• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.1044-1047
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• 1999

This paper deals with the dynamic property of ground overvoltage relay in large turbine generator. Relay operation is based on detecting the fundamental voltages originating from the generator. Calculations of fault voltage and current are reviewed for the neutral ground resistance. The frequency, ampitude and waveform of individual harmonics were measured using power quality analyzer and memory hi-corder at the secondary side of ground potential transformer. The ac and dc high-potential tests were applied to evaluate the condition of generator, main and auxiliary transformer, isolated phase bus, potential transformer, surge capacitor and arrester.

• Journal of the Korean Society for Precision Engineering
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• v.1 no.1
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• pp.34-49
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• 1984

The stability of machine tool systems is analyzed by considering the machining process as a stochastic process without decomposing into machine tool structural dynamics and cutting processes. In doing so the time series analysis technique developed by Wu and Pandit is applied systematically to the relative vibration between cutting tool and work- piece measured under actual working conditions. Various characteristic properties derived from the fitted ARMA(Autoregressive Moving Average) Models and those from raw data directly are investigated in relation with the system stability. Both damping ratio and absolute value of the characteristic roots of the AR part of the most significant dynamic mode are preferred as stability indicating factors to the other pro-perties such as theoretical variance .gamma. (o) or absolute power of the most dominant dynamic mode. Maximum aplitude during a certain interval and variance estimated from raw data are shown to be very sensi- tive to the type of the signal and the location of measurement point although they can be obtained rather easily. The relative vibration signal is also analyzed by FFT(Fast Fourier Transform) Analyzer for the purpose of comparison with the spectrums derived from the fitted ARMA models.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2008.10a
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• pp.107-122
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• 2008

종이의 도공액이 고농도화 됨에 따라 도공액의 유동학적 특성에 대한 연구가 더욱 더 중요시 되고 있다. 기존의 합성 증점제의 경우는 단순히 증점 보수제의 기능을 가지고 있으므로 고농도/고속 도공시 블레이드하에서 점탄성적인 성질 중 팽윤에 의한 탄성의 성질이 더 강하게 남아있게 되어 다양한 도공 트러블의 원인이 될 수 있다. 최근에는 이러한 단점을 개선하기 위한 표면 흡착형 유동성 조절제가 소개되고 있다. 따라서 본 연구에서는 알카리 팽윤형 합성 증점제와 표면 흡착형 유동성 개량제로 업계에 알려진 2종의 유동성 조절제가 고농도 도공액의 점탄성적인 유동특성에 미치는 영향성을 검토하였고, PDA(Penetration Dynamic Analyzer) 모듈을 이용하여 원지에 흡수되는 흡수 거동을 관찰하였다.

• Journal of Korea Society of Digital Industry and Information Management
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• v.5 no.4
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• pp.127-137
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• 2009

This paper is proposed that in-output Digital module is acquired a vibration signal of a rotating machinery by Data Acquisition System. The module is designed to get ride of nose through low pass filter on the vibration signal from sensors and set the gain value for being able to sampling AC to DC, and also the sampled data by sampler and the conversed data by DIP/FPGA is supplied to the analyzer for analysis at a software tool. The DIP(Digital Signal Processor) of the Digital input/output Board makes Average voltage, Peak to Peak voltage, RMS(Root Mean Square) and Gap voltage, also FFT(Fast Fourier Transform) for rotating vibration diagnosis.

• Journal of the Korea institute for structural maintenance and inspection
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• v.4 no.1
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• pp.77-83
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• 2000

구조물의 동특성은 대형구조물을 상시감시 할 수 있는 장점으로 인하여 널리 활용된다. 상시감시를 위해 계측된 랜덤 데이터는 FFT를 통한 구조물의 동적 고유특성을 분석함으로써 이루어진다. 이 과정에서 Input Data와 Response Data사이에서 FFT Analyzer를 통하여 FRF가 측정된다. 특히 랜덤 데이터의 계측은 여건과 환경에 따라 발생하는 Noise로부터 가능한 정확한 FRF를 계측해야만 성공적인 구조물의 고유의 동적특성을 파악하게 된다. 랜덤 데이터에서 발생할 가능성이 높은 입력, 출력 Noise를 동시에 최소화 할 수 있는 새로운 개념의 FRF측정 알고리즘을 제안한다. 이 알고리즘에 의하여 장대형 모형교량으로부터 Modal 실험을 수행하여 계측된 동특성을 FE 해석 결과와 비교 평가하여 유용성을 제시한다.

