• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.7
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• pp.1773-1782
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• 1994

In this paper, the expert cure system for carbon fiber epoxy composite materials, which controls the temperature and pressure of the autoclave according to the several rules, was developed to manufacture better composite products in shorter curing time. The rules were based on the on-line measured quantities such as the dielectric properties and temperature of the composites and the pressure of the autoclave. The curing time and the mechanical properties of the composite materials manufactured with the expert cure system were compared to those of the specimens manufactured with the conventional cure cycle.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1390-1393
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• 2003

Work factor approach is conveniently used in metal fracture mechanics to determine fracture toughness from a single fracture test. In this work, we investigated the applicability of the work factor approach in order to determine fracture toughness of thick graphite/epoxy composites in the hydrostatic pressure environment from a single fracture test. The effect of hydrostatic pressure on the elastic work factor was studied, The stacking sequence used was multi-directional, [0$^{\circ}$/${\pm}$45$^{\circ}$/90$^{\circ}$]. The hydrostatic pressures applied were 0.1 MPa, 100 MPa, 200 MPa, and 300 MPa. The results showed that the elastic work factor was not affected by the hydrostatic pressure, The elastic work factor decreased in a linear fashion with crack length.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.401-403
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• 1995

The degradation phenomena according to electrical stress in epoxy composites were studied. The formation of electrets were observed by appling high voltages, 22.9[kW/cm], during 5[hr] to five kinds of specimens for a given mixing rate, and then TSC(thermally stimulated current) values were measured at the temperature range of $-160\sim200[^{\circ}C]$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.7 s.178
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• pp.1703-1711
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• 2000

Microstructural morphology of molded composites of thermotropic liquid crystalline polymer(LCP) and polyamide 6 (PA6) has been studied as a function of epoxy fraction. Injection-moulding of a thin composite plaque at a temperature below the melting point of the LCP fibrils by suing the extruded LCP/PA6 pellets produced multi-layered structures: 1) the surface skin layer with thickness of 65-120 ym exhibiting a transverse orientation, 2) the sub-skin layer with an orientation perpendicular to the surface skin, i.e. in the flow direction, 3) the core layer with arc-curved flow patterns. Similar microstructural orientations were observed in the respective layers for the composite plaques with different fractions of epoxy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.260-263
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• 1996

The thermally stimulated currents(TSC) are measured to know the behaviour of charging particles of epoxy composites at the temperature range of -160∼200[$^{\circ}C$] and to prove the variation according to curing time in this study. It is confirmed that the peak amplitude is inversely proportional to the curing time, and TSC are reduced is and T$\sub$m/ is moved to high temperature side according to the curing time because carboxyl radical is formed by thermal oxidation and motility becomes lack.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.260-264
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• 1996

In this study, the dieiectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability . As a result. first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature, and the breakdown strength of specimens because it is believed that the adding filler farms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since the suggests that silane coupling agent improves interfacial combination and relays electric field concentration. Finally, from the analysis 7f weibull distribution. it was confirmed that as the allowed breakdown probability was given by 0.11[%].

• Proceedings of the KIEE Conference
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• 1999.07e
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• pp.2349-2351
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• 1999

In this paper, the variable absorption rates and DC dielectric breakdown strength of epoxy composites were measured at boiling absorption condition in order to observe the influences of moisture in out door use. Also, in order to improve withstand voltage properties at moisture absorbtion condition. IPN (interpenetrating polymer network) method which had been already reported, was introduced and the influence was investigated. As a result, it was confirmed that the moisture absorption rate was increased and DC dielectric breakdown strength was degraded with boiling time and filler content increasing. On the other hand, it was confirmed that moisture absorption rate and DC dielectric breakdown strength degrading rate were lowered by the improvement of adhesion strength In IPN specimens.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.159-163
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• 2003

In this study, the DC dielectric breakdown of epoxy composites used for PCB material was experimented and then its data were simulated by Weibull distribution equation. The more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical, and the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. From the analysis of Weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5[kV/mm].

• Macromolecular Research
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• v.10 no.1
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• pp.24-33
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• 2002

Interfacial and microfailure properties of carbon fiber/epoxy composites were evaluated using both tensile fragmentation and compressive Broutman tests. A monomeric and two polymeric coupling agents were applied via the electrodeposition (ED) and the dipping applications. A monomeric and a polymeric coupling agent showed significant and comparable improvements in interfacial shear strength (IFSS) compared to the untreated case under both tensile and compressive tests. Typical microfailure modes including cone-shaped fiber break, matrix cracking, and partial interlayer failure were observed under tension, whereas the diagonal slipped failure at both ends of the fractured fiber appeared under compression. Adsorption and shear displacement mechanisms at the interface were described in terms of electrical attraction and primary and secondary bonding forces.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.529-531
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• 1999

In this Paper, the variable dielectric breakdown strengths of epoxy composites were investigated at belling absorption condition in order to observe the influences of moisture in out door use. Also. in order to improve withstand voltage properties at moisture absorbtion condition, IPN(interpenetrating polymer network) method was Introduced and the Influence was investigated. As Adding filler(SiO$_2$) classified by o(phr), 50(phr) and 100[phr] to two kinds of matrix resin, six kinds of specimens were manufactured. As a result, it was confirmed that dielectric breakdown strength wer degraded with boiling time and filer content increasing. But, it was confirmed that dielectric breakdown strength degrading rate were lowered by the Improvement of adhesion strength in IPN specimens.