• Title/Summary/Keyword: Dynamic Photoelastic Experiment

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Development of Dynamic Photoelastic Experimental Hybrid Method for Propagating Cracks in Orthotropic Material (직교이방성체내의 진전 균열에 대한 동적 광탄성 실험 Hybrid 법 개발)

  • Shin, Dong-Chul;Hawong, Jai-Sug;Sung, Jong-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.8
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    • pp.1273-1280
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    • 2003
  • In this paper, transparent dynamic photoelastic experimental hybrid method for propagating cracks in orthotropic material was developed. Using transparent dynamic photoelastic experimental hybrid method, we can obtain stress intensity factor and separate the stress components from only isochromatic fringe patterns without using isoclinics. When crack is propagated with constant velocity, the contours of stress components in the vicinity of crack tip in orthotropic material are similar to those of isotropic material or orthotropic material with stationary crack under the static load. Dynamic stress intensity factors are decreased as crack growths. It was certified that the dynamic photoelastic experimental hybrid method was very useful for the analysis of the dynamic fracture mechanics.

Dynamic Photoelastic Experimental Method for Propagating Interfacial Crack of Bimaterials (이종재료의 진전 계면 균열에 대한 동적 광탄성 실험법)

  • Shin, Dong-Chul;Hawong, Jai-Sug
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.292-297
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    • 2000
  • In this research, the dynamic photoelastic experimental hybrid method for bimaterial is introduced. Dynamic biaxial loading device is developed, its strain rate is 31.637 s-1 and its maximum impact load is 20 ton. Manufactured methods for model of the dynamic photoelastic experiment for bimaterial are suggested. They are bonding method(bonding material: AW106, PC-1) and molding method. In the bonding method, residual stress is not occurred in the manufactured bimaterial. Crack is propagated along the interface or sometimes deviated from the interface. While in the molding method, residual stress is occurred in the manufactured bimaterial. Crack is always deviated from the interface and propagated in the epoxy region(softer materila). In order to propagate with constant velocity along the interface of bimaterial with arbitrary stiffer material, edge crack should be located along the interface of the acute angle side of the softer material in the bimaterial.

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Analysis of Propagating Crack Along Interface of Isotropic-Orthotropic Bimaterial by Photoelastic Experiment

  • Lee, K.H.;Shukla, A.;Parameswaran, V.;Chalivendra, V.;Hawong, J.S.
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.102-107
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    • 2001
  • Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when $\alpha=90^{\circ}C$ (fibers perpendicular to the interface) than when $\alpha=0^{\circ}C$ (fiber parallel to the interface) and those when $\alpha=90^{\circ}C$ are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating crack are greater when $\alpha=0^{\circ}C$ than $\alpha=90^{\circ}C$. The relationship between complex dynamic stress intensity factor $|K_D|$ and crack speed C is similar to that for isotropic homogeneous materials, the rate of increase of energy release rate G or $|K_D|$ with crack speed is not as drastic as that reported for homogeneous materials.

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