• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.228-228
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• 2008

본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.116-120
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• 2012

In this paper, ZnO-Epoxy nanocomposites (NEP) were prepared and epoxy composites that contain 5 wt% micro ZnO (MEP) and deliberately not well dispersed nano ZnO (NDNEP) were also prepared for purpose of comparison. The effects of the particle size and dispersion of ZnO on dielectric properties of epoxy resin were chiefly studied. Test results showed that: at a loading of 5 wt%, the three epoxy composites seem to have no significant difference on resistivity compared to epoxy resin; Dielectric constants of all the epoxy composites are also basically the same but they are bigger compared to that of the pure epoxy resin (unfilled); Dielectric dissipation factors ($tan{\delta}$) of NDNEP is greater than that of NEP and MEP. NEP has the minimum dielectric loss factor, whereas dielectric loss factors of the three epoxy composites are larger than that of the pure epoxy resin. The decreasing order of electrical breakdown strength for the three epoxy composites and for the pure epoxy resin is as follows: NEP>MEP>NDNEP>EP. Finally, in order to explain the experimental results the aggregation interface phase was proposed. Furthermore, addition of well dispersed nano filler has proved to have a positive effect on the improvement of the dielectric properties of epoxy resin.

• 한국염색가공학회지
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• 제29권1호
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• pp.37-44
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• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• Transactions on Electrical and Electronic Materials
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• 제14권4호
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• pp.199-202
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• 2013

In order to study the effect of reactive diluents on the electrical insulation breakdown strength and mechanical properties of, a polyglycol and an aliphatic epoxy were individually introduced to an epoxy system. Reactive diluents were used in order to decrease the viscosity of the epoxy system; polyglycol acted as a flexibilizer and 1,4-butanediol diglycidyl ether (BDGE) acted as an aliphatic epoxy, which then acted as a chain extender after curing reaction. The ac electrical breakdown strength was estimated in sphere-to-sphere electrodes and the electrical breakdown strength was estimated by Weibull statistical analysis. The scale parameters of the electrical breakdown strengths for the epoxy resin, epoxy-polyglycol, and epoxy-BDGE were 45.0, 46.2, and 45.1 kV/mm, respectively. The flexural and tensile strengths for epoxy-BDGE were lower than those of the epoxy resin and those for epoxy-polyglycol were lower than those of the epoxy resin.

• 접착 및 계면
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• 제12권4호
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• pp.138-143
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• 2011

특수한 방향족 화합물인 biphenylene 성분이 도입된 novolac 유도체를 기본 골격으로 하는 에폭시 수지 경화물은 난연제의 도움 없이도 자기소화성을 발현하며, 최근에 친환경 EMC (Epoxy Molding Compound) 소재로 상용화되고 있다. 본 연구에서는 이들을 골격으로 하는 에폭시수지와 경화제로 이루어진 경화물을 제조하여 DSC, DMA, TMA, TGA로부터 phenol 유도체의 분자구조와 반응성, 열팽창성, 탄성율 및 열분해성 등을 검토하였다. 주제와 경화제의 골격구조로 biphenyl novolac 구조가 모두 함유할 때 저팽창성, 기계적 성능 및 연소지연성 등이 우수하게 나타났다.

• 한국염색가공학회지
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• 제22권2호
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• pp.155-162
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• 2010

Nylon 6 was blended with a brominated epoxy resin, tetrabromobisphenol A diglycidyl ether (DGEBBA), to enhance flame retardant property. Thermal properties of the blends were analyzed by DSC. Melting point and crystallization temperature decreased as the amount of epoxy resin increased. Melt index and relative viscosity decreased as the amount of the epoxy resin increased. When the blended amount of the epoxy resin was below 5%, the melt index decreased while the relative viscosity slightly increased. The blend resin was successfully spun into fiber without swelling or drawing the resonance phenomena. However, both the tenacity and elongation of the fiber decreased by increasing the amount of the DGEBBA.

• 공업화학
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• 제2권4호
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• pp.301-310
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• 1991

대표적인 열가소성 수지인 에폭시 수지는 그 용도 및 응용분야가 광범위하지만, 경화 후 수지의 brittleness와 고온 및 습윤하에서 물성이 좋지 않아 시용에 제한을 받고 있다. 본고에서는 수지의 최대결점인 brittleness 개선과 고온 습윤 특성의 향상 방법에 대해 고찰하였다. Brittleness 개선 방법으로는 rubber 및 열가소성 수지를 에폭시 수지에 도입하여, 이에 따른 toughness 향상 정도를 중점적으로 다루었으며, 고온 습윤 특성을 향상시키기 위해 에폭시 수지의 molecular design 및 열가소성 수지의 응용방법에 대해 기술하였다.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2000년도 추계학술대회논문집
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• pp.57-60
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.57-60
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2009년도 추계 학술논문 발표대회
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• pp.55-59
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• 2009

The epoxy resin without hardener can harden by a ring-opening reaction in the presence of the alkalies produced by the hydration of cement in epoxy-modified mortars and concretes. This paper investigates the effect of curing conditions on the strength improvement of polymer-modified mortars using bisphenol A-type epoxy resin without hardener. The polymer-modified mortars using epoxy resin are prepared with various polymer-cement ratios, and subjected to ideal, water, dry and heat cures. In the heat cure, the epoxy-modified mortars are sealed or unsealed with a PVDC (polyvinylidene chloride) film. The epoxy-modified mortars are tested for flexural and compressive strengths at desired curing methods. The microstructures of the epoxy-modified mortars are also observed by scanning electron microscope. The effects of curing conditions on the strength development of the epoxy-modified mortars are examined. From the test results, the marked effectiveness of the heat cure under the PVDC film sealing against the development of the strength of the epoxy-modified mortar without the hardener is recognized. The flexural and compressive strengths of 7-day-90℃ heat-cured, PVDC film-sealed epoxy-modified mortars without hardener reach 7 to 17MPa and 24 to 44MPa respectively, and are two to three times of Unmodified mortar. Such high strength development of the epoxy-modified mortars may be achieved by the dense microstructure formation by cement hydrates and the hardening of the epoxy resin in the mortars.