• Polymer(Korea)
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• v.24 no.3
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• pp.358-365
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• 2000

Miscibility itnd thermal behavior of blends of synthetic biodegradable aliphatic polyester (Bionolle) with poly(epichlorohydrin) (PECH) were investigated by a differential scanning calorimetry (DSC), a dynamic mechanical thermal analyzer (DMTA) and a rotational rheometer. Observed both single glass transition temperatures from the DSC in agreement with the Fox equation and single T$_{g}$ changes as a function of composition from the DMTA indicate that these blend mixtures are miscible. In addition, the miscibility of this blend system was also observed from the single curve of the Cole-Cole Plot of log G′($\omega$) vs. log C"($\omega$) from the dynamic test using a rotational rheometer. This was further verified from the cryogenically fractured surface of BDP/PECH blends by scanning electron microscopy.

• Elastomers and Composites
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• v.53 no.4
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• pp.195-201
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• 2018

Three kinds of rubber compounds were prepared, and their underwater acoustical properties were investigated for anechoic coating. Dynamic mechanical properties of the rubber compounds were measured using a dynamic mechanical analyzer and extended to 100 kHz using time-temperature superposition. The sound speed, reflection coefficient, and attenuation constant were calculated. Silicone rubber showed the lowest reflection coefficient, and nitrile rubber showed the highest attenuation constant. The acoustic properties of nitrile rubber compounds with various compositions were investigated. The sound speed, reflection coefficient, and transmission coefficient of the nitrile rubber in the frequency range of 200-1000 kHz were measured in a water-filled tank.

• Journal of Adhesion and Interface
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• v.11 no.1
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• pp.26-34
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• 2010

We synthesized polyurethane adhesive having thermal characteristic could be debonded by heat treatment and made a dismantlable polyurethane adhesive including thermally expansive bead. We used dynamic mechanical thermal analyzer (DMA) to confirm thermal characteristic and investigated bond strength, dismantlement property of dismantlable polyurethane adhesive by content of thermally expansive bead, heating trigger and treatment conditions. The dismantlable polyurethane adhesive could be expanded by hot-air or microwave treatment and the dismantlement of the specimens became easier as the weight fraction of the thermally expansive bead increased. At the dismantlable polyurethane adhesive, the content of thermally expansive bead 40% was suitable for both bond strength and dismantlement, in case of using hot-air treatment as trigger for dismantlement, bonded joints were separated easily at $160^{\circ}C$ for 30 min and in case of using microwave as trigger, bonded joints were separated easily by irradiating microwave for 4 min.

• Polymer(Korea)
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• v.31 no.4
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• pp.289-296
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• 2007

The material factors influencing the sound absorption of the polyurethane foam were investigated with FT-IR, small-angle X-ray scattering (SAXS), and dynamic mechanical thermal analyzer (DMTA). The measurements were performed using the samples which had a similar cell structure but different absorption coefficients. It was found that the ability of the sound absorption of the polyurethane foams was closely related to the damping behavior over the transition range. In order to confirm the use of the low monol polyol (LMP) in high-performance applications, the polyurethanes based on LMP and polypropylene oxide polyol (PPG) were prepared by the solution polymerization method. The microstructure and the physical properties of these polyurethanes were compared. The PPG-based polyurethane showed a higher level of the phase-separated structure because the considerable amount of monol presented in PPG made a contribution to the increased chain mobility. However the short chains formed due to the monol species deteriorated the damping property. As a result, the LMP-based polyurethane showed the superior damping behavior as compared with the PPG-based one.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.