• 사물인터넷융복합논문지
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• 제2권3호
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• pp.43-51
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• 2016

본 논문에서는 IoT 시스템 또는 개인별 문서 파일 관리 과정의 보안성을 향상시키기 위해 개선된 파일 암복호화 시스템인 Crypft+를 개발했다. Crypft+ 시스템은 Python을 이용하여 핵심 보안 모듈을 개발하였으며, PyQt를 사용하여 사용자 인터페이스를 설계 및 구현하였다. 또한 가장 보안성이 뛰어난 AES 기반 대칭키 암호 알고리즘과 SHA-512 기반 해쉬 알고리즘을 이용하여 컴퓨터 시스템 내부에 저장된 중요 파일에 대한 암호화 및 복호화 과정을 수행할 수 있도록 구현하였다. 또한 Cx-Freezes 모듈을 사용하여 구축된 프로그램을 exe 기반 실행 파일로 변환하는 기능을 구현하였으며, 프로그램 사용에 있어 이해를 돕는 설명서를 프로그램 내부에 포함시켜 직접 다운로드 받을 수 있도록 구현하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.