• Title/Summary/Keyword: Electronic devices

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Annealing Effects of The Electrochromic $MoO_3$ Thin Films (전기변색 $MoO_3$ 박막의 열처리 효과)

  • 임동규;이진민;조봉희;김동진;김영호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.505-508
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    • 1999
  • The effect of the heat treatment on electrochromic properties of $MoO_3$ thin films is investigated by studing optical modulation, optical density, response time, and cyclic voltammetry. From the results of XRD analysis, heat-treated at $450^{\circ}C$ in air for 1 hour $MoO_3$ thin films are found to be crystalline while as-deposited film and heat-treated at low temperature (${\leq}300^{\circ}C$) are amorphous. The electrochrornic devices using as-deposited $MoO_3$ films exhibits good electrochromic properties compare to those using the heat treated $MoO_3$ films. It has shown that the heat-treatment affected the stability and the electrochromic properties of $MoO_3$ films.

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A Study on Oxygen Precipitation in Heavily Boron Doped Silicon Wafer (고농도 붕소의 도핑된 실리콘 웨이퍼에서의 산소석출에 관한 연구)

  • 윤상현;곽계달
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.9
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    • pp.705-710
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    • 1998
  • Intrinsic gettering is usually to improve wafer quality, which is an important factor for reliable ULSI devices. In order to generate oxygen precipitation in lightly and heavily boron doped silicon wafers with or without high $^75 As^+$ ion implantation, the 2-step annealing method was adopted. After annealing, the were cleaved and etched with th Wright etchant. The morphology of cross section on samples was inspected by FESEM(field emission scanning electron microscopy). The morphology of unimplanted samples was rater rough than that of the implanted. Oxygen precipitation density observed by an optical microscope in lightly boron doped samples was about 3$\times10^6/cm^3$. However, in heavily boron doped samples, the density of oxygen precipitation was largest at $600^{\circ}C$ in 1st annealing, and decreased abruptly until $800^{\circ}C$, But it increased slightly at $1000^{\circ}C$ and was independent with the implantation.

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The Analysis of I-V characteristics on n-channel offset gated poly-Si TFT`s (Offset 구조를 갖는 n-채널 다결정 실리콘 박막 트랜지스터의 I-V 분석)

  • 변문기;이제혁;김동진;조동희;김영호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.26-29
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    • 1999
  • The I-V characteristics of the n-channel offset gated poly-Si TETs have been systematically investigated in order to analyse the effects of offset region. The on currents are reduced due to the series resistance by the offset length and there is no kink phenomenon in offset devices. The off currents of the offset gated TFTs are remarkably reduced to 10$^{-12}$ A independent of gate and drain voltage because the electric field is weakened by the increase of the depletion region width near the drain region. It is shown that the offset regions behave as a series resistance and reduce lateral and vertical electric field.

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Emission Properties of Electroluminescent Device Using Poly(3-hexylthiophene) as Emilting Material (The Poly(3-hexylthiophene)을 발광층으로 사용한 전계 발광소자의 발광특성)

  • 김주승;구할본;조재철
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.263-266
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    • 1999
  • Electrolunlinescent devices based on conjugated polymer emitting materials have been much attracted possible applications for multicolor flat panel display, since the conjugated polymers have a small band gap emitting obtained at a low driving voltage. In this paper, we fabricated the single layer EL device using poly(3-hexylthiophene) as emitting material Electroluminescence(EL) and I-V-L characteristics of indium-tin-oxide[ITO]P3HT/AI device with a various thickness were investigated. It was demonstrate that the I-V characteristics depend, not the voltage but the electric- field strength, The current is dependent on the electric filed and not on the applied voltage, indicating that the carriers are injected by a tunneling process. In the device, the barrier to hole injection is only 0.5eV and the barrier to electron injection is 1.5eV.

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Emission Properties of Europium Complex Utilizing Multilayer Quantum-Well Structure Properties by Vacuum Vapor Deposition Method (진공증착법으로 제작한 다층 구조의 Europium Complex의 발광특성)

  • 이상필;이제혁;이한성;김영관;김정수
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.609-612
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    • 1999
  • Organic electroluminescent(EL) devices have received a great deal of attention due to their potential application as full-color displays. They are attractive because of their capability of multicolor emission, ease of fabrication, and operation at a low driving voltage. In this study, single and multiple quantum-well structures consisting of Eu(TTA)$_3$(bpy) complex well layer sandwiched between triphenyldiamine derivative (TPD) layers were fabricated and their photoluminescent electroluminescent characteristics were also investigated. Sharp emission at 616 nm has been observed from the Eu complex in multilayer, single and multiple quantum-well structures. Details on the explanation of electrical properties of these structures will be discussed.

