• 제목/요약/키워드: Electric current-induced kinetic enhancement

검색결과 1건 처리시간 0.015초

통전압접을 활용한 알루미늄 소재 간 고상접합에 관한 연구 (Study on Electrically Assisted Pressure Solid State Joining Between Aluminum Alloys)

  • 최호욱;이시환;김이재;홍성태;한흥남
    • 소성∙가공
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    • 제31권6호
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    • pp.337-343
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    • 2022
  • Electrically assisted pressure joining (EAPJ) utilizes electric current-induced kinetic enhancement to achieve solid state diffusion bonding within a short time. In this study, aluminum alloy specimens, which are known as a hard-to-weld metal, were successfully solid-state joined through EAPJ. The bonding process was performed in two ways: continuous direct current (CDC), which applies relatively low current density, and pulsed direct current (PDC), which applies high current density. It was observed that the bonding strength was higher in PDC than in CDC. The microstructure of the joint was characterized using 3D X-ray microscopy (XRM) and electron backscatter diffraction (EBSD).