• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.2 no.1
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• pp.37-49
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• 2008

At the present time the task of designing a highly integrated ZigBee radio frequency (RF) receiver with an excellent coexistence performance is still very demanding and challenging. This paper presents a number of system issues and design considerations for a ZigBee RF receiver, namely IEEE 802.15.4, for coexistence with wireless devices in the 2.4-GHz ISM-band. With regard to IEEE 802.15.4, the paper analyzes receiver performance requirements for; system noise figure (NF), system third-order intercept point (system-IIP3), local oscillator phase noise and selectivity. Based on some assumptions, the paper illustrates the relationship between minimum detectable signal (MDS) and various situations that involve the effects of electromagnetic interference generated by other wireless devices. We infer the necessity of much more stringent specification requirements than the published standard for various wireless communication field environments

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.1
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• pp.11-17
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• 2015

The increase of international and domestic trade according to global industrialization and economic growth has raised the national logistic cost in connection with physical distribution of articles. In order to reduce these costs and rise up national industrial competitiveness, Korea has also tried to improve the efficiency of logistics with various methods as advanced countries did. Especially, Korea government has decided standard dimension of pallets with T11 ($1100{\times}1100mm$) on the basis of unit load system in early 2000s, and certification program for logistics equipments has been operated to keep up the compatibility for the equipments and packaging with modulation of T11. Consequently, this certification program has contributed to extend standardization for logistics and to grow up 3 party logistics, but compared with advanced countries, the rate of national logistics cost to GDP (gross domestic product) still shows about 3% gap as demands for certification have been decreased in the recent. In this study, therefore, we proposed the development of logistics certification system based on social needs as a policy device to activate logistic industry as well as improve the efficiency of national logistics after we had analyzed all of certification programs for logistics being run in Korea. Namely, the first is the development of certification project for Northeast Asia's logistics corresponding to necessity for applying returnable transport system according to increasing the amount of trade between Northeast Asia's countries. The second is the development of certification project for safe transportation of packaging corresponding to costumer's needs for safe transit according to the growth of electronic commerce and the increase of global distribution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.178-178
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• 2009

전자제품의 고속화, 고집적화, 고성능이 요구되어짐에 따라 IC's 성능 향상을 통해 패키징 기술의 소형화를 필요로 하고 있어 소재나 칩 부품을 이용해 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브 기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 3D 패키징이 가능한 flexible 소재에 능, 수동 소자를 내장하기 위한 다층 flexible 기판 공정 기술에 대한 연구를 수행하였다. 기판제작을 위해 flexible 소재에 미세 형성이 가능한 폴리머 필름을 접착하였고 flexible 위에 후막 저항체 패턴을 퍼|이스트를 이용하여 형성하였다. 또한, 능동소자 내장을 위해 test chip을 제작하여 플립칩 본더를 이용해 flexible 기판에 접합한 후에 bonding film을 이용한 build up 공정을 통해 via를 형성하고 무전해 도금 공정을 거쳐 전기적인 연결을 하였다. 위의 공정을 통해 앓고 가벼울 뿐만 아니라 자유롭게 구부러지는 특성을 갖고 있는 능, 수동 소자 내장형 flexible 기판의 변형에 따른 전기적 특성을 평가하였다.

• Journal of IKEEE
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• v.17 no.3
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• pp.221-228
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• 2013

About functional parameters of a LED/UVLED (Light Emitting Diode/Ultra Violet LED), one of the most important parameters is the I-V characteristic. By researching factors affect to the I-V characteristic of uvled, we found that beside of the structure of the device itself, there is the influence of the electrode materials, electrode shapes, the process of wiring and packaging. In this work, we want to improve the performance of UVLED to find out the optimal mask design principles. The study is based on theoretical mathematical models, as well as the use of simulation software tool Comsol. From all results obtained, the team has improved mask design to manufacture electrodes for GaN-based UVLED. Electrode masks are designed by three softwares, which are Intellisuite, Klayout and AutoCad. Intellisuite masks would be used in fabrication simulation while Klayout and AutoCad are used to fabricate electrodes in experiments. As well as, we silmulated the structure of an uvled 355nm emission wavelength by TCAD software, in order to compare with uvled sample that has the same emission wavelength.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.909-911
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.3
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• pp.227-234
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• 2000

An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

• Culinary science and hospitality research
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• v.21 no.1
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• pp.235-249
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• 2015

This study was carried out to investigate the flavor changes of Lentinus edodes at different storage temperatures, time and natural additives using an electronic nose with six metal oxide sensors. To preserve good quality of modified atmosphere packaged Lentinus edodes, Four natural additives(Artemisia princeps, Artemisia capillaries, green tea, and activated charcoal) were used. The mushrooms were packaged in polyethylene films with each treatment and were stored at 5, 10 and $20^{\circ}C$. Increase in storage temperature and storage time decreased the ratio of resistance in the electronic nose as well as first principal component scores. In addition, indicating quality of mushroom reduced at high temperature and long storage time. The results of the electronic nose and the principal component analysis(PCA) in the mushrooms with Artemisia princeps and Artemisia capillaries that were stored at $5^{\circ}C$, and green tea and activated charcoal which were stored at $10^{\circ}C$ showed the good effects to maintain the freshness along with reducing off-flavor. However, there were no differences between control and treatment groups at $20^{\circ}C$.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.4 no.3
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• pp.167-173
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• 2011

Since many blood pressure pulse analyzer made to measurement of a pulse wave in quantitative way has been started, some sorts of pressure sensors are being developed. The result could differ and this cause either type of sensor or module shape, when pulse wave is measured. In this paper, calculate and compare the pressure sensor's stress distribution according to thickness of PDMS coating and existence of guide through Finite Element Method. As a result, the center of pressure sensor's stress increase as much as 24% as it is reduced as much as 0.3 mm that the PDMS coating thichness of pulse diagnostic sensor module, on the other hand the surrouding censor of center sensor's stress is reduced as much as 4.9%, and transmissive proportion of stress is small as little as 2.7%, When coating has guide.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.1
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• pp.23-28
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• 2024

Electronic products utilizing flexible devices experience harsh mechanical deformations in real-use environments. As a result, researches on the mechanical reliability of these flexible devices have attracted considerable interest among researchers. This study employed previous bending strain models and finite element analysis to predict the maximum bending strain of metal films deposited on flexible substrates. Bending experiments were simulated using finite element analysis with variations in the material and thickness of the thin films, and the substrate thickness. The results were compared with the strains predicted by existing models. The distribution of strain on the surface of film was observed, and the error rate of the existing model was analyzed during bending. Additionally, a modified model was proposed, providing mathematical constants for each case.