• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.33-38
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• 2007

본 실험에서는 Non-Conductive Adhesive (NCA) 와 고분자 범프를 이용한 COG (Chip-on-glass) 접합에 대하여 연구하였다. 산화막이 증착된 Si 기판 위에 고분자 범프를 사진식각 방법으로 형성하고, 고분자 범프 위에 직류 마그네트론 스퍼터링 방법으로 금속 박막층을 증착하였다. 기판으로는 Al을 증착한 유리기판을 사용하였다. 두 종류의 NCA를 사용하여 $80^{\circ}C$에서 하중을 변화시켜가며 접합을 실시하였다. 접합부의 특성을 평가하기 위하여 4단자 저항 측정법을 이용하여 접합부의 접속 저항을 측정하였으며, 주사전자현미경을 이용하여 접합부를 관찰하였다. 신뢰성은 $0^{\circ}C$ 와 $55^{\circ}C$ 사이에서 열충격 실험을 2000회까지 실시하여 평가하였다. 신뢰성 측정 전 접합부의 저항 값은 $70-90m{\Omega}$을 나타내었다. 200MPa 이상의 접합 압력에서는 고분자 범프가 NCA 의 필러 파티클에 의해 손상된 것을 관찰하였다. 신뢰성 측정 후 일부 범프가 fail 되었는데 범프의 fail 원인은 범프의 윗부분보다 상대적으로 금속층이 얇게 증착된 범프의 모서리 부분의 금속층의 끊어졌기 때문이었다.

• Journal of Welding and Joining
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• 제23권2호
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• pp.18-22
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• 2005

전자패키징을 포함한 마이크로시스템 패키징의 재료 및 어셈블리 기술에 관련한 도전성 접착제 및 접속 기술을 개략적으로 소개하였다. 이와 같은 도전성 접착제 및 접속 기술은 종래 사용되어 왔던 Pb 솔더의 환경, 인체에의 악영향 등으로 인한 무연(Pb-free) 솔더의 개발과 함께 차세대 솔더의 대체 재료 및 접속 기술로서 주목받고 있다. 도전성 접착제는 이미 반도체 집적회로를 기판에 접합하는 등 널리 사용되고 있지만 최근 도전성 접착제에 대한 수요와 시장 규모가 증가하는 추세이며 더 나아가 그 응용 범위가 점차로 확대되어 가고 있다. 특히 국제적 규약에 의한 무연 솔더의 사용이 의무화됨에 따라 전기적 접속성, 열 도전성, 접합성 등 기본 솔더에 버금가는 특성을 확보하기 위한 새로운 재료의 개발 및 공정에 대한 연구가 필요하다. 선진국에서는 이러한 기술의 필요성을 인식하고 많은 연구 인력, 시설 및 정보 공유 등을 통해 활발한 투자와 연구개발이 진행되고 있다. 이에 한국에서도 국제 경쟁력을 향상시키고 차세대 첨단 산업 분야의 신기술 확보를 위해 체계적인 연구 활동을 위한 노력이 절실히 요구된다.

• Journal of Welding and Joining
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• 제34권1호
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• pp.59-67
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• 2016

The automotive manufactures increase their use of lightweight materials to improve fuel economy and energy usage has a significant influence on the choice of developing materials. To meet this requirements manufacturers are replacing individual body parts with lightweight metals, for these the process treating and painting surfaces is changing. The pre-coated steels are newly developed to avoid the conventional complex and non-environmental painting process in the body-in-white car manufacturing. The development of new joining techniques is critically needed for pre-coated steel sheets, which are electrically non-conductive materials. In the present study, dissimilar combination of pre-coated steel and galvanized steel sheets were joined by the self-piercing rivet, adhesive bonding and hybrid joining techniques. The tensile shear test and free falling high speed crash test were conducted to evaluate the mechanical properties of the joints. The highest tensile peak load with large deformation was observed for the hybrid joining process which has attained 48% higher than the self-piercing rivet. Moreover, the hybrid and adhesive joints were observed better strain energy compared to self-piercing rivet. The fractography analyses were revealed that the mixed mode of cohesive and interfacial fracture for both the hybrid and adhesive bonding joints.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

• Current Photovoltaic Research
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• 제11권3호
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• pp.75-78
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• 2023

Recently, the installation of photovoltaic modules in urban areas has been increasing. In particular, the demand for solar modules installed in a limited space is increasing. However, since the crystalline silicon solar module's size is proportional to the solar cell's size, it is difficult to manufacture a module that can be installed in a limited area. In this study, we fabricated a solar module with a shingled design that can control horizontal and vertical width using a bi-directional laser scribing method. We fabricated a string cell with a width of 1/5 compared to the existing shingled design string cells using a bi-directional laser scribing method, and we fabricated a solar module by connecting three strings in parallel. Finally, we achieved a conversion power of 5.521 W at a 103 mm × 320 mm area.

