• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.176-177
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• 2015

본 실험에서 PET 위 무전해 구리 도금을 위한 전처리 방법 중 하나인 UV 조사를 통해 전처리를 한 후 PET 표면의 특성과 염기성 무전해 도금액이 개질된 표면에 미치는 영향에 관한 연구를 하였다. 일반적으로 PET 표면을 개질시키기 위해 UVC(254nm) 파장을 이용하여 PET bond break (Chain Scission)을 이루는 것으로 알려진다. 이때 공기 중의 산소와 UV 조사를 통해 생성된 PET 내의 free radical과 산화 반응을 통해 친수성이 높은 표면을 형성하게 된다. PET 표면의 친수성을 측정하기 위해 접촉각 측정기가 사용되었으며, 표면의 거칠기 및 형상을 관찰하기 위해 AFM과 FE-SEM를 각각 이용하였다. 또한 PET 표면의 구조 변화는 XPS를 통해 분석을 진행 하였다. UV 조사 후 표면의 거칠기 및 친수성은 높아졌지만, 무전해 도금은 이루어지지 않았다. 분석 결과, 이는 표면에 형성된 Low Molecular Weight Oxidation Compound(LMWOC)가 염기성 수용액 내에서 용해되어 모두 씻겨 나가 표면에 형성된 Sn/Pd을 모두 떨어트린 것으로 판단되며, 위와같은 이유로 UV 조사 후 습식 공정에 적용하기 위해 표면개질 된 PET를 염기성 수용액을 통해 전처리가 필요한 것으로 사료된다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.108-108
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• 2018

무전해 니켈도금 층은 마모, 마찰, 스크래치, tribology 등에 대한 내구성뿐만 아니라 내식성도 우수하여 산업현장에서 널리 적용되고 있다. 일반적으로 무전해 니켈도금 층의 내구성은 경도 값과 직접적인 상관관계를 가지며, 그 값은 약 $400-500H_V$ 정도이다. 이러한 무전해 도금 층에 대하여 약 $400^{\circ}C$에서 1시간 정도 열처리를 실시하면 경도 값은 약 $800-1000H_V$ 정도로 현저히 증가되고 내구성 역시 크게 향상시킬 수 있다. 그러나 해양환경에서 발생되는 캐비테이션 침식 부식에 대한 무전해 니켈도금 층의 열처리에 관한 연구는 거의 전무한 상태이다. 따라서 본 연구에서는 회주철의 캐비테이션 침식 부식을 방지하기 위해 무전해 니켈도금 후 다양한 온도와 시간으로 열처리를 실시하여 도금 층의 캐비테이션 침식 부식 특성을 평가하고자 하였다. 무전해 니켈코팅을 위한 모재는 회주철(FC250)을 $19.5mm{\times}19.5mm{\times}5mm$의 크기로 가공하였다. 도금조로 500mL 비커를 사용하였으며, 모든 시험편은 2시간 동안 무전해 니켈도금을 실시하였다. 그리고 캐비테이션 실험은 ASTM G32 규정에 의거하여 천연해수 내 $30^{\circ}C$에서 $50{\mu}m$의 진폭으로 실시하였다. 그 결과 열처리 적용 시 EN 도금의 표면경도가 현저히 증가하여 캐비테이션 침식 부식 저항성이 상당히 개선되었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.34-34
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• 2018

레이저를 통한 플라스틱 일체형 회로형성 기술은 레이저 직접 성형 (Laser Direct Structuring, LDS) 기술과 도금기술을 이용하여 기판 표면에 전도성 회로 패턴을 형성하고 소자를 집적하여 부품을 제작하는 기술이다. 종래에는 PCB 기반의 평면기판을 기반으로 하여 제작된 소자와 부품이 전자제품의 주를 이루었으나, 최근 소자의 집적화와 제품 디자인의 유연화(flexible)로 굽힘(bendable) 형태의 스마트 시계와 같은 웨어러블(wearable) 전자 제품이 출시되었으며, 레이저를 통한 플라스틱 일체형 회로형성 기술은 미래 사회의 주를 이룰 웨어러블 형태의 제품의 상용화를 가능하게 할 뿐만 아니라 회로 집적이 가능하여 제품 혁신을 주도할 기술로 주목 받고 있다. 본 연구에서는 LDS 부품의 미세 회로 구현을 위한 공정 기술 개발에 있어서 고생산성 무전해 동도금액 및 부품 실장을 위한 표면처리 기술 개발에 대한 결과를 보고한다. 미세 회로 패터닝 기술의 상용화를 위해서는 도금액의 안정성뿐만 아니라 고속 공정기술이 필요하다, 현재 국내 무전해 동 도금의 석출 속도는 시간 당 $4{\sim}5{\mu}m$ 내외이기 때문에, 생산성을 향상시키기 위해서는 시간 당 $10{\mu}m$ 정도의 고속 무전해 동 도금 공정 개발 필요하다.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.11
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• pp.1600-1604
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• 2017

