• 대한기계학회논문집B
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• 제23권7호
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• pp.928-936
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• 1999

The electronic refrigerating kimchi jar operates with a low noise because it contains no compressor but it consumes more energy than that of an refrigerator with compressor. In this paper, the heat flow characteristics and cooling performance of an electronic refrigerating kimchi jar are studied by means of experiments. When the storage temperature is kept in a range of $-5.7^{\circ}C$ to $4.1^{\circ}C$. in the case of three ambient temperatures; $12.7^{\circ}C$, $22.3^{\circ}C$ and $32.2^{\circ}C$, the cooling performance of $20{\ell}$ kimchi jar is investigated. The experiments show that the temperature difference that exists between kimchi jar and its ambient provides a measure of the coefficient of performance of kimchi jar. It is also found that ratio of net pumping heat to the heat pumping rate of thermoelectric module is independent of the temperature difference.

• 한국지능시스템학회논문지
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• 제25권2호
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• pp.147-154
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• 2015

본 논문에서는 승강기용 냉각장치의 에너지 절감을 위한 사람 검출과 퍼지 온도 제어 시스템을 제안한다. 기존의 냉매를 사용하는 냉각장치의 문제점들을 개선하기 위해 사람 검출과 퍼지 온도 제어 시스템으로 열전냉각장치를 구동시켜 에너지 절감을 하고 자동적으로 효율적인 온도 관리를 한다. 제안된 시스템은 사람 검출을 통해 승강기 탑승 인원수를 확인하고 나서 퍼지 시스템에서 탑승 인원수와 계절 평균 기온을 기반으로 온도 제어를 한다. 사람 검출 방법은 승강기에서 조감도 카메라를 기반으로 사람의 머리 부분을 특징으로 사용하여 탑승 인원수를 검지한다. 퍼지 시스템은 look-up table 방법으로서 검지된 인원수와 기온을 고려하여 승강기의 내부 온도를 결정한다. 제안된 시스템은 사람 검출과 온도 제어를 통해 냉각장치의 에너지를 절감시킨다. 실험을 통해 에너지 절감을 확인하고 제안된 시스템의 성능을 검증한다.

• 한국안전학회지
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• 제13권2호
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.953-955
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• 1998

In this paper, a double cylindrical type ozonizer has been designed and manufactured to improve ozone yield by cooling external electrode. The ozonizer equipped with three electrodes( central, internal and external electrodes ) and two gaps. Discharge and ozone characteristics are described in this paper by varying flux( Q ) of oxygen supplied gas, temperature of cooling gas and supplied voltage.

• 설비공학논문집
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• 제16권7호
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• 대한기계학회논문집B
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• 제31권4호
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• pp.367-375
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• 2007

The purpose of this study is to investigate the cooling performance of Heat Pipe Heat Exchanger(HPHE) for an electronic telecommunication system by adequate convection condition. Heat generation rates of electronic components, the temperature distributions of HPHE and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system, a program is developed. The program is useful to a user who is not familiar with an electronic telecommunication system. The simulation results showed that the HPHE were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $17.4^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.16.2-16.2
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• 2005

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.4.2-4.2
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• 2005

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 초전도 자성체 연구회
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• pp.42-45
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• 2003

The phase transformation of $REBa_2Cu_3O_{7-x}$ (RE=Nd, Gd, Dy) was investigated using isothermal heat-treatment and continuous cooling in air. During continuous cooling, the $REBa_2Cu_3O_{7-x}$ (RE=123) superconducting phase with well-distributed $REBa_2Cu_3O_{7-x}$ (RE-211) was obtainde at a cooling rate of $0.001^{\circ}C$/s. Single phase RE-123 (Nd, Gd, Dy) was stable at $1050^{\circ}C$, $1050^{\circ}C$, and $950^{\circ}C$ during isothermal heat-treatment, respectively. Above these temperatures the RE-211 phase existed within the RE-123 grains. The RE-123, RE-211, $BaCu_2Od_2$, and CuO phases coexisted at $50^{\circ}C$ below the partial melting temperature for each respective rare-earth RE-123.

• 전기학회논문지
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• 제61권12호
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• pp.1774-1781
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• 2012

There are some efforts to improve the performance of electrical heat pump(EHP) and replace it with an alternative cooling equipment such as gas engine-driven heat pump(GHP), a gas cooling equipment, in order to solve the problem of summer electricity supply through reducing the summer electricity peak. This paper analyzes cost-benefit in accordance with replacement of electrical cooling system by gas cooling system using california standard test and sensitivity analysis of some scenarios.