• 제목/요약/키워드: Edge Crack

검색결과 338건 처리시간 0.028초

New formulation for vibration analysis of Timoshenko beam with double-sided cracks

  • Ayatollahi, M.R.;Hashemi, R.;Rokhi, H.
    • Structural Engineering and Mechanics
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    • 제34권4호
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    • pp.475-490
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    • 2010
  • It is the intention of this study to synthesize the effects of double-edge cracks on the dynamic characteristics of a beam. The stiffness matrix is first determined for a Timoshenko beam containing two same-line edge cracks. The presented model is then developed for elements with two parallel double-sided cracks, considering the interaction between the stress fields of adjacent cracks. Finally, a finite element code is implemented, to examine the influence of depth and location of double cracks, on the natural frequencies of the damaged system.

반도체 패키지의 내부 결함 검사용 알고리즘 성능 향상 (The Performance Advancement of Test Algorithm for Inner Defects in Semiconductor Packages)

  • 김재열;윤성운;한재호;김창현;양동조;송경석
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.345-350
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    • 2002
  • In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

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전기저항 점용접부의 용접잔류응력 해석에 관한 연구 (A Study on the Welding Residual Stress Analysis of the Spot Welding Point)

  • 손일선;배동호
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 1999년도 특별강연 및 춘계학술발표대회 개요집
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    • pp.233-236
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    • 1999
  • The welding residual stress should be considered in fatigue stress analysis because it develope during the process of the electric resistance spot welding and it causes bad affect on the fatigue crack initiation and growth at nugget edge of spot welded points. Therefore the accurate estimation of residual stress is crucial. In this study, nonlinear finite element analysis on welding residual stress generated during the process of the spot welding was conducted, and their results were compared with the experimental data measured by X-ray diffraction method. From the results, it was found that welding residual stress existed as tension in the nugget center and as compression around the nugget edge.

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반도체 패키지의 내부 결함 검사용 알고리즘 성능 향상 (The Performance Advancement of Test Algorithm for Inner Defects In Semiconductor Packages)

  • 김재열;김창현;윤성운
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.721-726
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    • 2005
  • In this study, researchers classifying the artificial flaws in semiconductor. packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

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분자동역학을 이용한 공구형상에 따른 미소절삭현상에 관한 연구 (A Study on the Microcutting for Configuration of Tools using Molecular Dynamics)

  • 문찬홍;김정두
    • 한국정밀공학회지
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    • 제12권4호
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    • pp.135-142
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    • 1995
  • Recently, the analysis of microcutting with submicrometer depth of cut is tried to get a more high quality surface product, but to get a valuable result another method instead of conventional finite element method must be considered because finite element method is impossible for a very small focused region and mesh size. As the alternative method, Molecular Dynamics or Statics is suggested and accepted in the field of microcutting, indentation and crack propagation. In this paper using Molecular Dynamics simulation, the phenomena of microcutting with subnanometer chip thickness is studied and the cutting mechanism for tool edge configuration is evaluated. As the result of simulation the atomistic chip formation is achieved.

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유한요소해석을 통한 섬유보강 아스팔트의 파괴거동특성 분석 (Finite Element Analysis for Fracture Resistance of Fiber-reinforced Asphalt Concrete)

  • 백종은;유평준
    • 한국도로학회논문집
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    • 제17권3호
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    • pp.77-83
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    • 2015
  • PURPOSES : In this study, a fracture-based finite element (FE) model is proposed to evaluate the fracture behavior of fiber-reinforced asphalt (FRA) concrete under various interface conditions. METHODS : A fracture-based FE model was developed to simulate a double-edge notched tension (DENT) test. A cohesive zone model (CZM) and linear viscoelastic model were implemented to model the fracture behavior and viscous behavior of the FRA concrete, respectively. Three models were developed to characterize the behavior of interfacial bonding between the fiber reinforcement and surrounding materials. In the first model, the fracture property of the asphalt concrete was modified to study the effect of fiber reinforcement. In the second model, spring elements were used to simulated the fiber reinforcement. In the third method, bar and spring elements, based on a nonlinear bond-slip model, were used to simulate the fiber reinforcement and interfacial bonding conditions. The performance of the FRA in resisting crack development under various interfacial conditions was evaluated. RESULTS : The elastic modulus of the fibers was not sensitive to the behavior of the FRA in the DENT test before crack initiation. After crack development, the fracture resistance of the FRA was found to have enhanced considerably as the elastic modulus of the fibers increased from 450 MPa to 900 MPa. When the adhesion between the fibers and asphalt concrete was sufficiently high, the fiber reinforcement was effective. It means that the interfacial bonding conditions affect the fracture resistance of the FRA significantly. CONCLUSIONS : The bar/spring element models were more effective in representing the local behavior of the fibers and interfacial bonding than the fracture energy approach. The reinforcement effect is more significant after crack initiation, as the fibers can be pulled out sufficiently. Both the elastic modulus of the fiber reinforcement and the interfacial bonding were significant in controlling crack development in the FRA.

