• Journal of the Korean institute of surface engineering
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• v.21 no.1
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• pp.3-9
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• 1988

An electroless plating both for normal orientation of HCP-structure of Co-P to the film plane was developed. An ammonical succinate-citrate bath containg MnSo4, NiSO4 was studied Ni was codeposited into the films in order to decrease the saturation magentization (MS) since low Ms is necessary to decrease the magentizing fild. Mn was also codeposited to increase perpendicular orentaon of Co-P film. Effects on film composition and magnetic properties were studid in connection with follwing four factors such as concentration of NiSo4 and MnSo4, bath temp and pH.

• Polymer(Korea)
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• v.31 no.3
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• pp.184-188
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• 2007

Monodisperse PMMA/HDDA polymer particles were coated via electroless Ni plating using sodium hypophosphite as a reducing agent in an acidic environment. In this study, the effects of 1) the pretreatment conditions, 2) the plating temperature, 3) the plating pH, and 4) the initial pH, control of plating bath on the variation of plating rate, surface state of plated particles and plating reproducibility were investigated. It was observed that every pretreatment steps, especially conditioning and acceleration step, were very important for obtaining uniform Ni plating and the plating rate was increased with the increase of plating temperature and pH. Moreover, the initial pH control of plating bath was critical for the plating reproducibility.

• Journal of the Korean institute of surface engineering
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• v.19 no.3
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• pp.83-91
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• 1986

Codeposited of boron nitride(BN) particle dispersed into electroless nickel-phosphours (Ni-P) and nickel-boron(Ni-B) platings were studied for the purpose of developing the wear resistance and lubricity. BN can be codeposited from electroless nickel plating bath with $NaH_2PO_2$ and $NaBH_4$ as the reducing agents. Most dispersolids were distributed uniformly in the Ni-P and Ni-B matrix. Abrasion loss decreased with increasing amount of codeposits and reached a constant value 2.4 percent by volume percent of BN particle. The wear resistance and the friction coefficient of the heat treated BN composite coatings were improved about three times than that of as-coatings. The BN composite coatings were more wear resistance than hard chromium. Ni-B-BN composite coatings showed lower wear resistance and friction coefficient than Ni-P-BN. The BN content of the deposite was found to be 2.4 v/o for these optium conditions.

• Journal of the Korean institute of surface engineering
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• v.45 no.4
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• pp.162-167
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• 2012

Ni-P/C multi-layer was synthesized by electroless plating and paste coating for better corrosion and surface conductance as a metallic bipolar plate. The Ni-P layer could be synthesized with the range of 2.6~22.4 at.% P contents and it's surface morphology and corrosion resistance depend on content of P. Corrosion resistance of the Ni-P layer in sulfuric acid by electrochemical test is similar with pure Ni. Surface resistance of pure Ni after corrosion was increased about 8% compared to pure Ni. On the other hand, that of the Ni-P/C composite with 20% carbon content was increased only 1%.

• Journal of the Semiconductor & Display Technology
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• v.6 no.2 s.19
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• pp.25-28
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• 2007

Electroless Ni-P coating is widely used for chemical, electronic, and semiconductor equipment parts because of its corrosion resistance. The incorporation of chemically-inert PTFE particles into the Ni-P films improves properties such as, non-stick, anti-adhesive and better corrosion resistance. However, soft PTFE particles degrade the hardness, wear and abrasion resistance. In this study, effects of PTFE and W addition to the Ni-P-coatings were compared by the XRD, SEM, sheet resistance, contact angle, and microhardness measurements. The change in sheet resistance was negligible, but contact angle was doubled by the addition of PTFE and W. The microhardness was lower for Ni-P-PTFE, but higher for Ni-P-PTFE-W coatings, compared to that of Ni-P coatings.

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.11a
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• pp.45-45
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• 1993

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.80-81
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.27-36
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• 2007

In this study, we investigated the interfacial reactions between various Sn-Ag-Cu(SAC) solder alloys and ENIG(Electroless Ni Immersion Gold) and Cu-OSP(Organic Solderability Preservative) pad finish. In the case of the interfacial reaction between Sb added SAC solder and ENlf thinner P-rich Ni layer was formed at the interface. In the case of the interfacial reaction between Ni added SAC solder and Cu-OSP, the uniform $Cu_6Sn_5$, intermetallic compounds(IMCs) were formed and $Cu_6Sn_5$ grain did not grow after multiple reflows. Thinner $Cu_3Sn$ IMCs were farmed at the interface between $Cu_6Sn_5$ and Cu-OSP after $150^{\circ}C$ thermal aging.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.33.1-33.1
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• 2018

pH is expressed mathematically as $pH=-{\log}[H^+]$, is a measure of the hydrogen ion concentration, [$H^+$] to specify the acidity or basicity of an aqueous solution. The pH scale usually ranges from 0 to 14. Every aqueous solution can be measured to determine its pH value. The pH values below 7.0 express the acidity, above 7.0 are alkalinity and pH 7.0 is a neutral solution. The solution pH can be determined by indicator or by measurement using pH sensor, which measuring the voltage generated between a glass electrode and a reference electrode according to the Nernst Equation. The pH value of solutions depends on the temperature and the activity of contained ions. In nickel electroless plating process, the controlled pH value in some limited ranges are extremely important to achieve optimal deposition rate, phosphorus content as well as solution stability. Basically, nickel electroless plating solution contains of $Ni^{2+}ions$, reducing agent, buffer and complexing agents. The plating processes are normally carried out at $82-92^{\circ}C$. However, the change of its pH values with temperatures does not follow any rule. Thus, the purpose of study is to understand the relationship between pH and temperature of some based solutions and electroless nickel plating solutions. The change of pH with changing temperatures is explained by view of the thermal dynamic and the practical measurements.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.