• Proceedings of the Materials Research Society of Korea Conference
• /
• 2008.11a
• /
• pp.39.2-39.2
• /
• 2008

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1996.05a
• /
• pp.97-97
• /
• 1996

• Proceedings of the Korean Nuclear Society Conference
• /
• 2003.10a
• /
• pp.368.1-368.1
• /
• 2003

• Corrosion Science and Technology
• /
• v.21 no.6
• /
• pp.525-525
• /
• 2022

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.3
• /
• pp.882-890
• /
• 1996

Mechanical properties, including Young's modulus, residual stress and rupture strength, of a thermally evaporated gold film have been measured form a blister test. In a theoretical study, the priniple of minimum potential energy and that of virtual work have been applied to the pressurized circular membrane problem, and load-deflection relations have been derived for typical membrane deflection mode of spheroidal shape. In an experimental study, circular gold membranes of 4800 A-thickness and 3.5mm diameter were fabricated by the silicon electropolishing technique. Mecahnical properties of the thin gold films were deduced from the load-deflection curves obtained by the blister test, Young's moduli, obtianed from blister test, have been in the range of 45-70 GPa, while those of bulk gold have been in the range of 78-80 GPa. Residual stresses in the evaporated gold films have been measured as 28-110MPa in tension, The rupture strength of the gold film has turned out to be almost equal to that of dental gold alloy (310-380MPa). It has been demonstrated that the present specimen fabrication method and blister test apparatus have been effective for simultaneous measurement of Young's modulus, residual stress and repture strength of thin solid films. Especially, the electropolishing technique employed here has provided a simple and practical way to fabricate thin membranes in a circular or an arbitrary shape, which could not be obtained by the conventional anisotropic silicon mecromachining technique.

• The korean journal of orthodontics
• /
• v.22 no.4 s.39
• /
• pp.823-836
• /
• 1992

Guiding a tooth along an arch wire results in a counteracting frictional force among arch wires, bracket and ligature. This frictional forces should be eliminated or minimized when orthodontic teeth movement is being planned. The purpose of this study was to evaluate the changes of width, cross-sectional forms and surface morphologies of stainless steel wire and $Elgiloy^{\circledR}$ wire after electropolising. Experimental variables included in this experiment were arch wire materials, current, electrolyte temperature and polishing time. Wire widths were measured by micrometer and cross-sectional forms and surface morphologies were examined with optical microscope and scanning electron microcope. The results were as follows: 1. The mean and standard deviation of widths of stainless steel wire and $Elgiloy^{\circledR}$ wire varying polishing time with condition of $249A/dm^2$ and $20^{\circ}C,\;249A/dm^2$ and, $332A/dm^2$ and $20^{\circ}C$ and $332A/dm^2$ and $250^{\circ}C$ were obtained. 2. With increasing polishing time, the widths of stainless steel wire and $Elgiloy^{\circledR}$ wire became decreased proportionally 3. The changes of widths of stainless steel wire and $Elgiloy^{\circledR}$ wire were statistically insignificant between $20^{\circ}C$ group and $25^{\circ}C$ group, but significant between $249A/dm^2$ group and $332A/dm^2$ group. 4 The cross-sectional forms of wire after electropolishing were not changed in stainless steel wire, and while it were changed to rounded corners in $Elgiloy^{\circledR}$ wire. 5. The surface morphologies of wire after electropolishing were scratch-absent and more smoothened both in stainless steel wire and $Elgiloy^{\circledR}$ wire.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.25 no.3
• /
• pp.98-104
• /
• 2015

Titanium barrier membranes are prepared to investigate the effect of surface-treatments, such as machining, electropolishing, anodizing, and electropolishing + TiN coating, on the biocompatibility and physical properties of the membranes. The surface roughness (Ra) of the membrane decreases from machining ($0.37{\pm}0.09{\mu}m$), TiN coating ($0.22{\pm}0.09{\mu}m$), electropolishing ($0.20{\pm}0.03{\mu}m$), to anodizing ($0.15{\pm}0.03{\mu}m$). The highest ductility (24.50 %) is observed for the electropolished Ti membrane. No evidence of causing cell lysis or toxicity is found for the membranes regardless of the surface-treatments. Cell adhesion results of L-929 and MG-63 show that the machined Ti membrane exhibits the highest cell adhesion while the electropolished membrane is the best membrane for the L-929 cell proliferation after 7 days. However, no appreciable difference in MG-63 cell proliferation among variously surface-treated membranes is detected, suggesting that the electropolished Ti membrane is likely to be the best membrane due to the synergic combination of tailored flexibility and excellent fibroblast proliferation.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.3
• /
• pp.45-54
• /
• 2000

The effect of electropolishing far stamped leadframe on the removal of the edge burr and residual stress relief was examined. The present study showed that the electropolishing could be used for enhanced surface quality of stamped leadframes. The electropolishing was performed at the condition of 60% phosphoric acid electrolyte, 5 ampere of current and 3 cm electrode gap at $70^{\circ}C$ for 2 minutes for Alloy42 type leadframe, and $50^{\circ}C$ for 1.5 minutes for C-194 type leadframe. The FWHM values from X-ray diffraction showed that residual stress of electropolished leadframe recovered to the level of as-received raw materials and surface roughness measured by using AFM tuned out to be improved by 0.079 $\mu\textrm{m}$ and 0.014 $\mu\textrm{m}$ ($R_{rms}$) far alloy 42 and C-194 type leadframes, respectively. The plated thickness using XRF showed the improved uniformity in thickness variation by 0.4~0.5 $\mu\textrm{m}$ and grain growth, which is favorable for interface adhesion, was also observed from the bake test samples. We could certify dimensional stability of leadframe with inspection by means of 3D-topography and hardness measurements.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.11a
• /
• pp.139-140
• /
• 2010

• 한국초전도학회:학술대회논문집
• /
• v.16
• /
• pp.65-65
• /
• 2006