• Title/Summary/Keyword: Dual-Ovenable Packaging

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Preparation of crosslinkable imide oligomers and Applications in Polyether Imides for Dual-ovenable Packaging (가교형 이미드 올리고머 제조 및 듀얼 오브너블 용기(Dual-Ovenable Packaging) 용 폴리에테르이미드에 대한 적용 연구)

  • Seo, Jongchul;Park, Su-Il;Choi, Seunghyuk;Jang, Wongbong;Han, Haksoo
    • Korean Chemical Engineering Research
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    • v.48 no.1
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    • pp.45-52
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    • 2010
  • Two different imide oligomers(6FDA-ODA/APA and 6FDA-MDA/MA) having crosslinkable end groups were prepared by using a solution imidization method and their properties were investigated. Also, semi-interpenetrating polymer networks(semi-IPN) were prepared using the blends of imide oligomers with polyetherimide $Ultem^{(R)}$, which is used in dual-ovenable packaging materials. The characteristic properties of semi-IPN films were interpreted by using TGA, Thin Film Diffusion Analyzer, and WAXD. Molecular weights of imide oligomers were successfully controlled utilizing 2-aminophenylacetylene(APA) and maleic anhydride(MA) as an endcapping agent. Exotherm reactions by crosslinking appeared and the amount of exthotherm heat was linearly increased as the content of imide oligomers was increased. For semi-IPNs of $Ultem^{(R)}$ and imide oligomers, 5% and 10% weight loss temperatures increased as the contents of imide oligomers were increased. Diffusion coefficient and water uptake of semi-IPNs decreased as the content of imide oligomers was increased, which might be resulted from hydrophobic fluorine group and high packing density. It was concluded that relatively low thermal stability and hydrolytic stability of polyetherimide $Ultem^{(R)}$ were improved by incorporating new developed imide oligomers.