$J_k$ 적분을 이용한 이방성 복합적층판에 대한 혼합 모우드 파괴문제의 해석 (Analysis of mixed mode crack problems for anisotropic composite laminates using the $J_k$ integral)

  • 주석재;홍창선
    • 대한기계학회논문집
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    • 제13권3호
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    • pp.479-489
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    • 1989
  • 본 논문에서는 J$_{1}$,J$_{2}$ 적분과 K$_{I}$,K$_{II}$ 사이의 완전한 관계를 좁은 직사각형 경로를 택하여 간판하게 유도하였다. 그리고 유한요소의 해로 J$_{2}$적분을 효율적으로 계산하는 방법을 제시하였다.이미 해가 존재하는 문제 를 본 방법으로 다루어 그 결과를 비교하였고 일방향(unidirectional) 적층판 cantil- ever 평판 내의 single edge crack에 대한 해를 제시하였다.

벽면 이동로봇의 자동 균열검출에 적합한 기계학습 알고리즘에 관한 연구 (A Study on Machine Learning Algorithm Suitable for Automatic Crack Detection in Wall-Climbing Robot)

  • 박재민;김현섭;신동호;박명숙;김상훈
    • 정보처리학회논문지:소프트웨어 및 데이터공학
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    • 제8권11호
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    • pp.449-456
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    • 2019
  • 본 논문은 진공을 이용한 흡착방식과 바퀴형 이동방식을 사용하는 벽면 이동로봇의 구성과 이러한 임베디드 환경에 적합하고 기계학습에 기반한 벽면 균열 자동 검출 알고리즘의 성능 비교에 관한 연구이다. 임베디드 시스템 환경에서 객체 학습을 위해 YOLO 등 최근에 시도된 학습 방법들을 적용하여 성능을 비교, 검토하였으며 기존의 에지 검출 알고리즘들과도 성능을 비교하였다. 결국, 본 연구에서는 균열검출을 잘하며 임베디드 환경에도 적합한 최적의 기계학습방법을 선택하고 기존 방법과 성능을 비교하여 우수성을 제시하였다. 또한, 검출된 균열의 영상을 저장하고 위치 정보를 추정하여 균열에 대한 정보를 관리자 기기로 전송하는 지능적인 문제해결 기능을 구축하였다.

세 물체 간 마찰 완전 접촉 문제의 응력 특이성 거동 (Stress Singularity Behaviour in the Frictional Complete Contact Problem of Three Bodies)

  • 김형규
    • Tribology and Lubricants
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    • 제35권4호
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    • pp.229-236
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    • 2019
  • This study investigates the stress singularity that occurs at the contact edge of three bodies in a frictional complete contact. We use the asymptotic analysis method, wherein we constitute an eigenvalue problem and observe the eigenvalue behavior, which we use to obtain the order of the stress singularity. For the present geometry of three bodies in contact, a contact between a cracked indenter and half plane is considered. This is a typical geometry of the PCMI problem of a nuclear fuel rod. Thus, this paper, specifically presents the characteristics of the PCMI problem from the perspective of stress singularity. Consequently, it is noted that the behavior of the stress singularity varies with the difference in the crack angle, coefficient of friction, and material dissimilarity, as is observed in a frictional complete contact of two bodies. In addition, we find that the stress singularity changes essentially linearly with respect to the coefficient of friction, regardless of the variation in the crack angle and material dissimilarity. Concurrently, we find the order of singularity to be 0.5 at a certain coefficient of friction, irrespective of the crack angle, which we also observe in the crack problem of a homogeneous and isotropic body. The order of singularity can also exceed 0.5 in the frictional complete contact problem of three bodies. This implies that the propensity for failure when three bodies are in frictional complete contact can be even worse than that in case of a failure induced by a crack.

FE analysis of RC pipes under three-edge-bearing test: Pocket and diameter influence

  • Kataoka, Marcela Novischi;da Silva, Jefferson Lins;de Oliveira, Luciane Marcela Filizola;El Debs, Mounir Khalil
    • Computers and Concrete
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    • 제20권4호
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    • pp.483-490
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    • 2017
  • This paper studies on the behavior of reinforced concrete (RC) pipes used in basic sanitation in the conduction of storm water and sanitary sewer. Pipes with 800 mm and 1200 mm in diameter were analyzed. The 800 mm pipes were built with simple reinforcement and the 1200 mm pipes with double reinforcement. For the two diameters of pipes the presence or absence of the pocket was evaluated, and the denomination of each one is spigot and pocket pipe (SPP) and ogee joint pipe (OJP), respectively. The 3D numerical models reproduce the three-edge-bearing test that provides information about the strength and stiffness of the reinforced concrete pipes. The validation of the computational models was carried out comparing the vertical and horizontal displacements on the springline and crown/invert and it was also evaluated the reinforcement strains and the crack pattern. As a main conclusion, the numerical models represented satisfactorily the behavior of the pipes and can be used in future studies in parametric analysis.