• Textile Coloration and Finishing
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• v.34 no.3
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• pp.157-164
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• 2022

This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.

• Magazine of the Korean Society of Agricultural Engineers
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• v.24 no.4
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• pp.92-98
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• 1982

The major objective of this study was to investigate the heat resistance of epoxy resin mortar. For this purpose, these tests of compressive and bending strength were accomp- olished with various heating temperature (40˚C, 60˚C, 80˚C, 100˚C, 120˚C), and with various mixing ratio (1: 2, 1: 4, 1: 6, 1: 8, 1:10, 1:12, 1:14). The exprimental resin was to be Epi-Bis type epoxy resin, which is widely used as construction materials. The results obtained are summarized as follows; 1. The variations of color tone started to begin at 60˚C, and it has come out very heavy at 120˚C. It was assumed that the decrement of weight resulted from carbonization were about 0.22% at 100˚C, and about 0.34% at 120˚C. 2. The compressive and bending strength were increased with temperature rise up to 80˚C, but these were made rapid decrease when the given temperature was over. And so, the mean decrement of compressive and bending strength at 120˚C reached up to 35.5% and 26.4%, respectively. 3. The regression equation between compressive and bending strength for epoxy resin mortar under heat exposure were obtained as follows; od=0. 371oc+39. 23 (r=0. 986) And the estimated value of bending strength was corresponded to about 37 percent in comparing with that of the compressive strength. 4. Consquently, the heat resistance temperature of epoxy resin mortar was to be around 80˚C, and it was generally very low values. But it was regarded that the epoxy resin mortar will not be difficult with materials of civil engineering works and agricultural structures.

• The Korean Journal of Rheology
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• v.11 no.2
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• pp.135-142
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• 1999

The effects of 1 wt.% N-benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator and blend compositions composed of 0, 5, 10, 20 and 40 wt.% of phenol-novolac resin to epoxy resin were investigated in terms of cure kinetics, thermal stabilities and rheological properties. Thermal latent properties of BPH were measured from the conversion as a function of reaction temperature on a dynamic DSC. This cationic BPH system turned out to be an effective thermal latent initiator in the epoxy-phenol curing system. And the increase of phenol-novolac resin concentration led to the decrease in the latent temperature and to the increase of cure activation energy ($E_a$) of the blend system. The thermal stability and activation energy ($E_t$) for decomposition, gel-time and activation energy ($E_c$) for cross-linking from rheometer increased within the composition range of 20~40 wt.% of phenol-novolac resin. This implies that the three-dimensional cross-linking may take place among hydroxyl group within phenol resin, epoxide ring within epoxy resin and BPH.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.334.1-334.1
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• 2016

다른 재료에 비해 에너지 변환 효율의 관점에서 높은 경쟁력을 가진 결정질 실리콘은 지난 수십 년 동안 그 특성이 태양전지 분야에 널리 이용되어 왔다. 하지만 결정질 실리콘 웨이퍼는 일반적으로 제조 단계에서 많은 양의 에너지를 소비하고 절단 단계에서 절단 손실(Kerf-loss)이 발생된다. Epoxy Resin을 이용한 Kerf-less Wafering은 초박형 실리콘 웨이퍼 제조 기술 중 하나로, 비교적 간단한 장비와 공정을 통하여 절단 손실 없이 $50{\mu}m$이하의 초박형 실리콘 웨이퍼를 얻을 수 있는 기술이다. 실리콘과 Epoxy Resin 간의 열팽창 계수 차이를 이용하여 초박형 실리콘을 박리 시키는 기술로, 실리콘 기판 위에 Epoxy Resin으로 stress inducing layer를 올려 공정을 진행한다. stress inducing layer를 경화시키는 열처리가 끝나고 급냉되는 과정에서 stress inducing layer에 의해 실리콘 기판에 큰 응력이 가해지게 되고 실리콘 기판에 crack이 발생된다. 공정이 계속 됨에 따라 발생된 crack은 실리콘 표면과 평행한 방향으로 전파 되고 초박형 실리콘 layer가 실리콘 기판에서 박리 된다. 본 실험에서 중요한 공정 변수로는 stress inducing layer의 구성성분 및 두께, 열처리 온도 및 시간, cooling rate 등이 있다. 이러한 공정 변수들을 조절 하여 Epoxy Resin을 이용하여 $100{\mu}m$ 이하의 박리된 wafer를 얻을 수 있었다. 박리된 wafer의 단면과 두께를 Scanning Electron Microscopy(SEM)을 통해 관찰 하였고, 이를 통해 초박형 실리콘 박리 공정에 대한 연구를 진행하였다.

• Journal of the Korean Applied Science and Technology
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• v.30 no.3
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• pp.472-479
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• 2013

The conductive polymer composites recently became increasingly to many fields of industry due to their electrical properties. To understand these properties of composites, electrical properties were measured and were studied relatively. Electrical conductivity measurements showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in composites made of a conductive filler and an insulating matrix. It has been showed both experimentally and theoretically that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. This paper was to study epoxy resin filled with copper. The experiment was made with vehicle such as epoxy resin replenished with copper powder and the study about their practical use was performed in order to apply to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 3.065~13.325 in using copper powder. The weight loss of conductive composites happened from $350^{\circ}C{\sim}470^{\circ}C$.

