• Journal of Magnetics
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• v.10 no.4
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• pp.137-141
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• 2005

We confirmed that the improvement in properties of magnetic tunnel junctions prepared by radical oxidation after thermal treatment was mostly resulted from the redistribution of oxygen at the $AIOx/Co_{90}Fe_{10}$ interface. The as-deposited Al oxide barrier was oxygen-deficient but most of it re-oxidized into $Al_2O_3$, the thermodynamically stable stoichiometric phase, through thermal treatment. As a result, the effective barrier height was increased from 1.52 eV to 2.27 eV. On the other hand, the effective barrier width was decreased from 8.2 ${\AA}$ to 7.5 ${\AA}$. X-ray absorption spectra of Fe and Co clearly showed that the oxygen in the CoFe layer diffused back into the Al barrier and thereby enriched the barrier to close to a stoichiometirc $Al_2O_3$ phase. The oxygen bonded with Co and Fe diffused back by 6.8 ${\AA}$ and 4.5 ${\AA}$ after thermal treatment, respectively. Our results confirm that controlling the chemical structures of the interface is important to improve the properties of magnetic tunnel junctions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.239-240
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• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.8
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• pp.802-808
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• 2013

Thermal barrier coating (TBC) is used to protect substrates and extend the operating life of gas turbines in power plant and aeronautical applications. The major causes of failure of such coatings is spallation, which results from thermal stress due to a thermal expansion coefficient mismatch between the top coating and the bond coating layers. In this paper, the effects of the material properties and the thickness of the top coating layer on thermal stresses were evaluated using the finite element method and the equation for the thermal expansion coefficient mismatch stress. In addition, we investigated a design technique for the top coating whereby thermal resistance is exploited.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.710-713
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• 2005

In this study, waffle type barrier ribs for counter electrode discharge cells were prepared via micro-molding process. The master mold was prepared by UV lithography and working mold was manufactured by replicating the master mold. The UV paste used in this study consisted of ceramic powders for the barrier ribs, binder, hardener, and dispersant was filled into cavities of a polymeric mold by action of capillary pressure developed between mold and paste. The results demonstrated a possibility of one-step process for the manufacturing of waffle type barrier ribs embedded with sustaining electrodes.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1367-1370
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• 2009

We have developed a 2D-3D convertible 7" autostereoscopic mini-monitor with high 3D quality, in which the parallax barrier LCD is attached on the TFTLCD. The excellent optical performance was achieved by design of the ghost free barrier and precise assembly between the barrier layer and the TFT-LCD panel. Our design principle and fabrication technology suppressed 3D cross-talk and improved viewing angle. In this paper, the design and fabrication process of the 3D mini-monitor are described. The evaluation for the 3D performance is also discussed.

• Journal of Information Display
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• v.2 no.4
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• pp.46-51
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• 2001

Using ray-optics code incorporated with three-dimensional PDP cell simulation, we have analysed the energy flow in the PDP cell from the electric power input to the visible light output. Also, the visible light output profile and viewing angle distribution were obtained. We applied our code to the analysis of the barrier rib height effect on the visible light luminance and efficiency of the sustaining discharge. Although cells with higher barrier rib generate more VUV photons, less ratio of visible photons are emitted toward front panel due to the shadow effect. Thus, there exists optimal barrier rib height giving the highest visible luminance and efficiency. This kind of code can be a powerful tool in designing cell geometry.

• Applied Chemistry for Engineering
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• v.10 no.8
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• pp.1114-1118
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• 1999

Barrier rib for the plasma display panel(PDP) was made by photolithographic process utilizing photosensitive barrier rib paste. The barrier rib paste was prepared by first dissolving ethylcellulose(binder polymer) in butyl carbitol(BC)/butyl carbitol acetate(BCA) =30/70 wt % mixture solvent at 15 wt % concentration. To this solution a mixture of functional monomers consisted of tripropyleneglycol diacrylate/ pentaerythritol triacrylate = 50/50 wt %, Irgacur 651 photoinitiator, and barrier rib powder were added and then the whole mixture was mixed in the three roll mill for 2 hr. The effect of component and concentration of photosensitive barrier paste on the photolithographic process was studied. After optimization of the paste formulation and photolithographic process, barrier rib could be obtained with good resolution up to $100{\mu}m$ height.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1225-1228
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• 2005

Barrier ribs in the plasma display panel(PDP) function to maintain the discharge space between the glass plates as well as to prevent optical crosstalk. Patterning of barrier ribs is one of unique processes for making PDP. In this work photosensitive barrier rib pastes were prepared by incorporating binder polymer, solvent, functional monomers photoinitiator, and barrier rib powder of which surface was treated with fumed silica particles. Study on the function of materials for the barrier rib paste were undertaken. After optimization of paste formulation and photolithographic process, it was found that photolithographic patterning of barrier ribs with photosensitive barrier rib green sheet could be used in the fabrication of high resolution PDP.

• Journal of Ocean Engineering and Technology
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• v.20 no.6 s.73
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• pp.54-60
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• 2006

This study discusses characteristic of spatiotemporal changes of the sand barrier in the Nakdong estuarine for the last century, focusing on geomarphologic evolution and mobility of sand barriers in the view of coastal engineering. The Nakdong estuarine, the research subject, has a complexly changing natural environment by interaction between ground and marine elements such as ocean wave, tidal current, sediment, etc. Moreover, recently, unnatural geomorphologic changes (e.g., seaside reclamation, new harbor construction, etc.) has been radically increased in this area with increasing desire for coastal development. Because of this, its sand barrier has developed quite unstable condition. Therefore, to identify the development process of geomorphologic changes in this area, required is a close examination on historical characteristics of spatiotemporal changes of the sand barrier in relation to surrounding seaside reclamation and physical environmental changes. This study, based on the marine charts published in between 1927 and 1995 year, analyzes the length and area of the sand barrier for the last hundred years, and investigates the cause of the changes by looking into the change of water depth for the last two years and doing ocean-physical site observations. In conclusion, the sand barrier of the Nakdong estuarine expands toward the open sea by $7.4{\sim}26m$ in annual average, maintaining a fixed distance of $1,241{\sim}1.279m$, and its area is expected to increase about $2.8km^2$ annually. This is characterized by the wocean wave from the open sea and the discharge of Nakdong River.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.8
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• pp.721-725
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• 2016

This paper reviews the analysis of a given scenario according to the Hybrid Model, and why accident causation models are necessary in casualty investigations. The given scenario has been analyzed according to the Hybrid Model using its main five components, fallible decisions, line management, psychological precursors to unsafe acts, unsafe acts, and inadequate defenses. In addition, the differences between the SHEL and the Hybrid Model, and the importance of a safety barrier during an accident investigation, are shown in this paper. One unit of SHEL can be linked with another unit of SHEL. However, it cannot be used for the analysis of an accident. Therefore, we must use an accident causation model, which can be a Hybrid Model. This can explain the "How" and "Why" of accident, so it is a suitable model for analyzing them. During an accident investigation, the reason we focus on a safety barrier is to create another safety barrier or to change an existing safety barrier if that barrier fails. Hence, the paper shows how a sea accident can be investigated, and we propose a preventive way of avoiding the accident through combining the methods of different models for the future.