• Transactions on Electrical and Electronic Materials
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• v.17 no.3
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• pp.155-158
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• 2016

The effect of microsilica content modified with silicone-modified epoxy on electrical and mechanical properties of cycloaliphatic epoxy/microsilica system was investigated. The cycloaliphatic epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was an anhydride. Surface of microsilica was modified with silicone-modified epoxy. Electrical breakdown strength, the most important property for electrical insulation materials was tested. Tensile and flexural tests were also performed using universal testing machine (UTM). The microcomposite with 60 wt% microsilica shows maximum values in electrical breakdown strength.

• Journal of Electrical Engineering and Technology
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• v.11 no.6
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• pp.1783-1786
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• 2016

The paper investigates the insulation properties of the supercritical $CO_2$ ($SCCO_2$) fluid as an insulating medium for electrical apparatuses. The insulating material is crucial for electrical apparatuses and $SF_6$ gas has been widely used for high power electrical apparatuses. There have been many research efforts to develop substituents for $SF_6$ gas because of high global warming potential. We obtained above 350 kV/mm insulation strength with 12.0 MPa $SCCO_2$. The positive and negative IEC standard pulses are applied between two 10 mm diameter spherical electrodes. The insulation strength of $SCCO_2$ is at least 2.5 times higher than that of $CO_2$ gas at 6.0MPa. The insulation strength of $SCCO_2$ fluid is about 10 times higher than that of $SF_6$ at 0.5MPa which is the ordinary operating pressure of electrical switchgears. Using the result, we expect that the time for switching and dielectric recovery could be reduced using $SCCO_2$ fluid as an insulating medium.

• Transactions on Electrical and Electronic Materials
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• v.7 no.2
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• pp.81-86
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• 2006

In this paper, the response surface modeling of the control of the pretilt angle in the nematic liquid crystal on the homogeneous polyimide surface with different surface treatment is investigated. The pretilt angle is one of the main factors to determine the alignment of the liquid crystal display. The pretilt angle is measured to analyze the variation of the characteristics on the various process conditions. The rubbing strength and the hard baking temperature are considered as input factors. After the design of experiments is performed, the process model is then explored using the response surface methodology. The analysis of variance is used to analyze the statistical significance and the effect plots are also investigated to examine the relationship between the process parameters and the response.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• Korean Journal of Materials Research
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• v.14 no.1
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• pp.73-77
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• 2004

The mechanical and electrical properties of $Cu-TiB_2$ composites prepared by hot extrusion and cold drawing according to the variation of $TiB_2$ contents and the size of $TiB_2$ particle have been studied. The experimental results showed that the electrical conductivity was decreased with increasing the $TiB_2$ content, and their tensile strength and hardness increased inversely. In the case of the same content of $TiB_2$ particle, the smaller $TiB_2$ particle, the higher their mechanical properties. The electrical conductivity of $Cu-TiB_2$ composites showed more than 70%IACS. Their yield strength and hardness were more than 120 MPa and HRB 60～70, respectively.

• Journal of The Korean Astronomical Society
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• v.8 no.1
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• pp.29-34
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• 1975

Solar electrical conductivity has been calculated, making use of Yun and Wyller's formulation. The computed results arc presented in a tabulated form as functions of temperature and pressure for given magnetic field strengths. The results of the calculation show that the magnetic field does not play any important role in characterizing the electrical conductivity of the ionized gas when the gas pressure is relatively high (e.g., $P{\geq}10^4\;dynes/cm^2$). However, when the gas pressure is low (e.g., $P{\leq}10\;dynes/cm^2$), the magnetic field becomes very effective even if its field strength is quite small (e.g., $B{\leq}0.01$ gauss). It is also found that, except for lower temperature region (e.g., $T{\leq}10^{4^{\circ}}K$), there is a certain linear relationship in a log- log graph between the pressure and the critical magnetic field strength, which is defined as a field strength capable of reducing the non-magnetic component of the electrical conductivity by 20%.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.98-101
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• 2011

A 10 nm nano-silica was introduced to a conventional 3 ${\mu}M$ micro-silica composite to develop an eco-friendly new electric insulation material for heavy electric equipment. Thermal and mechanical properties, such as glass transition temperature (Tg), dynamic mechanical analysis, tensile and flexural strength, were studied. The mechanical results were estimated by comparing scale and shape parameters in Weibull statistical analysis. The thermal and mechanical properties of conventional epoxy/micro-silica composite were improved by the addition of nano-silica. This was due to the increment of the compaction via the even dispersion of the nano-silica among the micro-silica particles.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1480-1481
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• 2008

In this paper, we present surface treatments for achieving bonds between PMMA and PDMS substrates. Silane primer is used for the formation of hydroxyl group on PMMA surfaces. The formed hydroxyl groups enhance the bonding strength of PDMS-PMMA substrates without channel clogging and structure deformation. The bonding strength on the different surface treatments (include oxygen plasma, 3-APTES, and corona discharge) is evaluated to find optimal bonding condition. The maximum bonding strength at the optimal surface treatment is over 300 kPa. The surface treatment using silane primer can be used to the bonding process of Micro-TAS and Lab-on-a-Chip.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.191-194
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• 2005

Evaluating methods of the polar and/or azimuthal anchoring strength coefficients by means of the renormalized transmission spectroscopic ellipsometry are demonstrated. The Anchoring strength coefficients can be evaluated from the measurement of ellipsometric parameters measured by the oblique incident transmission ellipsometry, where the effect of multiplebeam interference is eliminated. The device parameters such as the pretilt angle and cell gap can be determined simultaneously even in the case of the twisted nematic liquid crystal sample cells.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.544-547
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• 1999

To develop the better insulants. the zeolite particle, which is aluminosilicate mineral, was filled In the DGEBA/MDA/SN epoxy resin system. Dynamic DSC curves of cured specimens with various contents of zeolite were observed and the glass transition temperature(T$_{g}$) was obtained. According to this result, we could carry out the experiment concerned with the dielectric breakdown strength around T$_{g}$ and find the limit temperature for the application of the DDEBA/MDA/SN system filled with natural zeolite. T$_{g}$ increased with the content of zeolite. As the temperature increased, the dielectric breakdown strength decreased rapidly, in the region of T$_{g}$. At the high temperature, the deterioration by electrical stress was activated. The diameter of puncture at the high temperature was larger 7han that at the room temperature.erature.