• Title/Summary/Keyword: Electronic devices

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Importance of Green Density of Nanoparticle Precursor Film in Microstructural Development and Photovoltaic Properties of CuInSe2 Thin Films

  • Hwang, Yoonjung;Lim, Ye Seul;Lee, Byung-Seok;Park, Young-Il;Lee, Doh-Kwon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.471.2-471.2
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    • 2014
  • We demonstrate here that an improvement in precursor film density (green density) leads to a great enhancement in the photovoltaic performance of CuInSe2 (CISe) thin film solar cells fabricated with Cu-In nanoparticle precursor films via chemical solution deposition. A cold-isostatic pressing (CIP) technique was applied to uniformly compress the precursor film over the entire surface (measuring 3~4 cm2) and was found to increase its relative density (particle packing density) by ca. 20%, which resulted in an appreciable improvement in the microstructural features of the sintered CISe film in terms of lower porosity, reduced grain boundaries, and a more uniform surface morphology. The low-bandgap (Eg=1.0 eV) CISe PV devices with the CIP-treated film exhibited greatly enhanced open-circuit voltage (VOC, from 0.265 V to 0.413 V) and fill factor (FF, from 0.34 to 0.55), as compared to the control devices. As a consequence, an almost 3-fold increase in the average power conversion efficiency, 3.0 to 8.2% (with the highest value of 9.02%), was realized without an anti-reflection coating. A diode analysis revealed that the enhanced VOC and FF were essentially attributed to the reduced reverse saturation current density (j0) and diode ideality factor (n). This is associated with the suppressed recombination, likely due to the reduction in recombination sites such as grain/air surfaces (pores), inter-granular interfaces, and defective CISe/CdS junctions in the CIP-treated device. From the temperature dependences of VOC, it was confirmed that the CIP-treated devices suffer less from interface recombination.

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A Study on Developing Safety and Performance Assessment Guideline for Electronic Warm-Acupuncture Apparatus (전기식 온침기에 대한 안전성 및 성능평가 가이드라인 개발 연구)

  • Hansol Jang;U-Ryeong Chung;Jeong-Hyun Moon;Seong-Kyeong Choi;Won-Suk Sung;Min-Seop Hwang;Seung-Deok Lee;Kyung-Ho Kim;Jong-Hwa Yoon;Eun-Jung Kim
    • The Journal of Korean Medicine
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    • v.43 no.3
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    • pp.150-163
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    • 2022
  • Objectives: This research aimed to develop a guideline for evaluating safety and performance of electronic warm-acupuncture apparatus. With the development of medical devices like electronic warm-acupuncture apparatus with improved performance, convenience and safety measures compared to traditional warm-acupuncture needling, safety and performance guideline is a necessity. Methods: By referring to existing standards and guidelines of other electronic devices for Korean medicine with heating function, guideline for safety and performance assessment of electronic warm-acupuncture apparatus was drafted Results: The guideline, presents explanation for adequate temperature and settings of the apparatus, and safety measurements providing against thermal runaway situations along with guidelines for the manual. Guideline for detailed test method for the performance of the apparatus such as accuracy of temperature increase and the timer, and safety unit was also provided. The test items and suggested test methods for the requirements of biological, electrical and electromagnetic safety were referred to Korean approval documents of ministry of Food and Drug Safety. Conclusion: We proposed the relevant items to verify performance and safety of warm-acupuncture apparatus to assure patient safety and improve the quality of currently developing devices for application in clinical field.

An Ad hoc Scatternet Formation Algorithm on Bluetooth

  • Kim, Dong-Kyoo;Choi, Yun-Jong;Park, Poo-Gyeon
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.2418-2423
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    • 2003
  • Bluetooth is a low cost, license-free, and short-range radio communication technology. This gradually gaining de facto standard for applications of a personal area network over the world. To make it further popular, it should provide faster and more flexible connectivity than that supported by the existing bluetooth specification. This paper proposes a new Ad hoc scatternet formation algorithm that supports those connectivity under circumstances such that devices can not get in direct touch with one another; say out-of-bounded case. It also maintains the character that those connectivity minimizes the number of piconets when all devices are in the communication range with one another, say in-bounded case, as pervious works.

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A MAS Information Management Method for WiMedia MAC Protocol

  • Chung, Tae-Wook;Chung, Chul-Ho;Kim, Jae-Seok
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.4
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    • pp.205-208
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    • 2009
  • In this paper, a MAS information management method is proposed for the WiMedia MAC protocol. WiMedia MAC configures a fully distributed network based on Ad-hoc method. WiMedia devices communicate during Superframe which is a communication unit in WiMedia MAC. Each superframe which consist of 256 MASs is divided into two periods, beacon period and data period. In data period, devices communicate with each other using the received channel access information during the beacon period. Due to only $12{\mu}s$ timing allowance between beacon period and data period, the process of the MAS information management cannot be completed in time if entire process handle by software. Therefore, we propose a novel MAS information management method using hardware module. With our proposed method, a WiMedia device is satisfied with the processing time that is required in WiMedia MAC protocol.