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

• Korean Journal of Materials Research
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• v.16 no.7
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• pp.430-434
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• 2006

Au/Ni coatings are widely used in the electrical interconnect system, such as connectors, sockets and wire crimps. But due to repeated mechanical contacts, fretting corrosion occurs and causes a rapid increase in resistance. As an attempt to resolve these problem, application of Ni-P-PTFE to replace Ni undercoats was proposed, for which basic materials properties of Ni-P-PTFE coatings for preventing fretting corrosion was examined in this study. The Ni-P-PTFE coatings were formed by electroless Ni plating and PTFE coating followed by the heat-treatment. PTFE particles were found to be uniformly distributed in the Ni-P matrix. The Ni-P-PTFE coatings showed the excellent anti-adherent property with the contact angle of $104.3^{\circ}$, microhardness of 144.3 Hv comparable to that of Ni-P, and electric conductivity equivalent to that of Ni-P.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.25-27
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• 2005

Sn-9Zn solder balls were bonded to Cu and ENIG (Electroless Nickel/Immersion Gold) pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Sn-9Zn/ENIG, the shear strength remained nearly constant in spite of aging for 1000 hours at $150^{\circ}C$. On the other hand, in the case of the Sn-9Zn/Cu, the shear strength significantly decreased after aging at $150^{\circ}C$ for 100hours and then remained constant by further prolonged aging. Therefore, the protective plating layer such as ENIG must be used to ensure the mechanical reliability of the Sn-9Zn/Cu joint.

• Transactions of the Korean hydrogen and new energy society
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• v.3 no.2
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• pp.45-54
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• 1992

An applicability microencapsulation, using electroless copper plating, of hydrogen storage alloy powder as an anode material for nickel-hydrogen secondary batteries was investigated. Alloys employed were $LaNi_{4.7}Al_{0.3}$ and $MmNi_{4.5}Al_{0.5}$(Mm=mischmetal) which have an appropriate equilibrium pressure and capacity. The microencapsulation of the alloy powder was found to accelerate initial activation of electrodes and to increase capacity which is about 285mAh/g for $LaNi_{4.7}Al_{0.3}$. In addition, other charge and discharge characteristics, such as polarization and flatness of charge and discharge potential, were improved due to the role of copper layer as a microcurrent collector and an oxidation barrier of the alloy powder. $MmNi_{4.5}Al_{0.5}$ alloy showed lower capacity than $LaNi_{4.7}Al_{0.3}$ because of higher equilibrium pressure. Cyclic characteristics of both alloys were somewhat poor because of mainly shedding and partial oxidation of alloy powder during the cycling. However, it was considered that the microencapsulation method is effective to improve the performances of the hydrogen storage alloy electrodes.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.7
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• pp.298-304
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• 2003

IPMC(Ionic Polymer-Metal Composite) is a highly sensitive actuator that shows a large deformation in presence of low applied voltage. Generally, IPMC can be fabricated by electroless plating of platinum on both sides of a Nafion (perfluorosulfonic acid) film. When a commercial Nafion film is used as a base structure of the IPMC membrane, the micro-pump structure and the IPMC membrane are fabricated separately and then later assembled, which makes the fabrication inefficient. Therefore, fabrication of an IPMC membrane and the micro-pump structure on a single wafer without the need of assembly have been developed. The silicon wafer was partially etched to hold liquid Nafion to be casted and a 60-${\mu}{\textrm}{m}$ thick IPMC membrane was realized. IPMC membranes with various size were fabricated by casting and they showed 4-2${\mu}{\textrm}{m}$ displacements from $4mm{\times}4mm$ , $6mm{\times}6mm$, $8mm{\times}8mm$ membranes at the applied voltage ranging from 2Vp-p to 5Vp-p at 0.5Hz. The displacement of the fabricated IPMC membranes is fairly proportional to the membrane area and the applied voltage.

• Proceedings of the KAIS Fall Conference
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• 2004.06a
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• pp.69-71
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• 2004

새로운 기술인 Momentary mold surface heating(MmSH)은 기존의 사출성형법으로 제조된 Acrylonitrile Butadiene Styrene(ABS)의 단점을 개선한 사출성형법이다. MmSH로 제조된 ABS와 기존의 사출성형법으로 제조된 ABS의 도금특성을 도금욕 pH 변화에 따라 연구하였다. Sodium hypophosphite가 첨가된 무전해 Ni 도금욕의 PH가 증가할수록 도금 두께가 증가하였고 기존의 사출성형법으로 제조된 ABS의 경우 pH 5이상에서 4B의 밀착력을 가졌다. MmSH로 제조된 ABS의 경우 pH 6이상에서 5B인 12.3N/25mm 이상의 가장 우수한 밀착력을 나타내었다.