• 한국재료학회:학술대회논문집
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• 한국재료학회 2002년도 춘계 학술발표강연 및 논문개요집
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• pp.86-86
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• 2002

• 한국재료학회:학술대회논문집
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• 한국재료학회 2002년도 춘계 학술발표강연 및 논문개요집
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• pp.85-85
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• 2002

• 한국재료학회:학술대회논문집
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• 한국재료학회 2001년도 춘계학술발표강연 및 논문개요집
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• pp.131-131
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• 2001

• 한국재료학회:학술대회논문집
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• 한국재료학회 1992년도 춘계학술발표회
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• pp.21-22
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• 1992

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 2003년도 춘계학술발표대회 요약집
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• pp.233.2-233.2
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• 2003

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2002년도 추계학술강연 및 발표대회
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• pp.13-14
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• 2002

• Journal of Welding and Joining
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• 제32권1호
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• pp.66-70
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• 2014

In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

• 한국주조공학회지
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• 제13권6호
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• pp.555-562
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• 1993

A study was investgated the relationship between fracture characteristics and microstructure changes according to Cu addition and heat treatment methods on the ductile cast iron. According to increment of Cu addition pearlite volume fraction was increased due to the deffect of anti-ferritizing of Cu. At the case of austempering heat treatment, fracture toughness of Cu contained specimen was decreased. The reason for the results seems to be responsible for decrement of plastic zone size at the crack tip. It was observed that the excellent fracture toughness can be obtained at the condition of normalizing and the specimen was not contained Cu. Under the such conditions, fractographs is composed of dimple pattern and fracture toughness 71.6MPa $\sqrt{m}$, tensile strength determined as the value of 961.6MPa, respectively.

• 한국재료학회지
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• 제8권11호
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• pp.1043-1047
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• 1998

CuO 및 C얘의 첨가가 $BiNbO_4$ 세라믹스의 고주파 유전특성에 미치는 영향을 조사하였다. CdO 첨가량이 증가함에 따라 소결밀도 및 품질계수는 감소하였고 소결온도가 증가하면 유전상수 및 품질계수는 증가하였다. $BiNbO_4$에 CuO 및 CdO를 각각 0.03wt% 첨가한 시편을 $960^{\circ}C$에서 소결시 유전율 41.2, 품질계수($Q{\times}f_0$) 6,500(at 5.6GHz), 공진주파수 온도계수 $3ppm^{\circ}C$의 우수한 고주파 유전특성을 얻을 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.162-165
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• 2003

The corrosion characteristics of diffusion barrier in Copper CMP has been investigated. Key experimental variables that has been investigated are the corrosion rate by different agents containing slurry of Cu CMP. Whenever Cu and Ta films were corroded adding each oxidizer, the corrosion rate of Ta was much lower than that of Cu. That is, the difference in the corrosion rates of Ta by oxidizer was not larger as compared with Cu. As corroded by complexing agents, the corrosion rate of Ta was close to O. The corrosion rate of Ta increased as added $HNO_3$ and $CH_3COOH$ compared with the reference slurry; on the other hand, it decreased with addition of HF. In addition, resulting corrosion rate went up with lower pH of agent. The corrosion rates by agents were however significant small; hence, it doesn't affect on the removal rate of Cu CMP practically. Consequently, this can be explained by assuming that the mechanical effect dominates than the chemical effect on the polishing rate of Ta(TaN).