• Carbon letters
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• v.25
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• pp.43-49
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• 2018

This study suggests the novel thermoplastic toughening agent, which can be applied in the monomer forms without increasing the viscosity of the epoxy resin and polymerized during the resin curing. The diazide (p-BAB) and dialkyne (SPB) compounds are synthesized and mixed with the epoxy resin and the carbon fiber reinforced epoxy composites are prepared using vacuum infusion process (VIP). Then, flexural and drop weight tests are performed to evaluate the improvement in the toughness of the prepared composites to investigate the potential of the novel toughening agent. When 10 phr of p-BAB and SPB is added, the flexural properties are improved, maintaining the modulus as well as the toughness is improved. Even with a small amount of polytriazolesulfone polymerized, due to the filtering effect of the solid SPB by the layered carbon fabrics during the VIP, the toughening and strengthening effect were observed from the novel toughening agent, which could be added in monomer forms, p-BAB and SPB. This suggests that the novel toughening agent has a potential to be used for the composites prepared from viscosity sensitive process, such as resin transfer molding and VIP.

• Journal of Electrical Engineering and Technology
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• v.13 no.2
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• pp.892-901
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• 2018

Because of excellent electrical properties, epoxy resin is widely used in packaging and casting power equipment. Moisture and temperature in the environment are inclined to seriously affect the insulation tolerance of epoxy resin. This work focuses on the aging characteristics of epoxy resin in hygrothermal environment. Scanning electron microscopy images show that there are micro-crack, micro-slit and holes inside aged samples. The moisture absorption process undergoes three equilibrium stages and it does not follow the Fick's second law. Observing the change of hydrogen bonds in the infrared spectra of the dried samples, it is found that chemically moisture absorption immerges when the physical moisture absorption entered the third equilibrium stage. By Debye equation to fit the imaginary part of the dielectric constant, it is concluded that the uniformity of water molecule has a great influence on the electrical conductivity loss. Furthermore, the polarization loss can be more easily affected by water molecules than small free molecules. After the aged samples being dried, their real and imaginary part of the dielectric constant descend, but their original electrical properties cannot completely restored. After chemical moisture absorption appears inside the material, the residual space charges increase significantly and the charge dissipation rate slow down obviously.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.247-248
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• 2006

Bulk YBCO 초전도체는 top-seeded melt-growth 방법으로 제조되었다. YBCO bulk는 Epoxy resin과 $AgNO_3$를 보강해 초전도체의 기계적 강도를 향상하고자 하였다. Epoxy resin은 보강 재료인 STYCAST 2850-FT와 경화제인 CATALYST 24LV 를 100:5 비율로 혼합하여 제조한 후 mould에 넣고 $66^{\circ}C$에서 2시간 열처리 하였다 (rotary pump로 진공 분위기 조성). $AgNO_3$는 $350^{\circ}C$에서 2시간, $450^{\circ}C$에서 1시간 열처리 하여 Ag와 $NO_3$의 분리 후 YBCO bulk에 Ag가 보강되도록 하였다. Epoxy resin 과 분리된 Ag는 YBCO bluk의 crack과 void에 침투되는 것을 SEM과 광학현미경을 통해 관찰할 수 있었다. Three point bending test를 이용하여 보강 전후의 YBCO bulk의 기계적 강도를 측정하였다. 보강 후의 YBCO bluk의 기계적 강도는 보강 전에 비해 향상된 결과를 확인할 수 있었고, Epoxy resin과 $AgNO_3$를 보강한 YBCO는 기계적 강도 향상에 높은 신뢰성을 보이고 있다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.389-392
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• 1997

Glutaronitrile(GN) was introduced to diglycidyl ether of bisphenol A(DGEBA)/ 4,4'-methylene dianiline(MDA) system to improve toughness. Effects of GN contents on thermal decomposition of epoxy resin system were investigated. To study the characteristics of thermal decomposition, thermo-gravimetric analysis(TGA) and Kissinger equation were used. Thermal degradation temperatures were about 365$^{\circ}C$ regardless of GN contents. Activation energies of thermal decomposition in epoxy resin system were almost constant below 10 phr and decreased above 15 phr.

• Elastomers and Composites
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• v.35 no.2
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• pp.89-97
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• 2000

Waterborne epoxy resins have been developed in order to meet environmental regulations for reduction of the emission of organic solvents from coating industry As each generation has filled a performance gap in the previous technology, new waterborne epoxy resin has developed. Initially, waterborne epoxy resins were used primarily on masonry, but the subsequent generations have found utility for the protection of metallic substrates as well. Indeed, the third generation systems have been formulated to produce the high performance industrial maintenance primers which possess the desirable combination of good corrosion resistance and low volatile organic compound levels. This paper outlines the important guidelines for formulating waterborne epoxy primers from waterborne epoxy resin that has recently developed in our company. The importance of using the appropriate resin-curing agent system at the optimized epoxy to amine ratio is stressed.