• Journal of Power System Engineering
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• v.6 no.1
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• pp.74-81
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• 2002

The characteristics of corrosion resistance for the surface of ductile cast iron(GCD40) by plasma nitriding process have been studied in terms of electrochemical polarization behaviors including corrosion potential($E_{corr}$), anodic polarization trends, polarization resistance($R_p$), and also have been studied microstructures, hardness and specific wear of nitrided layer Nitrided layer showed an enhanced hardness values in all the plasma nitriding condition investigated. In the result of wear test, specific wear of nitrided specimens were much decreased than that of non-treated specimens. In the results of XRD, ${\gamma}'phase\;and\;{\varepsilon}$ phase were detected in nitrided surface. And it was found that ${\varepsilon}$ phase was decreased and ${\gamma}'phase$ was increased respectively, as the nitriding time became longer. In the test of corrosion resistance, natural potentials in all the nitrided specimens were towards noble directions than in the case of non-treated specimens. The measurement of electrode potentials revealed that corrosion resistivity of plasma nitrided specimens were higher than in the case of the non-treated specimens.

• Journal of Welding and Joining
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• v.12 no.3
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• pp.48-55
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• 1994

In this experiment, to find optimum brazing conditions for Cu/Stainless Steel brazing using filler metals of Ag-Cu-Zn-Cd system, first of all spreading ratio was tested on 304 stainless Steel and low carbon steel. And then shear test of brazed joint was executed. As the result of that, the shear strengths of brazed joints were the range of 60-90 MPa. Through microstructure analysis for brazed interface layer, We found as follows. Firstly interface layer increased as time increased. Secondly continuous layer of Ag-Cd compound was observed along the side of stainless steel. Also by means of EDS analysis for fracture surface, ductile fracture was occurred and precipitates on the fracture surface were found to include Cr, Mn, Si in Ag-rich phase.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.351-354
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• 2004

This work presents a simple and cost-effective approach for maskless fabrication of positive-tone silicon master for the replica molding of hyperfine elastomeric channel. Positive-tone silicon masters were fabricated by a maskless fabrication technique using the combination of nanoscratch by Nanoindenter ⓡ XP and XOH wet etching. Grooves were machined on a silicon surface coated with native oxide by ductile-regime nanoscratch, and they were etched in a 20 wt％ KOH solution. After the KOH etching process, positive-tone structures resulted because of the etch-mask effect of the amorphous oxide layer generated by nanoscratch. The size and shape of the positive-tone structures were controlled by varying the etching time (5, 15, 18, 20, 25, 30 min) and the normal loads (1, 5 mN) during nanoscratch. Moreover, the effects of the Berkovich tip alignment (0, 45$^{\circ}$) on the deformation behavior and etching characteristic of silicon material were investigated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.201-205
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• 1996

This paper suggests the scheme to simultaneously accomplish prediction of fracture initation and geometrical configuration of deformation in metal forming processes using the artificial neural network. A three-layer neural network is used and a back propagation algorithm is adapted to train the network. The Cockcroft-Latham criterion is used to estimate whether fracture occurs during the deformation process. The geometrical configuration and the value of ductile fracture are measured by finite element method. The prediction of network and numerical results of simple upsetting are compared. The proposed scheme has successfully predicted the geometrical configuration and fracture initiation.

• Transactions on Electrical and Electronic Materials
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• v.3 no.4
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• pp.32-35
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• 2002

In this work, we test electrode material of TFD (Thin Film Diode) device subject to flexible substrate. Al, that is ductile metal, was proper for flexible electrode to fabricate flexible display. The fabricated devices had symmetric electrode structure on both sides of insulation layer. The electrode was made of ductile Al so as to reduce the mismatch of properties between the electrode and substrate. The TFD device was successfully fabricated applying our own etch-free process. Electrical properties were improved by post-annealing.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• Tribology and Lubricants
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• v.12 no.4
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• pp.60-70
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• 1996

Scuffing and severe wear of the highly stressed sliding components have been very critical problems in the development of a rotary compressor. In order to improve durability and reliability of the compressor, plasma ion-nitriding was applied on the shaft and the vane surface. The effects of different treatment conditions on the mechanical and tribological properties of the ion-nitrided surfaces were investigated. Ion-nitrided surfaces showed better tribological performances than untreated surfaces. The best wear performance was observed when the shaft was nitrided in the condition of 450$\circ$C, 7 hours, $N_2:H_2=1:4$ gas mixture by forming a ductile nitrided layer which has $\gamma'$ phase microstructure. As nitrogen gas pressure increased, $\varepsilon$ phase layer was formed. This hard phase layer was observed to be more beneficial for the vane in reducing friction and wear.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.732-734
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• 1998

Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/$SiO_2$ system. Based on beam bending theory and concept of bending strain. elastic and elastic/plastic thermal deformation behaviors of multilayered materials can be estimated. In the case of plastic deformation of ductile layer, strain rate equations based on deformation mechanism map are employed for describe the stress relaxation effect. To experimentally examine deformation of multilayered thin film materials, in-situ laser scanning method is used to measure curvature of specimens during heating and cooling. The thickness of $SiO_2$ layer is varied to estimate third-layer effect of thermal deformation of metal films, and its effect on deformation behavior are discussed.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.186-195
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• 2002

The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.

• Journal of the Korean institute of surface engineering
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• v.32 no.1
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• pp.67-77
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• 1999

The Ni base superalloy Mar-M247 substrate was aluminized or aluminized after boronizing by the pack cementation under Ar atmosphere. The hot corrosion resistance and after-heat-treatment effect of aluminized specimens were studied by the cyclic hot corrosion test in $Na_2SO_4$-NaCl molten salt. XRD analysis showed that the $Ni_2Al_3$ phase was formed between the coated layer and substrate below 1273K but the NiAl phase above 1273K. The peak of the NiAl phase was developed after heat treatment. Corrosion test showed that corrosion resistance of the specimen with the NiAl phase was better than that with the $Ni_2Al_3$ phase. Corrosion resistance could be improved by heat treatment to form ductile NiAl phase, where cracks were not formed by thermal shock on coating layer. Moreover, it appeared that heat treatment played a role to improve corrosion resistance of Al diffusion coating above 1273K. The existence of boron in the Al diffusion coating layer obstructed outwared diffusion of Cr from the substrate, and it influenced on corrosion resistance of the coating layer by weakening adherence of the oxide scale.