• Journal of Adhesion and Interface
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• v.6 no.2
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• pp.13-20
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• 2005

Interfacial shear strength (IFSS) of environmentally friendly natural fiber reinforced polymer composites plays a very important role in controlling the overall mechanical performance. The IFSS of various Ramie and Kenaf fibers/epoxy composites was evaluated using the combination of micromechanical test and nondestructive acoustic emission (AE) to find out optimal conditions for desirable final performance. Dynamic contact angle was measured for Ramie and Kenaf fibers and correlated the wettability properties with interfacial adhesion. Mechanical properties of Ramie and Kenaf fibers were investigated using single-fiber tensile test and analyzed statistically by both uni-and bimodal Weibull distributions. An influence of clamping effect on a real elongation for both Ramie and Kenaf fibers were evaluated as well. Two different microfailure modes, axial debonding and fibril fracture coming from fiber bundles and single fiber composites (SFC) were observed under tension and compression.

• Composites Research
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• v.17 no.6
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• pp.28-36
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• 2004

Micro-tow deformation during forming of PVC foam-fabric composite sandwich structure is investigated to find out the correlation between forming condition and material deformation. The foams used in this research are PVC foams which have 4 different densities and the fabric composite is Carbon/epoxy prepreg which is plain weave (3k) as a skin material. Tow parameters such as crimp angle and tow amplitude are measured using microscope and a proper image tool and are compared with each other. In order to find out the effect of foam deformation during forming on tow deformation the compressive tests of foams are performed in three different environmental temperatures ($25^{\circ}C$, $80{\circ}C$, $125^{\circ}C$). The microscopic observation results show that the micro tow deformations are quite different from each other with respect to the foam density and forming pressure.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.1
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• pp.46-53
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• 2008

Ultrasonic C-scan technique is one of very popular techniques being used for detection of flaws in polymer matrix composite(PMC). However, the application of this technique is very limited for evaluation of defects in PMC fabricated by the automated fiber placement process. The purpose of this study is to develop a novel ultrasonic hybrid system based on nondestructive and non-contact ultrasonic techniques for evaluation of delamination in carbon/epoxy and carbon/PPS composite laminates. It was shown that the newly developed ultrasonic hybrid system based on dual air-coupled pitch-catch technique with ultrasonic scattering reflection concept could provide excellent image with higher resolution of delamination in PMC compared with the conventional pitch-catch method. It is expected that this ultrasonic hybrid technique can be applied for on-line inspection of flaws in PMC during the fabrication process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Composites Research
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• v.26 no.1
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• pp.72-78
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• 2013

This study explores the resistive heating characteristics of discontinuous carbon fiber (CF)-epoxy composites. Test samples including 1, 3, and 5 wt.% CF were fabricated using sonication and cast molding processes. For heating performance characterization, DC currents were applied to the composite samples, and surface temperatures were evaluated visually and quantitatively using an infrared camera. To estimate the thermal performance of composites and verify the experimental results, finite element analyses were performed. The resistive heating mechanism was investigated in connection with CF loading and applied voltages. Resistive heating efficiency increased proportionately with CF concentration and applied voltage. To obtain homogeneous temperature distribution of the samples, high degree of CF dispersion is required.

• Journal of Conservation Science
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• v.26 no.2
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• pp.183-190
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• 2010

We fabricated urethane material based on properties of reversible and unfading for antic-ceramics restoration. This material with low viscosity was made hardness control possible that user want. And it have very strong adhesion and shear strength properties and is shown the best properties for pigment filling, anti-contractibility, coloring as like epoxy system materials. Particularly, the yellowing and ir-reversibility problem in epoxy restoration material were finally solved. So, there is guarantee in the eternity and stabilization of restoration for antic-celamics. And in order to show the reversible state of the restoration, we successfully dissolve this urethane materials in solvent after perfect restoring subsequently.

• Advances in aircraft and spacecraft science
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• v.3 no.2
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• pp.171-195
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• 2016

The present paper is a review of the main activities carried out within the context of the COMPTINN' program, a joint research project founded by a FUI program (Fonds $Unifi{\acute{e}}s$ $Interminist{\acute{e}}riels$) in which four research teams focused on the thermo-oxidation behaviour of HTS-TACTIX carbon-epoxy composite at 'high' temperatures ($120^{\circ}C-180^{\circ}C$). The scientific aim of the COMPTINN' program was to better identify, with a multi-scale approach, the link between the physico-chemical mechanisms involved in thermo-oxidation phenomena, and to provide theoretical and numerical tools for predicting the mechanical behaviour of aged composite materials including damage onset and development.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.197-204
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• 1993

Abstract The effects of the hole size and the specimen width on the fracture behavior of several fabric composite plates are experimentally investigated in tension. Tests are performed on plain woven glass/ epoxy, plain woven carbon/epoxy and satin woven glass/polyester specimens with a circular hole. It is shown in this paper that the characteristic length according to the point stress criterion depends on the hole size and the specimen width. An excellent agreement is found between the experimental results and the analytical predictions of the modified failure criterion. The notched strength increase with an increase in the damage ratio, which is explained by a stress relaxation due to the formation of damage zone. When the unstable fracture occurred, the critical crack length equivalent for the damage zone is about twice the characteristic length. The critical energy release rate $G_c$ is independent of hole size for the same specimen width. The variation of $G_c$ according to the material system, fiber volume fraction and specimen width relates to the notch sensitivity factor. $G_c$ increases with a decrease in the notch sensitivity factor, which can be explained by a stress relaxation due to the increase of damage zone.