• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.21 no.3
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• pp.129-135
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• 2021

Switched Reluctance Motor (SRM) has a characteristic that the inductance changes very nonlinearly depending on the magnitude of the current and the relative position of the rotor and stator, and the torque is generated In consideration of these problems, many studies have been conducted on a topology for driving that can improve efficiency and performance in an existing asymmetric bridge converter in order to simplify the circuit and economic efficiency. Therefore, in this paper, we want to check the performance by comparing and analyzing each converter used by applying it as a topology for SRM driving. The driving converters applied to the comparison and analysis are Conventional C-dump, Modified C-dump, Energy efficient C-dump, Resonant C-dump converter with C-dump converter type structure and the most widely used asymmetric bridge converter and 6-Switch inverter that used for general motors.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.237-242
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• 2011

The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

• Korean Journal of Metals and Materials
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• v.50 no.9
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• pp.685-690
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• 2012

Decalcomania is a new method for SOFCs (solid oxide fuel cells) unit cell fabrication. A tight and dense $5{\mu}m$ Yttria-stabilized zirconia (8YSZ) electrolyte layer on anode substrate was fabricated by the decalcomania method. After 8YSZ as the electrolyte starting material was calcined at $1200^{\circ}C$, the particle size was controlled by the attrition mill. The median particle size (D50) of each 8YSZ was $39.6{\mu}m$, $9.30{\mu}m$, $6.35{\mu}m$, and $3.16{\mu}m$, respectively. The anode substrate was coated with decalcomania papers which were made by using 8YSZ with different median particle sizes. In order to investigate the effect of median particle sizes and sintering conditions on the electrolyte density, each sample was sintered for 2, 5 and 10 h, respectively. 8YSZ with a median particle size of $3.16{\mu}m$ which was sintered at $1400^{\circ}C$ for 10 had the highest density. With this 8YSZ, a SOFCs unit cell was manufactured with a $5{\mu}m$ layer by the decalcomania method. Then the unit cell was run at $800^{\circ}C$. The Open Circuit Voltage (OCV) and Maximum power density (MPD) was 1.12 V and $650mW/cm^2$, respectively.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• The Journal of the Korea institute of electronic communication sciences
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• v.17 no.1
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• pp.71-76
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• 2022

Since brightness is proportional to the operating current, a method of connecting several LEDs in series and driving with a constant current source is widely used for driving circuits of LED lights. Because several LEDs are connected in series, if some LEDs open due to a fault, the current path is broken and all other LEDs connected in series are turned off. In this paper, we designed a circuit to solve this problem by connecting a Zener diode having a breakdown voltage of about 0.4V higher than the LED operating voltage in parallel with each LED to create a current bypass in case of LED failure. Through simulations and experiments, it was confirmed that the current of the Zener diode hardly flows when the LED is operating normally, and that the Zener diode stably operates as a current bypass when the LED fails.

• Composites Research
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• v.35 no.2
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• pp.69-74
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• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

• Journal of IKEEE
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• v.26 no.2
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• pp.211-218
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• 2022

This paper presents a S-band phased array antenna system for receiving LEO satellite telemetry signals. The proposed antenna, which is performed to be beam-tiled along the elevation direction, consists of 16 sub-array assemblies, 16 active circuit modules, a perpendicular feed network and a control/power unit. In order to precisely track an LEO satellite, the developed antenna is placed with its elevation axis along the projected trajectory of the satellite on the earth. The center of antenna aperture is facing to the maximum elevation angle in the LEO trajectory. The beam-tilted angles for tracking LEO satellite are obtained by calculating accurately satellite points. Satellite tracking measurements are carried out in the range of ±30° with the respect to the maximum elevation angle. The S/N ratio of 16.5 dB and the Eb/No of 13.3 dB at the maximum elevation angle are obtained from the measurements. The measured result agrees well with the pre-analyzed system margin.

• Journal of Sensor Science and Technology
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• v.31 no.4
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• pp.249-254
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• 2022

To achieve high-performance colloidal quantum dot light-emitting diodes (QD-LEDs), the use of a densely packed QD film is crucial to prevent the formation of leakage current pathways and increase in interface resistance. Spin coating is the most common method to deposit QDs; however, this method often produces pinholes that can act as short-circuit paths within devices. Since state-of-the-art QD-LEDs typically employ mono- or bi-layer QDs as an emissive layer because of their low conductivities, the use of a densely packed and pinhole-free QD film is essential. Herein, we introduce the Langmuir-Blodgett (LB) technique as a deposition method for the fabricate densely packed QD films in QD-LEDs. The LB technique successfully transfers a highly dense monolayer of QDs onto the substrate, and multilayer deposition is performed by repeating the transfer process. To validate the comparability of the LB technique with the standard QD-LED fabrication process, we fabricate and compare the performance of LB-based QD-LEDs to that of the spin-coating-based device. Owing to the non-destructiveness of the LB technique, the electroluminescence efficiency of the LB-based QD-LEDs is similar to that of the standard spin coating-based device. Thus, the LB technique is promising for use in optoelectronic applications.

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2444-2452
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• 2022

The field-programmable gate array (FPGA) is gaining popularity in industrial automation such as nuclear power plant instrumentation and control (I&C) systems due to the benefits of having non-existence of operating system, minimum software errors, and minimum common reason failures. Separate functions can be processed individually and in parallel on the same integrated circuit using FPGAs in comparison to the conventional microprocessor-based systems used in any plant operations. The use of FPGAs offers the potential to minimize complexity and the accompanying difficulty of securing regulatory approval, as well as provide superior protection against obsolescence. Wireless sensor networks (WSNs) are a new technology for acquiring and processing plant data wirelessly in which sensor nodes are configured for real-time signal processing, data acquisition, and monitoring. ZigBee (IEEE 802.15.4) is an open worldwide standard for minimum power, low-cost machine-to-machine (M2M), and internet of things (IoT) enabled wireless network communication. It is always a challenge to follow the specific topology when different Zigbee nodes are placed in a large network such as a plant. The research article focuses on the hardware chip design of different topological structures supported by ZigBee that can be used for monitoring and controlling the different operations of the plant and evaluates the performance in Vitex-5 FPGA hardware. The research work presents a strategy for configuring FPGA with ZigBee sensor nodes when communicating in a large area such as an industrial plant for real-time monitoring.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.22 no.5
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• pp.111-116
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• 2022

The causes of motor burnout include overload, phase loss, restraint, interlayer short circuit, winding ground fault, instantaneous overvoltage, and the rotor contacting the stator, leading to insulation breakdown, leading to breakdown or electrical accidents. Therefore, equipment failure causes not only loss due to cost required for equipment maintenance/repair, but also huge economic loss due to productivity decrease due to process stop because the process itself including the motor is stopped. The current level of technology for diagnosing motor failures uses vibration, heat, and power analysis methods, but there is a limit to analyzing the problems only after a considerable amount of time has passed according to the failure. Therefore, in this paper, a device and algorithm for measuring insulation resistance using DC AMP signal was applied to an industrial motor to solve this problem. And by following the insulation resistance state value, we propose a diagnosis of deterioration and failure of the motor that cannot be solved by the existing method.