• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.157-161
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• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

• Journal of information and communication convergence engineering
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• v.4 no.2
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• pp.88-91
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• 2006

In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the S11-parameter of the inductor.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.255-258
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• 2006

In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the $S_{11}-parameter$ of the inductor.

• Proceedings of the Korean Magnestics Society Conference
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• 2004.12a
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• pp.173-174
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• 2004

• Journal of the Optical Society of Korea
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• v.12 no.1
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• pp.49-51
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• 2008

The wide-band spiral inductor to be monolithically integrated on the AlN substrate as a choking inductor for a compact 10 Gb/s optical transmitter applications is investigated. In order to reduce the parasitic capacitance limiting the choking bandwidth, the AlN substrate is partially etched away, which is analyzed by using an equivalent circuit model. The measured $S_{21}$ transmission response of the fabricated inductor is suppressed as low as -10 dB in the frequency range of 5 to 16 GHz.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.178-182
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• 2003

This paper presents the embedded inductors in PCB (Printed Circuit Board) for PAM(Power Amplifier Module) of mobile terminations. The inductors are designed, simulated, and compared to conventional chip inductors. The Quality factor(Q) and self-resonance frequency(SRF) of the inductors are evaluated. The quality factors of the inductors are two times higher than those of the chip inductors, and the self-resonance frequency is 1.3 times higher than those of chip inductors at the inductance of 2.7 nH and 3.3 nH respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.678-681
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• 2002

In this paper, Characterization for several 3-D embedded passive elements with different structures was performed. The equivalent circuit optimization for embedded inductor was performed by HSPICE simulation software. After extracting each parameter values, the difference of parameter from each structure was examined. From this work, effective characterization of passive devices with similar structure will be possible.