• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1273-1276
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• 2007

We provide a newly developed dry etching process for the fabrication of ZnO-based oxide TFTs. The etching characteristics of ZnO (active layer) and $Al_2O_3$ (gate insulator) thin films were systematically investigated when the etching gas mixtures and their mixing ratios were varied in the heliconplasma etching system.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.826-828
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• 2003

With a new PDP transparent dielectric layer formation technique, we were able to make dielectric layer with high transmittance by using dry film type dielectric material. We optimized dielectric pastes for dry film and they showed good process properties in lamination , drying and firing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.69-70
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• 2006

Waste vinyl tretreatment system has been developed by the joint project between KIMM and Woosung Co. General process for removal of impurities from waste vinyl is consisted of feeding, separating, cutting, washing, drying and recovering impurities. However, there are problems such as wastewater when washing of waste vinyl. In order to solve these problems we have developed new dry type cleaning system.

• Journal of the Korean Ceramic Society
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• v.55 no.1
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• pp.44-49
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• 2018

The use of fossil fuels is steadily increasing. The thermal power generation industry uses a lot of energy and emits a large amount of greenhouse gases. On the other hand, a desulfurization facility can be installed to remove sulfur content during boiler combustion process of the power plant. Dry desulfurized gypsum generated from dry desulfurization facilities is suitable as a $CO_2$ absorbing material due to the presence of CaO. In this study, the carbonation properties of dry desulfurized gypsum were investigated by carbonizing dry desulfurized gypsum via mixing with water and stirring. As a result of microstructural, XRD and thermal analyses of the carbonized dry desulfurized gypsum, the carbonation age was found to be suitable for 16 h. Dry desulfurized gypsum absorbs about 16% of $CO_2$ per unit weight.

• Electrical & Electronic Materials
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• v.10 no.1
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• pp.8-14
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• 1997

The UV/O$_{3}$ dry cleaning has been well known in removing organic molecules. The UV/O$_{3}$ dry cleaning method was performed to clean the Si wafer surfaces and contact holes contaminated by organic molecules such as residual PR. During the cleaning process, the Si surfaces were analyzed with X-ray photoelectron spectroscopy (XPS), atomic force microscope (AFM) and ellipsometer. When the UV/O$_{3}$ dry cleaning at 200'C was performed for 3 minutes, the residual photoresist was almost removed on Si wafer surfaces, but Si surfaces were oxidized. For UV/O$_{3}$ application of contact hole cleaning, the contact string were formed using the equipment of ISRC (Inter-university Semiconductor Research Center). Before Al deposition, UV/O$_{3}$ (at 200.deg. C) dry cleaning was performed for 3 minutes. After metal annealing, the specific contact resistivity was measured. Because UV/O$_{3}$ dry cleaning removed organic contaminants in contact holes, the specific contact resistivity decreased. Each contact hole size was different, but the specific contact resistivities were all much the same. Thus, it is expected that the UV/O$_{3}$ dry cleaning method will be useful method of removal of the organic contaminants at smaller contact hole cleaning.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.35 no.5
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• pp.133-143
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• 2019

Various problems regarding the wet floor method such as its complicated process and waste of thermal storage have been raised, but the usage of dry floor recommended for long-life housing has declined due to lack of confidence on the performance of dry floor. The purpose of this study is to secure the credibility of dry floor. Under this purpose, this study considered precedent studies and established directions to secure the performance of long-life housing infill, and thus, 9 performance items (Impact sound, Smoothness, thermal comfort, sensation hardness while walking, falling safety, impact resistance, local compression load, local strength and strain at heating) were drawn. In addition, the experiment was carried out for 5 performances except for legal performance, some dry floor performances and whole spatial performance. As a result, an appropriate result from all performances except was obtained. The performance of dry floor was verified for each item from these results and it is expected to use such results as basic data on dry floor in the future.

• Geomechanics and Engineering
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• v.28 no.4
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• pp.375-384
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• 2022

The glacial tills and shales in Midwestern states of the USA often show strength degradation after construction. They are often in need of applying soil modification techniques to remediate their strength degradation with weathering process. This study investigated the weathering durability of these natural soils and biopolymer treated soils by comparing direct shear test results for wet-dry and wet-freeze-thaw-dry cycled specimens. The tests showed that untreated glacial tills maintained only 62% and 50% initial shear strength after eight wet-dry cycles and eight wet-freeze-thaw-dry cycles, respectively. These untreated soils could not withstand by themselves after 16 weathering cycles. The same soils treated with 1.5% (by dry weight) food-grade Xanthan gum maintained 140% and 88% initial shear strength of untreated soils after 16 weathering cycles for wet-dry cycles and wet-freeze-thaw-dry cycles, respectively. The same soils treated with 1.5% (by dry weight) Gellan gum maintained 82% and 60% initial shear strength of untreated ones after 16 weathering cycles, respectively. Similar results were obtained for crushed shales, manifesting that the biopolymerization method may be adopted as a new eco-friendly method to enhance the weathering durability of these problematic soils of glacial tills and shales.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.2
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• pp.60-69
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• 1998

Polysilicon surface mdoification tecnique is developed to reduce the sticking of microstructures fabricated by micromachining. Modified anti-sticking grain holes are simply formed by two-step dry eth without additional photolithography nor deposition of thin films. Both process-induced sticking and in-use sticking are successfully reduced more than two times by adopting grain holed polysilicon substrate. A sticking model for cantilever beam is derived. This model includes bending moment stems from stress gradient along the thickness directionof structural polysilicon. Because the surface tension of rinse liquid and the surface energy of the solids to be stuk tend to decrease in recently developed anti-sticking techniques, the effect of stress gradient will play an important role to analyze the sticking phenomena. Effect of the temperature during post-release rinse and dry is modelled and verified experimentally. Based on developed anti-sticking polysilicon structure and the sticking model, sticking of microstructure, fabricated by simple wet process including sacrificial layer etch and rinse with deionized water without special equimpment for post-release rinse and dry was alleviated more than 3.5 times.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.3 no.4
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• pp.29-36
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• 2004

An experimental study on drilling of stainless steel is conducted using TiAlN coated drills and HSS twist drills with several cutting conditions; feed rate, spindle rotational speed, and dry/wet cutting. The effects of number of hole on the thrust force are examined by cutting force measurement. The flank wear of the drills and the change of hole diameter are quantitatively observed using a vision system. It is found that the thrust force in drilling with TiAlN coated drills decrease under dry and wet machining, whereas the flank wear resistance is improved.