• Journal of Surface Science and Engineering
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• v.36 no.4
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• pp.317-323
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• 2003

The effect of additives such as complexing agents, stabilzers and boric acid on the bath stability and the deposition rate of electroless black Ni-Zn plating has been examined. The deposits obtained became black and showed an amorphous structure. The significant increasing in the deposition rate was not found when only glycine and citric acid were used as complexing agents. The deposition rate increased up to 3 and 4 times by adding malic acid and glycolic acid as an additional complexing agent, respectively. The stabilizers and the boric acid, however, had little influence on the deposition rate.

• Journal of Powder Materials
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• v.22 no.2
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• pp.134-137
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• 2015

The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Ni plating layer. The mean diamond particle sizes of 15, 23 and $50{\mu}m$ are used as thermal conductivity pathway for fabricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamond particles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their mean diameter. The thermal conductivity decrease with increasing measurement temperature up to $150^{\circ}C$ in all diamond size conditions. When the diamond particle size is increased from $15{\mu}m$ to $50{\mu}m$ (Max. 304 W/mK at room temperature) tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer.

• Journal of Surface Science and Engineering
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• v.48 no.5
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• pp.199-204
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• 2015

Recently, fuel cell is a good alternative for energy source. Separator is a important component for fuel cell. In this study, The surface of separator was modified for corrosion resistance and electric conductivity. Reduced graphene oxide (rGO) was made by Staudenmaier's method. Nickel, phosphorus and rGO were coated on 6061 aluminum alloy as a separator of proton exchange membrane fuel cell by composite electroless plating. Scanning electron microscope, energy-dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy were used to examine the morphology of Ni-P-rGO. Surface images were shown that the rGO was dispersed on the surface of Ni-P electroless plating, and nickel was combined with the un-reduced oxygen functional group of rGO.

• Applied Chemistry for Engineering
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• v.8 no.5
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• pp.742-748
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• 1997

Diamond films which have high hardness and thermal conductivity can be used to improve the performance of WC-Co as a cutting tool material. However, it is difficult to get such coatings of good uniformity and adhesiveness due to the surface characteristics of WC-Co. To get better coatings, some techniques, such as the surface treatment of substrate or the formation of interlayer between substrate and diamond film, have been tried. In the present work, the nickel interlayer is formed onto WC-Co by electroless Ni-P plating, which is introduced as a new method, and then diamond film is deposited on the interlayer. Formation and uniformity of three layers, i.e., substrate, electroless plate, and diamond film, and the adhesiveness of interlayers were studied. To investigate the effects of pretreatment on electroless plating, two different methods such as acid treatment and diamond powder treatment were used. The effects of heat treatment of the electroless plated surface on adhesiveness between the substrate and the interlayer were examined. It was found that as the temperature increases, the Ni crystals grow and then result in improved adhesiveness. Diamond film coatings of pure diamond phase were obtained at $800^{\circ}C$. It is concluded that the heat treated electroless Ni-P plating can be effectively used as a interlayer between WC-Co substrate and diamond film.

• Polymer(Korea)
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• v.25 no.2
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• pp.218-225
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• 2001

The electroless plating of a metallic nickel on PAN-based carbon fiber surfaces was carried out to improve mechanical interfacial properties of the carbon fiber/epoxy resin composites which were unidirectionally fabricated by a prepregging method. In this work, the influence of Ni-P alloy concentration showing brittle-to-ductile transition was investigated on interlaminar shear strength (ILSS) and impact strength of the composites. The surface properties of carbon fibers were also measured by X-ray photoelectron spectroscopy (XPS). As the result, the $O_{ls}$ /$O_{ls}$ ratio or Ni and P amounts were increased with increasing electroless nickel plating time but the ILSS were not significantly improved. However, the impact properties was significantly improved in the presence of Ni-P alloy in the carbon fiber surface, resulting in an increase of the ductility of the composites.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.37-45
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• 2004

Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and $13 wt.\%$P). A reaction between Sn penetrated through the channels among $Ni_3Sn_4$ IMCs and the P-rich layer ($Ni_3P$) of the Ni(P) film formed a $Ni_3SnP$ layer. Thickening of the $Ni_3SnP$ layer led to $Ni_3Sn_4$ spatting. After $Ni_3Sn_4$ spatting, the Ni(P) film directly contacted the molten solder and the $Ni_3P$ phase further transformed into a $Ni_2P$ phase. During the crystallization process, some cracks formed in the Ni(P) film to release tensile stress accumulated from volume shrinkage of the film.

• Textile Coloration and Finishing
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• v.22 no.1
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• pp.77-82
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• 2010

Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

• Transactions of Materials Processing
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• v.21 no.5
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• pp.330-335
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• 2012

Roll formed steel bolts are electrodeposited with Zn-Ni to protect themselves from corrosion. However, white storage stain or white rust(corrosion) is found on Zn-Ni electrodeposited surface of steel bolts when they are exposed to moisture. In this paper a new process is introduced to protect Zn-Ni electrodeposited steel bolt from white storage stain or white rust for a long time under the salt spray test and high humidity test conditions. The better corrosion resistance could be gotten by the additional process of Ni-P electroless deposition and heat treatment to conventional manufacturing method of Zn-Ni coated steel bolt. The corrosion resistance of Zn-Al powder slurry coated steel bolt showed better than that of Zn-Ni electrodeposited one.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.10-10
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• 2001

In this paper, initial depositing process of electroless Ni-Cu-P alloy was investigated by means of SEM, TEM and AES. The results show that the initial deposition is inhomogeneous and there exist different transition layers between different coatings and substrates, which are decided by the structures and compositions of the bath. For Ni-P binary alloy, its deposition takes place superiorly at grain boundary and on some grains with beneficial texture, the thickness of transition layer composed of Ni-Fe-P reaches 2000 angstrom. But during initiation of Ni-Cu-P trinary alloy, only at grain boundary is prIor to be deposited electrolessly, transited layer contains Ni-Fe-Cu-P and is decreased to about 500 angstrom. The structures of the films of Ni-P and Ni-Cu-P are crystalline at the initial depositing stage. The mechanisms of the process are put forward in this paper.

• Journal of Surface Science and Engineering
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• v.33 no.2
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• pp.126-134
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• 2000

This study investigated the bath compositions and plating conditions and crystal structure used for achieving nickel-thallium-phosphorus deposits by means electroless plating. The electroless nickel-thallium-phosphorus deposits were achieved with a bath using sodium hypophosphite as the reducing agent and sodium citrate as the complexing agent. The depositing rate was 10.5mg.$cm^{2-1}$ .$hr^{-1 }$ from the optimistic bath composition, 0.1M nickel sulfate, 0.005M thallium sulfate, 0.2M sodium hypophosphite, and 0.05M sodium citrat and the recommended plating conditions, pH 5.5 and $90^{\circ}C$. The composition of alloy deposits determined by X-ray analysis (EDS) that the Thallium was increased with major increasing concentration of complexing agent and thallium ion in bath solution, it decreased according to the increasing concentrations of reduction agent in the bath solution, Bit Phosphorus showed a contrary to the thallium. It was observed from X-ray diffraction analysis, Scanning Electron Microscopy and Transmission Electron Microscopy. The crystalline structure of deposits was amorphous at the first deposited state but it was changed $Ni-T1-Ni_{5}$ $P_2$ polycrystalline when subjected to 1 hour heat treatment of more than $350^{\circ}C$. TEM observation demonstrated that the microstructure was identical to the result of the XRD at as deposited but it became $Ni-Tl-Ni_{5}$ $P_2$ polycrystalline when heated. And grain size was 10-50nm.