• Journal of the Semiconductor & Display Technology
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• v.14 no.4
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• pp.67-71
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• 2015

Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.92-99
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• 2024

As semiconductor processes require several nanometers precision, the importance of motor control is increasing in semiconductor equipment. Due to unpredictable uncertainties such as friction and mechanical vibrations achieving precise position control in semiconductor processes is challenging. The internal model principle-based controller is a control technique that ensures robust steady-state performance by incorporating a model of the reference and disturbance. The disturbance observer-based controller is a prominent robust control technique implemented to cope with various nonlinearities and uncertainties. Provided that the two controllers can be designed to exhibit equivalent performance under certain conditions, this paper demonstrates through experiments that they yield identical results for the case of a BLDC position control problem. The experimental results also indicate that they can offer enhanced robustness compared with the conventional PID controller in the presence of a time-varying disturbance.

• Journal of the Semiconductor & Display Technology
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• v.23 no.1
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• pp.52-55
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• 2024

In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

• Journal of the Korea Society of Computer and Information
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• v.12 no.2 s.46
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• pp.151-159
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• 2007

It is very important to collect all production-related status values during the manufacturing process of semiconductor. The analysis results of the collected data can be used for the operation rate, fault diagnosis, process control and removal of predicted obstacles of equipments, eventually contributing to the improvement of production efficiency. For this propose. many IC makers have adopted EES(Equipment Engineering System). As the use of web has become a daily lift activity lately, it has been suggested to expand the scope of monitoring equipments using HTTP or SOAP protocols. To fulfill the web-based EES, EDA(Equipment Data Aquisition) should be facilitated first by integrating and standardizing various forms of messages generated from many different semiconductor equipments. In this paper, a method for integration between different types of information is suggested based on the analysis of various protocols used for the communication between semiconductor equipments. In addition, a software architecture to support the method is desisted.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.59-62
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• 2012

This test method covers a procedure for measuring particle removal characteristic of equipment fan filter unit(EFFU) installed inside of semiconductor process equipments, FPD manufacturing equipments and so on. Since EFFU is a combination of air filter and the assembly of fan, motor and frame, the integrity of these parts is very important for the performance of EFFU. So a conventional particle removal test method for air filters is not suitable for EFFU particle removal performance. This test method defines an evaluation method for EFFU which is installed inside an enclosed space to remove particles that are generated inside process equipment. The particle removal performance of EFFUs is usually depending on the performance of filter media and air flow rate. To understand a performance of an EFFU, the filter media characteristic, air flow rate and the integrity of EFFU parts should be considered simultaneously. This test method is intended to demonstrate the system performance of an EFFU and successfully evaluated EFFU performance characteristics.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.96-103
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• 2023

This paper presents a robust position tracking controller for a motor used in semiconductor equipment, utilizing the motor angle measurement. Precise position control is challenging due to the presence of uncertainties in various motor applications. The proposed controller consists of a PD (Proportional-Derivative) controller and a PIO (Proportional-Integral Observer) to estimate the system's state and equivalent disturbance compensating for the uncertainties. Since the stability alternates as the observer gain increases, we have investigated it through the closedloop root locus under the system parameters change. The analysis has showed that the inertia of the motor is the main parameter that affects it, and by adjusting the control gain appropriately, the system can be rendered to be stable even when the inertia of the motor changes. The effectiveness of the proposed control algorithm is validated through computer simulations, followed by a comparison of its performance with the results of a previous study.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.182-186
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• 2012

This paper aims to analyze the vibration characteristics of the test equipment that inspects any defects in manufactured semiconductor chips and classifies defective chips. This type of equipment should be robust against any vibrations because such vibrations can cause disruption in the process that requires higher precision. 3D model of the structure of the equipment has been used to configure vibration simulation model. Model analysis have been carried out to analyze which part of the equipment is weak against vibration. To minimize the vibration effect of the equipment, the thickness of the plate consist of the equipment and weights are modified. The results show that thicker plate and higher weight in the equipment can decrease vibration effect.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.17-22
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• 2006

In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.92-96
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• 2004

Scales, accumulated on semiconductor equipment parts during device fabrication processes, often lower equipment lifetime and production yields. Thus, many equipments parts have be cleaned regularly. In this study, an attempt to establish an effective process for the removal of scales on the sidewall of collimators in the chamber of sputter is made. The EDX analysis revealed that the scales are composed of Ti and TiN with the colummar structure. It was found that the heat-treatment at 700 for 1 min. after the oxide removal in the HF solution, and then etching in the HNO3 : H2SO4 : H2O =4:2:4 solution for 5.5 hrs at 67 was the most effective process for the scale removal.