• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.23 no.12
• /
• pp.127-135
• /
• 2009

In this paper, the Interleaved AC/DC boost converter using two inductor with voltage-doubler characteristic when it operates with a duty cycle greater than 0.5 is proposed. Generally, the low-line(Input AC 110[V]) operation of the AC/DC boost converter is much less efficient than high-line (Input AC 220[V]) operation. The proposed Interleaved AC/DC boost converter operates as a voltage doubler at low-line. Its low-line range have higher power factor and improved efficiency compared with that of conventional converter. This research proposed the Interleaved AC/DC boost converter for voltage-doubler characteristic. The principle of operation, feature and design considerations is illustrated and the validity of verified through the experiment with a 300[W] based experimental circuit.

• Korean Journal of Remote Sensing
• /
• v.18 no.1
• /
• pp.53-59
• /
• 2002

The MSC is a payload on the KOMPSAT-2 satellite to perform the earth remote sensing. The instrument images the earth using a push-broom motion with a swath width of 15 km and a GSD(Ground Sample Distance) of 1 m over the entire FOV(Field Of View) at altitude 685 km. The instrument is designed to haute an on-orbit operation duty cycle of 20% over the mission lifetime of 3 years with the functions of programmable gain/offset and on-board image data compression/storage. The MSC instrument has one channel for panchromatic imaging and four channel for multi-spectral imaging covering the spectral range from 450nm to 900nm using TDI(Time Belayed Integration) CCD(Charge Coupled Device) FPA(Focal Plane Assembly). The MSC hardware consists of three subsystem, EOS(Electro Optic camera Subsystem), PMU(Payload Management Unit) and PDTS(Payload Data Transmission Subsystem) and each subsystems are currently under development and will be integrated and verified through functional and space environment tests. Final verified MSC will be delivered to spacecraft bus for AIT(Assembly, Integration and Test) and then COMSAT-2 satellite will be launched after verification process through IST(Integrated Satellite Test). In this paper, the introduction of MSC, the configuration of MSC electronics including electrical interlace and design of CEU(Camera Electronic Unit) in EOS are described. MSC Operation parameters induced from the operation concept are discussed and analyzed to find the influence of system for on-orbit operation in future.

• Korean Journal of Remote Sensing
• /
• v.15 no.4
• /
• pp.297-305
• /
• 1999

Ocean Scanning Multispectral Imager (OSMI) is a payload on the KOMPSAT satellite to perform global ocean color monitoring for the study of biological oceanography. The instrument images the ocean surface using a wisk-broom motion with a swath width of 800km and a ground sample distance (GSD) of < 1km over the entire field of view (FOV). The instrument is designed to have an on-orbit operation duty cycle of 20% over the mission lifetime of 3 years with the functions of programmable gain/offset and on-board image data compression/storage. The instrument also performs sun and dark calibration for on-board instrument calibration. The OSMI instrument is a multi-spectral imager covering the spectral range from 400nm to 900nm using CCD Focal Plane Array (FPA). The ocean colors are monitored using 6 spectral channels that can be selected via ground commands. KOMPSAT satellite with OSMI was integrated and the satellite level environment tests including instrument aliveness/functional test, such as launch environment, on-orbit environment (Thermal/Vacuum) and EMI/EMC test were performed at KARl. Test results met the requirements and the OSMI data were collected and analyzed during each test phase. The instrument is launched on the KOMPSAT satellite on December 21,1999 and is scheduled to start collecting ocean color data in the early 2000 upon completion of on-orbit instrument checkout.

• Current Optics and Photonics
• /
• v.2 no.2
• /
• pp.125-133
• /
• 2018

We report an in-depth analysis of the design and fabrication of multilayer dielectric (MLD) diffraction gratings for spectral beam combining at a wavelength of 1055 nm. The design involves a near-Littrow grating and a modal analysis for high diffraction efficiency. A range of wavelengths, grating periods, and angles of incidence were examined for the near-Littrow grating, for the $0^{th}$ and $-1^{st}$ diffraction orders only. A modal method was then used to investigate the effect of the duty cycle on the effective indices of the grating modes, and the depth of the grating was determined for only the $-1^{st}$-order diffraction. The design parameters of the grating and the matching layer thickness between grating and MLD reflector were refined for high diffraction efficiency, using the finite-difference time-domain (FDTD) method. A high reflector was deposited by electron-beam evaporation, and a grating structure was fabricated by photolithography and reactive-ion etching. The diffraction efficiency and laser-induced damage threshold of the fabricated MLD diffraction gratings were measured, and the diffraction efficiency was compared with the design's value.

• Journal of Internet of Things and Convergence
• /
• v.9 no.3
• /
• pp.61-67
• /
• 2023

In order to optimize the pulse electroforming copper process, a double hidden layer BP (Back Propagation) neural network is constructed. Through sample training, the mapping relationship between electroforming copper process conditions and target properties is accurately established, and the prediction of microhardness and tensile strength of the electroforming layer in the pulse electroforming copper process is realized. The predicted results are verified by electrodeposition copper test in copper pyrophosphate solution system with pulse power supply. The results show that the microhardness and tensile strength of copper layer predicted by "3-4-3-2" structure double hidden layer neural network are very close to the experimental values, and the relative error is less than 2.32%. In the parameter range, the microhardness of copper layer is between 100.3~205.6MPa and the tensile strength is between 112~485MPa.When the microhardness and tensile strength are optimal,the corresponding process conditions are as follows: current density is 2A-dm-2, pulse frequency is 2KHz and pulse duty cycle is 10%.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.23 no.9
• /
• pp.1079-1086
• /
• 2012

In this paper, X-band 60 W Solid-State Power Amplifier with sequential control circuit and pulse width variation circuit for improve bias of SSPA module was designed. The sequential control circuit operate in regular sequence drain bias switching of GaAs FET. The distortion and efficiency of output signals due to SSPA nonlinear degradation is increased by making operate in regular sequence the drain bias wider than that of RF input signals pulse width if only input signal using pulsed width variation. The GaAs FETs are used for the 60 W SSPA module which is consists of 3-stage modules, pre-amplifier stage, driver-amplifier stage and main-power amplifier stage. The main power amplifier stage is implemented with the power combiner, as a balanced amplifier structure, to obtain the power greater than 60 W. The designed SSPA modules has 50 dB gain, pulse period 1 msec, pulse width 100 us, 10 % duty cycle and 60 watts output power in the frequency range of 9.2~9.6 GHz and it can be applied to solid-state pulse compression radar using pulse SSPA.