• Current Photovoltaic Research
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• 제10권1호
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• pp.1-5
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• 2022

Bifacial photovoltaic (PV) technology has received considerable attention in recent years due to the potential to achieve a higher annual energy yield compared to its monofacial PV systems. In this study, we fabricated the bifacial c-Si PV module with a shingled design using the conventional patterned bifacial solar cells. The shingled design PV module has recently attracted attention as a high-power module. Compared to the conventional module, it can have a much more active area due to the busbar-free structure. We employed the transparent backsheet for a light reception at the rear side of the PV module. Finally, we achieved a conversion power of 453.9 W for a 1300 mm × 2000 mm area. Moreover, we perform reliability tests to verify the durability of our Shingled Design Bifacial c-Si Photovoltaic module.

• 한국표면공학회지
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• 제57권1호
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• pp.49-56
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• 2024

Superhydrophobic surfaces have been expected to be able to provide considerable performance improvements and introduce innovative functions across diverse industries. However, representative methods for fabricating superhydrophobic surfaces include etching the substrate or attaching nanosized particles, but they have been limited by problems such as applicability to only a few materials or low adhesion between particles and substrates, resulting in a short lifetime of superhydrophobic properties. In this work, we report a novel coating technique that can achieve superhydrophobicity by electrophoretic deposition of aluminum nitride (AlN) nanopowders and their self-bonding to form a surface structure without the use of binder resins through a hydrolysis reaction. Furthermore, by using a water-soluble adhesive as a temporary shield for the electrophoretic deposited AlN powders, hierarchical aluminum hydroxide structures can be strongly adhered to a variety of electrically conductive substrates. This binder-free technique for creating hierarchical structures that exhibit strong adhesion to a variety of substrates significantly expands the practical applicability of superhydrophobic surfaces.

• Composites Research
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• 제33권4호
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• pp.228-233
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• 2020

본 논문은 유리섬유강화 복합재료(GFRC)를 사용하여 단일 랩 전단 시험을 진행하고, 단일 랩 전단 시험을 진행하면서 연필심을 이용한 종이센서(PLDPS)를 적용하였다. 복합재료의 접착은 비스페놀-A계 에폭시와 아민계 경화제를 혼합하여 접착제로 사용하였다. 접착물성의 차이를 주기 위해 각기 다른 조건에서 경화시켰고 물성이 달라진 것을 확인하였다. 연필심을 이용한 종이센서는 A4용지에 4B연필을 사용하여 제작하였다. 연필에 있는 흑연은 전기가 통하는 물질이므로 전기저항을 측정할 수 있다. 연필심을 이용한 종이센서에 단일 랩 전단 시편에 붙은 위치에 따라 전기저항의 변화를 관찰하였고, 붙이는 두 위치에 따라 전기저항의 변화가 다르게 나오는 것을 확인하였다. 또한, 랩 전단변형률에 따라서 전기 저항의 변화도 관찰하였다. 랩 전단변형률이 높으면 전기 저항 변화도 큰 것을 확인했다. 접착부분의 변형이 클수록 시편이 휘는 정도도 커져 전극 사이의 거리변화도 크게 만들기 때문이다.

• 신재생에너지
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• 제16권3호
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• pp.1-12
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• 2020

Shingled technology is the latest cell interconnection technology developed in the photovoltaic (PV) industry due to its reduced resistance loss, low-cost, and innovative electrically conductive adhesive (ECA). There are several advantages associated with shingled technology to develop cell to module (CTM) such as the module area enlargement, low processing temperature, and interconnection; these advantages further improves the energy yield capacity. This review paper provides valuable insight into CTM loss when cells are interconnected by shingled technology to form modules. The fill factor (FF) had improved, further reducing electrical power loss compared to the conventional module interconnection technology. The commercial PV module technology was mainly focused on different performance parameters; the module maximum power point (Pmpp), and module efficiency. The module was then subjected to anti-reflection (AR) coating and encapsulant material to absorb infrared (IR) and ultraviolet (UV) light, which can increase the overall efficiency of the shingled module by up to 24.4%. Module fabrication by shingled interconnection technology uses EGaIn paste; this enables further increases in output power under standard test conditions. Previous research has demonstrated that a total module output power of approximately 400 Wp may be achieved using shingled technology and CTM loss may be reduced to 0.03%, alongside the low cost of fabrication.

• 한국전기전자재료학회논문지
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• 제31권5호
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• pp.295-299
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• 2018

In this work, we conducted a study on cell strings of high efficiency and high power solar cell modules via simulation. In contrast to the conventional module manufacturing method, the simulation was performed by connecting cutting cells divided into four parts from 6-in size using the electrically conductive adhesive (ECA). The resistance of the ECA added in series connection was extracted using an experimental method. This resistance was found to be $3m{\Omega}$. Based on this simulation, we verified the change in efficiency of the string as a function of the number of cutting cell connections. Consequently, the cutting cell efficiency of the first 20.08% was significantly increased to 20.63% until the fifth connection; however, for further connections, it was confirmed that the efficiency was saturated to 20.8%. Connecting cutting cells using ECA improves the efficiency of the string; therefore, it is expected that it will be possible to fabricate modules with high efficiency and high power.