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Study on pre-bonding according with HF pre-treatment conditions in Si wafer direct bonding (실리콘기판 직접접합에 있어서 HF 전처리 조건에 따른 초기접합에 관한 연구)

  • 강경두;박진성;정수태;주병권;정귀상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.370-373
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    • 1999
  • Si direct bonding (SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on- pre treatment conditions in Si wafer direct bonding, The paper resents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, applied pressure and annealing temperature(200~ 100$0^{\circ}C$) after pre-bonding. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively, Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding(Min 2.4kgf/$\textrm{cm}^2$~ Max : 14.kgf/$\textrm{cm}^2$)

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Dry Etching of patternedLiNbO3Waveguides for the High-speed Optical Modulator fabrication (초고속 광변조기 제작을 위한 LiNbO3도파로의 건식식각)

  • 양우석;김우경;이승태;박우정;장현수;윤대호;이한영
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.8
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    • pp.731-735
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    • 2003
  • Ti-indiffused LiNbO$_3$waveguide have been used to various high speed optical device based on electro-optic effect such as modulators, switches, and sensor, etc. In order to high speed modulation of optical modulator have, one of the further devices, needed to increasing of electrode surrounding air by LiNbO$_3$dry etching because of impedance matching for optical and RF phase velocity between waveguide and electrode. We studied property of LiNbO$_3$dry etching after waveguide patterning lot optical modulation by using neutral loop discharge (NLD) plasma.

Evaluation Technology of Mechano-Electromagnetic Properties in HTS Superconducting Tapes for Practical Applications (HTS 초전도 테이프의 기계-전기적 특성 평가기술)

  • Shin, Hyung-Seop
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05a
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    • pp.17-22
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    • 2003
  • HTS superconducting tapes are now commercially available for practical applications such as magnets and cables. Since superconductors in such applications are subjected to high mechanical loads that can significantly degrade the superconducting properties, mechanical properties and the strain tolerance known as the strain effect on superconducting properties are needed to be estimated for developing superconducting devices. The progress in technology achieved in the field of strain effect evaluation on the critical current of HTS tapes in various deformation modes is discussed in this study.

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The Structural-Dependent Characteristics of Rashba Spin Transports in In0.5Ga0.5As/In0.5Al0.5As Heterojunctions

  • Choi, Hyon-Kwang;Hwang, Sook-Hyun;Jeon, Min-Hyon;Yamda, Syoji
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.4
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    • pp.140-143
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    • 2011
  • The growth and characterization of $In_{0.5}Ga_{0.5}As/In_{0.5}Al_{0.5}As$ narrow-gap inverted high electron mobility transistor structures, developed as a candidate material for spin-injection devices, are presented in this study. We have grown samples possessing surface $In_{0.5}Ga_{0.5}As$ channels of different thicknesses (30 nm and 60 nm) both with and without a thin 3 nm $In_{0.5}Ga_{0.5}As$ cap layer by using molecular beam epitaxy. We then investigated the in-plane transport properties as well as the Rashba spin-orbit coupling constant of the two-dimensional electron gas confined at the heterojunction interface.

The Characteristics of p-channel SONOS Transistor for the NAND Charge-trap Flash Memory (NAND 전하트랩 플래시메모리를 위한 p채널 SONOS 트랜지스터의 특성)

  • Kim, Byung-Cheul;Kim, Joo-Yeon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.1
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    • pp.7-11
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    • 2009
  • In this study, p-channel silicon-oxide-nitride-oxide-silicon(SONOS) transistors are fabricated and characterized as an unit cell for NAND flash memory. The SONOS transistors are fabricated by $0.13{\mu}m$ low power standard logic process technology. The thicknesses of gate insulators are 2.0 nm for the tunnel oxide, 1.4 nm for the nitride layer, and 4.9 nm for the blocking oxide. The fabricated SONOS transistors show low programming voltage and fast erase speed. However, the retention and endurance of the devices show poor characteristics.