Quality improvement on joints of electronic materials and its reliability by Fe-Ni alloy clad lead frame (Fe-Ni 합금 클래드 리드 프레임을 이용한 전자 재료 접합부의 품질향상과 그 신뢰성)

  • 신영의;최인수;안승호
    • Journal of Welding and Joining
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    • v.13 no.2
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    • pp.82-95
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    • 1995
  • This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

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A Study on the Electrical Characteristics of Organic Thin Film Transistor using Photoacryl as Gate Dielectric Layer (Photoacryl을 게이트 절연층으로 사용한 유기 박막 트랜지스터의 전기적 특성에 관한 연구)

  • 김윤명;표상우;심재훈;김영관;김정수
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.247-250
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    • 2001
  • Organic semiconductors based on vacuum-deposited films of fused-ring polycyclic aromatic hydrocarbon have great potential to be utilized as an active layer for electronic and optoelectronic devices. We have fabricated organic thin film transistors(OTFTs) and discuss electrical characteristics of the devices. For the gate dielectric layer, OPTMER PC403 photoacryl(JSR Co.) was spin-coated and cured at 220$^{\circ}C$. Electrical characteristics of the device were investigated, where the photoacryl dielectric layer thickness and pentacene active layer thickness were about 0.6$\mu\textrm{m}$ and 800${\AA}$.

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An Efficient Error Detection Technique for 3D Bit-Partitioned SRAM Devices

  • Yoon, Heung Sun;Park, Jong Kang;Kim, Jong Tae
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.5
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    • pp.445-454
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    • 2015
  • As the feature sizes and the operating charges continue to be scaled down, multi-bit soft errors are becoming more critical in SRAM designs of a few nanometers. In this paper, we propose an efficient error detection technique to reduce the size of parity bits by applying a 2D bit-interleaving technique to 3D bit-partitioned SRAM devices. Our proposed bit-interleaving technique uses only 1/K (where K is the number of dies) parity bits, compared with conventional bit-interleaving structures. Our simulation results show that 1/K parity bits are needed with only a 0.024-0.036% detection error increased over that of the existing bit-interleaving method. It is also possible for our technique to improve the burst error coverage, by adding more parity bits.

A Study on Configuration of Extremely Low Phase Noise Oscillator Circuit

  • Sakuta, Yukinori;Arai, Yuji;Sekine, Yoshifumi
    • Proceedings of the IEEK Conference
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    • 2002.07b
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    • pp.1196-1199
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    • 2002
  • The low phase noise frequency source to be used for measurements and so on realizes by oscillator having highly output signal power against output noise power. SAW devices can be used by high power than BAW devices. So we examine on configuration of SAW oscillator circuits with the power gain. In this paper we shall discuss a configuration of oscillator circuit to obtain an extremely low phase noise and an oscillator operating at a non-reactive frequency of SAW resonator.

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Development of the shoes measuring the performance of walking or running (운동량 측정 신발의 개발)

  • Kim, Y.S.;Jun, C.H.;Kim, M.H.;Choi, H.S.
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.863-867
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    • 2003
  • This paper aims at the development of shoes measuring the performance of walking or running, which is equipped with electronic devices. In the in-sole of the shoes, a piezoelectric sensor is inserted for measuring the number of steps and the speed of walking. The measured signals are processed by the one-chip microprocessor and related electronic devices. Using the data, the momentum and calories of walking and running are calculated, and the results are transmitted to the displaying system composed of LCD by the RF telecommunication system.

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Ferromagnetic Heterostructures based on Semiconductors

  • Tanaka, M.;Sugahara, S.;Nazmul, A.M.
    • Proceedings of the Korean Magnestics Society Conference
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    • 2003.06a
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    • pp.262-262
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    • 2003
  • Creating a new spin-based electronics (often called "spin-electronics" or "spintronics") is one of the hot topics in the current solid-state physics and electronics research. In order to utilize the spin degree of freedom in solids, particularly in semiconductors the current electronics is based on, we need to fabricate appropriate materials, understand and control the spin-dependent phenomena. In this ta1k, I will review the recent deve1opments of epitaxial ferromagnetic hetero structures based on semiconductors towards spintronics. This includes the semiconductor materials and hetero structures having high ferromagnetic transition temperature (III-V based alloy magnetic semiconductors, Mn-delta-doped magnetic semiconductors, and related heterostructures), spin-dependent transport and tunneling, and their device applications (tunneling magnetoresistance devices and three-terminal devices). Future issues and prospects will be also discussed.

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