• Journal of the Korean Ceramic Society
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• v.33 no.11
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• pp.1231-1236
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• 1996

The electrode resistance of semiconducting PTC BaTiO3 ceramic material was studied in some detail. Comme-rical In-Ag paste In-Ga alloy and electroless plated Ni as well as evaporated Al were chosen as electrode. The contact resistance of electroded samples were measured by both dc resistivity and ac impedance analysis. The aging effect on contact resistance under cyclic loading from -1$0^{\circ}C$ to 85$^{\circ}C$ was also monitored for the prolonged period of time. In case of Al electroded samples the heat treatment and protective coating had effects on the stability against contact resistance degradation. It was also found that the samples with commercial In-Ag paste and electroless plated Ni electrode had good properties of contact resistance against aging.

• Journal of the Korean Ceramic Society
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• v.28 no.2
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• pp.101-108
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• 1991

0.2 mo1% La doped BaTiO3 samples were prepared by a wet chemical process (Pechini process) and electrical conductivity were measured from annealing temperatures(800-110$0^{\circ}C$) to room temperature continuously. 2 probe I-V characteristics showed that Pt electrodes were non-ohmic below about 80$0^{\circ}C$ for Ladoped sample. I-V curves showed varistor behavior and breakdown voltages showed PTC-like behavior. AC complex impedance of 0.2 La and 0.05 Mn mo1% doped BaTiO3 samples with three different electrodes (electroless Ni, Pt, Ag electrodes) were measured with temperature variation. Complex impedance plots showed that the samples with electroless Ni electrodes have negligible electrode resistance. Samples with Ag or Pt paste electrodes showed large electrode resistance. PTC effect, which is defined as the ratio of maximum resistance to minimum resistance, was found to be less than 10 for 0.2 mo1% La doped dense sample however greater than 105 with codoping of 0.05 mo1% Mn and 0.2 mol% La.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1889-1892
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• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

• Journal of the Korean Magnetics Society
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• v.15 no.3
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• pp.202-206
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• 2005

The present investigation provides an electromagnetic radiation absorptive composition which comprises silver-coated ferrite microspheres dispersed in silicon rubber matrix for the aim of thin microwave absorber in GHz frequencies. Ni-Zn ferrite spheres with $50{\mu}m$ size in average were prepared by spray-drying and sintering at $1130^{\circ}C$. Conductive silver layer was plated on ferrite spheres by electroless plating. Conductive Ni-Zn ferrite sphere with uniform silver layer were obtained in the concentration of 10 g/L $AgNO_3$ per 20 g ferrite spheres. For this powder, electrical resistance is reduced as low as $10^{-2}\~10^{-3}\;\Omega$. The most sensitive material parameters with silver plating is real and imaginary parts of complex permittivity. The conductive Ni-Zn ferrite spheres have large values of dielectric constant. Due to this high dielectric constant of microspheres, matching thickness is reduced to as low as 2 mm at the frequency of 7 GHz, which is much thinner than conventional ferrite absorbers.

• Proceedings of the KAIS Fall Conference
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• 2002.11a
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• pp.243-245
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• 2002

ABS(Acrylonitrile Butadiene Styrene) 수지는 낮은 비중과 전기전도도, 가공성 등 우수한 물리적 성질을 갖는다. ABS 수지 제조방법인 Conventional process와 이를 개선한 MmSH(Momentary mold Surface Heating) injection process로 제조하여 나타나는 도금의 최적 조건을 연구하였다. 탈지, 에칭, Neutralization, Catalyzing, Accelerating의 전처리 과정을 거쳐 pH 변화에 따른 무전해 Ni 도금을 실시한 결과 각 수지 모두 pH7 이상에서 도금속도와 밀착력이 증가하였으나 MmSH injection process로 제작된 ABS 수지보다 Coventional process에서 제작된 ABS 수지의 밀착력이 우수한 경향이 나타났다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.113-113
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• 2011

알루미늄 박막 커패시터 제작을 위해 선택적인 알루미늄 etching과 anodizing을 이용한 유전체($Al_2O_3$) 형성, 전극층 형성을 위한 무전해 Ni-P 도금을 진행하였다. $5{\mu}m$ patterns/$10{\mu}m$ space를 가지는 dot patterns을 알루미늄 기판에 patterning하고, 이를 각각의 전류밀도 조건에서 etching한 후, barrier type anodizing을 진행하였다. 유전체에 전극층은 무전해 Ni-P 도금을 통해 형성하였으며, 이렇게 제작된 알루미늄 박막 커패시터 특성을 평가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.434-435
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• 2009

The crystalline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more. high-efficiency and low cost endeavors many crystalline silicon solar cells. the fabrication processes of high-efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/Ag contact, however, this contact formation processed by expensive materials. Ni/Cu contact formation is good alternative. in this paper, according to temperature Ni silicide makes, produced Ni/Cu contact solar cell and measured conversion efficiency.

• Journal of the Korean institute of surface engineering
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• v.45 no.4
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• pp.162-167
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• 2012

Ni-P/C multi-layer was synthesized by electroless plating and paste coating for better corrosion and surface conductance as a metallic bipolar plate. The Ni-P layer could be synthesized with the range of 2.6~22.4 at.% P contents and it's surface morphology and corrosion resistance depend on content of P. Corrosion resistance of the Ni-P layer in sulfuric acid by electrochemical test is similar with pure Ni. Surface resistance of pure Ni after corrosion was increased about 8% compared to pure Ni. On the other hand, that of the Ni-P/C composite with 20% carbon content was increased only 1%.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.59-59
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• 2004

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.94-95
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• 1999