• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.293-294
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• 2007

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• 전기화학회지
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• 제5권4호
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• pp.221-225
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• 2002

Assisted by the highly sensitive confocal microprobe Raman spectrometer and proper surface roughening procedure, the Raman investigation on the adsorption and reaction of methanol was performed on Pt-Ru electrodes with different coverages. A detailed description of the roughening process of the Pt electrodes and the underpotential deposition of the Ru was given. Reasonably good Raman signal reflecting the metal-carbon vibration and CO vibration was detected. The appearance of vibrations of the Ru oxides, together with the existence of Ru-C, Pt-C and CO bands, clearly demonstrates the participation of the bi-functional mechanism during the oxidation process of methanol on Pt-Ru electrodes. The Pt-Ru electrode was found to have a higher catalytic activity over Pt electrodes. This preliminary study shows that electrochemical Raman spectroscopy can be applied to the study of rough electrode surface.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.64-64
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• 2009

As the advanced packaging technology developing, Copper electro-plating processing has be wildly utilized in the semiconductor interconnect technique. Chemical solution monitoring methods, including PH and gravity measurement exist in industry, but economical and practical real-time monitoring has not been achieved yet. Red-green-blue (RGB) color sensor can successfully monitor the condition of $CuSO_4$ solution during electric copper plating process. Comparing the intensity variations of the RGB data and optical spectroscopy data, strong correlation between two in-situ sensors have shown.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.386.1-386.1
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• 2014

The ionic polymer-metal composite (IPMC), a type of electro-active polymer material, has received enormous interest in various fields such as robotics, medical sensors, artificial muscles because it has many advantages of flexibility, light weight, high displacement, and low voltage activation, compare to traditional mechanical actuators. Mostly noble metal materials such as gold or platinum were used to form the electrode of an IPMC by using electroless plating process. Furthermore, carbon-based materials, which are carbon nanotube (CNT) and reduced graphene-CNT composite, were used to alter the electrode of IPMC. To form the electrode of IPMC, we employ the synthesized graphene on copper foil by chemical vapor deposition method and use the transfer process by using a support of PET/silicone film. The properties of graphene were evaluated by Raman spectroscopy, UV/Vis spectroscopy, and 4-point probe. The structure and surface of IPMC were analyzed via field emission scanning electron microscope. The fabricated IPMC performance such as displacement and operating frequency was measured in underwater.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1280-1282
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• 1994

The method of passivation for protecting the $Hg_{l-x}Cd_xTe$ surface is important device fabrication process, because the surface components are highly reactive leading to its chemical and electrical instability. Especially, the material of which composition is x=0.2 or 0.3, is narrow bandgap semiconductor and used as detector of infrared radiation. The device performance of narrow bandgap semiconductors are largely governed by the properties of the semiconductor surface. The electro-chemical processing of $Hg_{l-x}Cd_xTe$ allows rigorous control of the surface chemistry and provides an in-situ monitor of surface reaction. So electro-chemical reduction at specific potential can selectively eliminate the undesirable species on the surface and manipulated to reproducibly attain the desired stoichiometry. This method shows to assess the quality or chemically treated $Hg_{l-x}Cd_xTe$ good surface.

• 공업화학
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• 제29권1호
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• pp.117-121
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• 2018

하폐수 고도산화처리(AOP, advanced oxidation process) 중 하나인 펜톤산화법과 전기화학적 방법을 결합한 전기펜톤산화법의 cathode에 stainless steel mesh (SUS mesh)를 적용하였다. 난분해성 물질인 염료 methylene blue (MB) 용액에 대해서, SUS mesh의 표면 처리 및 산화철 코팅 여부에 따라 전기펜톤산화 처리의 효율이 어떻게 달라지는지를 비교, 분석하였다. MB분해 반응의 효율 비교를 통해 mesh 표면에 코팅된 산화철의 양이 많을수록 전극의 촉매 특성이 높아짐을 확인하였고, 이는 전극표면에서 in situ로 발생하는 과산화수소의 발생량이 높아지는 것과 연관이 있었다. 전류-전위 순환법(CV)을 통해 개발된 전극의 전기화학적 특성을 평가해 본 결과, mesh 표면에 코팅된 산화철의 양이 많을수록 전기화학적 산화-환원 특성 또한 개선되었고, 이것이 우수한 전기펜톤산화 전극으로서의 성능과 밀접한 관계가 있음을 확인하였다.

