• 제목/요약/키워드: Engineering graphics workstation

검색결과 13건 처리시간 0.019초

AMG-CG method for numerical analysis of high-rise structures on heterogeneous platforms with GPUs

  • Li, Zuohua;Shan, Qingfei;Ning, Jiafei;Li, Yu;Guo, Kaisheng;Teng, Jun
    • Computers and Concrete
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    • 제29권2호
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    • pp.93-105
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    • 2022
  • The degrees of freedom (DOFs) of high-rise structures increase rapidly due to the need for refined analysis, which poses a challenge toward a computationally efficient method for numerical analysis of high-rise structures using the finite element method (FEM). This paper presented an efficient iterative method, an algebraic multigrid (AMG) with a Jacobi overrelaxation smoother preconditioned conjugate gradient method (AMG-CG) used for solving large-scale structural system equations running on heterogeneous platforms with parallel accelerator graphics processing units (GPUs) enabled. Furthermore, an AMG-CG FEM application framework was established for the numerical analysis of high-rise structures. In the proposed method, the coarsening method, the optimal relaxation coefficient of the JOR smoother, the smoothing times, and the solution method for the coarsest grid of an AMG preconditioner were investigated via several numerical benchmarks of high-rise structures. The accuracy and the efficiency of the proposed FEM application framework were compared using the mature software Abaqus, and there were speedups of up to 18.4x when using an NVIDIA K40C GPU hosted in a workstation. The results demonstrated that the proposed method could improve the computational efficiency of solving structural system equations, and the AMG-CG FEM application framework was inherently suitable for numerical analysis of high-rise structures.

반도체 리드 프레임 제조를 위한 프로그레시브 금형의 CAD/CAM 시스템 개발 (Development of Progressive Die CAD/CAM System for Manufacturing Lead Frame, Semiconductor)

  • 최재찬;김병민;김철;김재훈;김창봉
    • 한국정밀공학회지
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    • 제16권12호
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    • pp.230-238
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    • 1999
  • This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

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대규모 영상처리를 위한 외장 메모리 확장장치의 구현 (Implementation of External Memory Expansion Device for Large Image Processing)

  • 최용석;이혜진
    • 방송공학회논문지
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    • 제23권5호
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    • pp.606-613
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    • 2018
  • 본 연구는 대규모 영상처리를 위한 메모리 확장을 위한 외장 메모리 확장장치 구현에 관련된 내용으로, 이는 영상처리를 위한 그래픽 워크스테이션에 장착되는 PCI(Peripheral Component Interconnect) Express Gen3 x8 인터페이스를 가지는 외장 메모리 어댑터 카드와 외장 DDR(Dual Data Rate) 메모리로 구성된 외장 메모리 보드로 구성되며, 메모리 어댑터 카드와 외장 메모리 보드간의 연결은 광 인터페이스를 통하여 이루어진다. 외장 메모리 억세스를 위해서는 Programmable I/O 방식과 DMA(Direct Memory Access) 방식을 모두 사용할 수 있도록 하여 영상 데이터의 효율적 송수신이 이루어지도록 하였다. 본 연구 결과의 구현은 Altera Stratix V FPGA(Field Programmable Gate Array)와 40G 광 트랜시버가 장착된 보드를 사용하였으며, 1.6GB/s의 대역폭 성능을 보여주고 있다. 이는 4K UHD(Ultra High Definition) 영상 한 채널을 담당할 수 있는 규모이다. 향후 본 연구를 계속 진행하여 3GB/s 이상 대역폭을 보이는 연구결과를 보일 예정이다.