• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.11a
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• pp.79-80
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• 2018

Recently, the interest in remodeling of new and old buildings is increasing worldwide. As a result, the frequency of use of architectural adhesives has increased. Currently, adhesives used in buildings are made of organic materials in most cases, and epoxy resin adhesives are most widely used. However, epoxy resin adhesives contain formaldehyde and VOCs in the room during construction, which can cause sick house syndrome. In case of building fire, it may cause damage due to carbon monoxide generated from organic materials. It is urgent to study the problem of epoxy fill adhesive made of such organic materials. Therefore, the purpose of this study is to investigate the effect of the adhesion of epoxy resin adhesive, which is a problem of epoxy resin adhesive, which is an existing organic adhesive by using inorganic materials such as magnesia and phosphate, And the inorganic adhesive which does not emit the release amount as an inorganic material.

• Composites Research
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• v.24 no.3
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• pp.39-45
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• 2011

Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane (PU) and Epoxy adhesives are now being used for liquefied natural gas (LNG) carriers at cryogenic temperatures. This paper presents a comprehensive evaluation of epoxy and PU adhesive bonds between Triplex sheets at normal and cryogenic temperatures. The most significant result of this study is that for all adhesives tested, there is a significant decrease in peel strength at cryogenic temperatures. However, the reasons for the decrease in peel strength for epoxy and PU adhesives differ. Consequently, PU adhesives can be considered better suited for use in applications requiring high bonding performance at cryogenic conditions, such as in LNG carriers.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1479-1487
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• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

• Journal of Conservation Science
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• v.36 no.6
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• pp.475-482
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• 2020

In this study, we synthesized rosin-based epoxy resin and manufactured two components adhesives and epoxy putty using this epoxy resin. This study manufactured main element of adhesives for enabling it to form epoxide group by letting epichlorohydrin react to maleic anhydride modified rosin, and used room temperature curing type triethylenetetramine for hardener. The ratio between main element and hardener of of manufactured adhesives was 100 : 20, and main element and hardener of filling material were manufactured as clay type by mixing them with filler. Manufactured undiluted adhesives and filling material showed very stable result in the adhesive strength (3.06 MPa) and ultraviolet irradiation, showing outstanding result comparing to existing restoration adhesives. And it is considered a material having reversibility as it was dissolved in organic solvents such as acetone and toluene after being hardened, which showed a result that solved part of possible problems caused by restoration. As a result of use and application of manufactured adhesives and filling material for actual wood crafts, they showed excellent results in workability, stability, removability etc., and this study confirmed that the material can be used for and applied to various fields.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.485-486
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• 2012

• Journal of the Korea Institute of Building Construction
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• v.19 no.4
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• pp.289-297
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• 2019

Epoxy resin adhesives are currently used as adhesives in buildings. Epoxy resin adhesives, which are organic materials, generate harmful substances when producing adhesives, and toxic substances are high in the residential space after installation. In addition, a large amount of carbon monoxide generated from organic materials in the case of a building fire leads to personal injury. This study evaluates the feasibility of inorganic adhesives using pure inorganic materials such as magnesia, phosphate, and borax as inorganic adhesives to replace existing organic adhesives. As a result of the experiment on the selection of adequate phosphate and the characteristics of the addition rate of borax used as a retarder, the potassium phosphate monobasic was obtained as a suitable phosphate and the characteristics according to the borax addition rate were compared with the quality standard of KS F 4923 The hardening shrinkage and heat change rate satisfied the quality standards. The tensile strength was satisfactory when the borax addition rate was 4% or more, but the adhesive strength did not meet the quality standards. Further studies are needed to improve adhesion strength.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.11a
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• pp.62-63
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• 2019

Currently, polymer-based tile cement (Thin-bed method) and epoxy adhesive (Thick-bed method) are mainly used as tile adhesive for polishing and porcelain. In the case of epoxy adhesive, there is a low economic efficiency, there is a problem that the work efficiency is reduced by mixing the resin and the hardener. In particular, the epoxy contains a bisphenol A and amine component, there is a risk of workable disease when a worker is exposed to odor and harmful gases generated in the epoxy adhesive for a long time. Against this background, it is necessary to analyze the hazards of using epoxy adhesives indoors, and develop cementitious high performance tile adhesive products with significantly lower hazards than epoxy adhesives.

• Journal of Conservation Science
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• v.26 no.1
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• pp.85-94
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• 2010

Color stable hydrogenated bisphenol-A (HBA) epoxy adhesives containing organic-inorganic hybrid nanocomposites were prepared and investigated the properties. Isophorone-diamine (IPDA) was used as a hardener and polyhedral organomeric silsesquioxanes (POSS; EP0408 and EP0409) having epoxy function groups were used to tailor adhesives in the nanoscale range. The dependence of the concentration of different nano materials were studied since the large surface area of the nanosized particles can cause significant changes in properties of adhesives. HBA-IPDA adhesives containing different amount of nanomaterials have been applied to the fresh Namsan granite and compared with those of commercial adhesives, which have problems of color change as well as a high viscosity. The mechanical properties of HBA-IPDA containing POSSs are consistent with those of commercial adhesives in addition to the low viscosity.

• Journal of the Korea Furniture Society
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• v.11 no.1
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• pp.25-29
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• 2000

This study was carried out to analyze the ultrasonic properties of sound board which was glued with various adhesives and to evaluate which adhesive is the best for the acoustic radiation of the musical instrument. The results are as follows: 1. Animal glue is the best adhesive for the sound board with respect to the acoustic radiation ratio of the musical instruments. Epoxy resin and polyvinyl acetate resin are the next group, urea formaldehyde resin and Hot melt are the third group, polychloroprene(CR) resin is the lowest. 2. Epoxy resin, animal glue and Titebond(PVA) give the highest shear strength and the highest wood failure relatively Hot melt and polychloroprene(CR) resin do not meet the standard because of low wood failure.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2022.04a
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• pp.180-181
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• 2022

The higher the addition rate, the less difference in kneading was found. This is because most of the cases are mixed with vinyl gloves by hand when immediately mixed in the field, so there is no problem of mixing dough according to the amount of addition. The mean increase temperature for 20 minutes was 31.6℃ for Plain, 38.1℃ for Al, 33.7℃ for Cu, and 5~7℃ for Al 20% added sample, 38.1℃ for Al 20% added sample, but 36.6℃ for Al 5% added sample. This suggests that it is possible to improve its own heat transferability by adding metal powder to epoxy adhesives.