• 한국산학기술학회논문지
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• 제16권3호
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• pp.2314-2320
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• 2015

MBR (Membrane Bio-Reactor) 공정은 막 오염을 해결하기 위해 막대한 에너지 소비를 하는 공정으로 알려져 있다. 이를 해결하기 위한 일환으로 전기응집 기술을 MBR에 적용하는 시도가 보고되고 있다. 본 연구에서는 전류밀도를 변화시켜가며 활성슬러지의 막 여과를 수행하여 전기응집이 막 오염 저감에 미치는 영향과 메커니즘을 파악하고자 하였다. 활성슬러지 혼합액을 전기응집한 후 회분식교반셀로 분리 막의 여과성능을 평가하였다. 전류밀도(A/m2)를 10에서 40으로 증가시켰을 때 총 오염 저항 (Rc+Rf) 값이 18%에서 79%까지 감소하여 전기응집으로 인해 분리 막의 여과성능이 향상됨을 확인할 수 있었다. 전기응집 전후로 유기물 농도와 활성슬러지 입도분포 변화는 거의 일어나지 않았다. 여과 성능의 향상은 수산화알루미늄, Al(OH)3이 생성되어 막 표면에 부착되면서 오염물질이 쌓이게 됨을 방지하는 역할, 즉 dynamic membrane 으로 작용하였기 때문인 것으로 판단되었다.

• Korean Chemical Engineering Research
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• 제52권6호
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• pp.768-774
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• 2014

황-요오드(Sulfur-Iodine, SI) 공정은 물을 분해시켜 수소를 생산하는 열화학 공정으로 공정에 사용되는 황과 요오드는 재순환된다. SI 공정 중 요오드가 분리 순환되는 Section III에서는 공정 효율 개선을 위해 다양한 방법이 개발되고 있다. EED(electro-electrodialysis)를 이용한 방법은 추가적인 화합물이 필요하지 않는 공정으로 Section III의 효율을 높일 수 있으나 공정 흐름에 포함된 요오드에 의해 상당한 부하가 걸리게 된다. 이를 해결하기 설계를 위한 기초 자료 제거 공정으로 결정화 방법이 고려되고 있다. 본 연구에서는 요오드 결정화 반응기 설계를 위한 기초 자료 확보를 위해 $I_2$ 포화 $HI_x$ 용액에서 요오드 결정의 침강 속도를 모델링 하였다. $HI_x$ 용액 조성은 열역학 모델인 UVa를 이용하여 결정하였으며 용액 물성은 순수한 물성들과 상관관계식을 활용하여 추산하였다. Multiphysics 전산툴을 이용하여 침강에 따른 속도 변화를 계산하였으며 요오드 직경과 온도에 따른 변화를 추산하였다. 직경(1.0~2.5 mm)과 온도($10{\sim}50^{\circ}C$) 범위에서 요오드는 0.5 m/s 내외의 종말 속도를 보이며 이 속도는 용액의 점도 보다 밀도에 더 크게 영향을 받는 것으로 나타났다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.212-215
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• 2002

Interfacial evaluation and damage sensing of the carbon fiber/epoxy-amine terminated (AT)-polyetherimide (PEI) composites were performed using micromechanical test and electrical resistance measurement. As AT-PEI content increased, the fracture toughness of epoxy-AT-PEI matrix increased, and thus their interfacial shear strength (IFSS) was improved due to the improved toughness. After curing process, the changes in electrical resistance (ΔR) with increasing AT-PEI contents increased gradually because of the changes in thermal expansion coefficient (TEC) and thermal shrinkage of matrix. Matrix fracture toughness was correlated to the IFSS, residual stress and electrical resistance. The results obtained from the electrical resistance measurement during curing process, reversible stress/strain, and durability test were consistent with modified matrix toughness properties.