• Title/Summary/Keyword: Electronic Board

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Prediction of forming accuracy using FEM analysis in slitting process for connector terminal with micro width (미세폭 슬리팅 공정에서 유한요소해석을 이용한 성형 정밀도 예측)

  • Hong, Seok-Kwan;Lee, Byung-Moon;Kang, Jeong-Jin;Kim, Jong-Deok
    • Design & Manufacturing
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    • v.2 no.3
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    • pp.45-50
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    • 2008
  • In the electronic products, connector which play a role of board-to-board connection is an essential part. The manufacture process of this connector involves slitting and bending stage. Recently, manufacturing the connector is becoming more and more difficult as miniaturization of the electronic products. In this study, FEM analysis was performed on slitting and bending process for connector terminal with micro width in order to predict the cause of inaccurate dimension of connector terminal which occurs in actual industrial spot.

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High Brightness Sign Board LCD Backlight (LCD 백라이트를 이용한 고휘도 사인보드)

  • Lim, Sung-Kyoo;Hur, Jeong-Wook;Park, Jong-Lee;Lee, Hwan-Woong;Oh, Myoung-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.522-525
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    • 2002
  • 본 논문에서는 고휘도 LCD 백라이트 유닛에 사용되는 직하방식 백라이트 제조 방법을 이용하여 저전력, 고휘도, 경박 단소의 광고용 사인보드를 설계 제작하였다. 광학 시뮬레이션을 이용하여 램프의 배치 등 을 설계하였으며. 최고 16개의 냉음극관 램프를 구동할 수 있는 인버터를 설계 제작하였다. 크기 $500mm{\times}400mm$의 광고판의 경우 두께는 35mm 이었으며 휘도는 15,000lux이었다.

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Development and Characterization of Optimum Heat Sink for 30 W Chip on Board LED Down-Light

  • Seo, Bum-Sik;Lee, Ki-Joung;Yang, Jong-Kyung;Cho, Young Seek;Park, Dae-Hee
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.6
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    • pp.292-296
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    • 2012
  • An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

사고 분석 사례 - Queen of the North 좌초 -

  • Lee, Dong-Seop
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 2011.06a
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    • pp.80-81
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    • 2011
  • Canada British Columbia 주의 Prince Rupert 와 Port Hardy(503km) 를 1주일에 2회 왕복하던 Queen of the North 호가 2006년 3월 22일 Gill Island 북쪽 해상에서 좌초되었다. 사고 후, 선박에 탑재된 Electronic Chart System(ECS)을 수거하여 선박의 항해자료를 회수키로하고, 2006년 6월 15일 해양탐사로봇을 이용하여 해저 약 453m 지점에 착저된 선박으로부터 ECS 컴퓨터를 수거하였고 Maker인 Transas사는 수거된 ECS의 Data를 복원하여 선주사에 재공하였다. 이에 따라 캐나다 교통안전국 (Transportation Safety Board of Canada)는 재현 결과물을 통하여 사고원인을 규명한 사건이다.

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A Study on Dielectric Properties of Printed Circuit Board(PCB) Materials with Variation of Frequency and Temperature (온도 및 주파수 변화에 따른 프린트 배선기판의 유전특성 연구)

  • 박종성;김종헌;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.06a
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    • pp.135-138
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    • 1998
  • This paper presents the results of measured permittivity of PCB sheet material in the frequency range of 0.1[GHz] - 2[GHz] and temperature range of $25[^{\circ}C]$ - $85[^{\circ}C]$. Microstrip lines with different physical length are implemented to measure the attenuation and phase shift of the signals though these lines. The loss factor of these materials could be obtained with the dielectric constant and the attenuation of the microstrip lines.

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A Study on Dielectric Properties of Printed Circuit Board Materials with Variation of Frequency and Temperature (온도 및 주파수 변화에 따른 프린트 배선기판의 유전특성 연구)

  • 박종성;김종헌;이준웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.10
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    • pp.773-777
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    • 1998
  • This paper presents the results of measured permittivity of PCB sheet material in the frequency range of 0.1 ~ 2[㎓] and temperature range of 25~ 85[>$^{\circ}C$]. Microstrip lines with different physical length are implemented to measure the attenuation and phase shift of the signals through these lines. The loss factor of glass-epoxy and teflon could by calculated with the measured dielectric constant and the attenuation. From the experiment, the glass-epoxy was more influenced by temperature and frequency than teflon. The average dielectric constants of glass-epoxy and teflon within the measured frequency range are 4.48 and 2.18, respectively.

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Design of Embedded Platform based on Android (안드로이드 기반 임베디드 플랫폼 설계)

  • Yoon, Chan-Ho;Kim, Gwang-Jun;Jang, Chang-Soo
    • The Journal of the Korea institute of electronic communication sciences
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    • v.8 no.10
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    • pp.1545-1552
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    • 2013
  • This paper presents an implementation of embedded platform based ARM A8-cortex processor for android supporting. The development board for S5PV210 is a platform that is suitable for code development of SAMSUNG's S5PV210 32bit RICS micro controller(ARMv7) architecture for hand-held device and general applications. Embedded platform development board offers various function and high efficiencies. In addition to the high performance, the embedded platform offers low current consumption, ensuring low costs and power.

A study on the development of BID-IPM (BID-IPM 개발에 관한 연구)

  • Oh, Pil-Kyoung;Yeon, Jae-Eul;Kim, Hee-Jun;Park, Min-Hee;An, Sung-Yun
    • Proceedings of the KIEE Conference
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    • 2005.10c
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    • pp.158-161
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    • 2005
  • For low power motor control, there are increasing demands for compactness, cost effective and built in many functions. Hence Intelligent Power Module(IPM) is considered as an important technology in inverter-driven motor applications. Regarding BID-IPM(Built In DC/DC converter, Intelligent Power Module) newly developed to integrate NPT-IGBT, HVIC and Flyback converter in a compact package, this paper discussed design of BID-IPM and presented the experimental results by using signal source board and equivalent load test board.

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Study on the MTTF of Multi Wave Lengths IR and NIR LEDs Module (다파장 IR과 NIR 모듈의 평균 수명 예측에 관한 연구)

  • Kim, Dong Pyo;Kim, Kyung Seob
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.1
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    • pp.44-49
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    • 2021
  • Recently, infrared (IR) and near-infrared (NIR) light-emitting diodes (LEDs) were widely used for home medical applications owing to its low output power and wide exposed area for curing. For deep penetration of the light under the skin, multiple LEDs with wavelengths of 700~10,000 nm were located on a flexible printed circuit board. When multiple wavelengths of LEDs were soldered on a circuit board, the lifetime of LED module highly depends on LEDs with a short lifetime. The mean time to failure (MTTF) was able to calculate with the experimental results under high temperature and the Arrhenius model. The results of this study could help companies to approve the warranty of LED modules and its product.

PI(Power Integrity)를 이용한 EMI 개선

  • Lee, Suk-Yeun;Chung, Ki-Hyun
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.1195-1196
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    • 2008
  • It is difficult to solve PCB(Printed Circuit Board) Noise problem. Because Electronic circuit system operates very high frequency. Resonance analysis of PCB layout by PI(Power Integrity) Simulation method visualizes distribution of Switching noise between VDD and GND. By using de-cap, we reduce impedance and solve the EMI problems.

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