• Title/Summary/Keyword: Dry Process

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Effect of Dry Granulation Process on Flowability of Erdosteine

  • Wang, Hun-Sik;Kwon, Min-Chang;Shim, Ji-Yeon;Park, Jun-Sang
    • Proceedings of the PSK Conference
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    • 2003.10b
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    • pp.230.2-230.2
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    • 2003
  • Erdosteine, an expectorant, has been known to show a very poor flowability. Furthermore, high dosing amount (300mg/cap) and bulk density make it more difficult to fill in a capsule less than No. 0 size as bulk state. We have studied the possibility of dry granulation process in purpose of getting a better flowability and manufacturing efficiency. A roller compactor was introduced for this purpose and the applicability of laboratory result into commercial scale instrument was also experimented.Roller compacting process was very favorable to obtain the granules with good flowability and improved density profiles. (omitted)

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Shape Improvement and Optimum Gradation of Dry Processed Bottom Ash for Lightweight Mortar (경량 모르터용 건식공정 바텀애시의 입형 개선 효과와 최적 입도)

  • Choi, Hong-Beom;Kim, Jin-Man;Sun, Jung-Soo;Han, Dong-Yeop
    • Journal of the Korean Recycled Construction Resources Institute
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    • v.3 no.1
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    • pp.7-14
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    • 2015
  • The aim of this research is suggesting dry processed bottom ash as a new and economical source of lightweight aggregate for mortar and concrete. The dry process of bottom ash is an advance method of water-free and no chloride because only cooled down by double dry conveyer belt systems. Furthermore, because of relatively slow cooling down process helps burning up the remaining carbon in bottom ash. Using this dry process bottom ash, to evaluate the feasibility of using as a lightweight aggregate for mortar and concrete, two-phase of experiments were conducted: 1) improving shape of the bottom ash, and 2) controlling grade of the bottom ash. From the first phase of experiment, additional abrasing process was conducted for round shape bottom ash, hence improved workability and compressive strength was achieved while unit weight was increased comparatively. Based on the better shape of bottom ash, from the second phase, various grades were adopted on cement mortar, standard grade showed the most favorable results on fresh and hardened properties. It is considered that the results of this research contribute on widening sustainable method of using bottom ash based on the dry process and increasing value of bottom ash as a lightweight aggregate for concrete.

The Study on the Formative Process of Taeumin's Dry-febrile Symptom (태음인(太陰人) 조열증(燥熱證)의 형성과정(形成過程)에 대한 연구(硏究))

  • Kim, Sang-Hyuk;Kim, Yun-Hee;Hwang, Min-Woo;Lee, Jun-Hee;Song, Il-Byung;Koh, Byung-Hee
    • Journal of Sasang Constitutional Medicine
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    • v.20 no.1
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    • pp.1-14
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    • 2008
  • 1. Objectives This paper was written in order to understand formative process of Taeumin's Dry-febrile Symptom. 2. Methods We analysis Taeumin's Dry-febrile Symptom through pathology and prescription in ${\ulcorner}$Dongyisusebowonchobongyun${\lrcorner}$, ${\ulcorner}$Dongyisusebowongabo-bon${\lrcorner}$, ${\ulcorner}$Dongyisusebowonsinchukbon${\lrcorner}$. And we also analysis before study on pathology of Taeumin. 3. Results and Conclusions SCM was controled by Good-Qi. There was explained the strong and weak of Good-Qi to the number of real life. Slightness and Severeness of disease are dependent on the Health Energy of small viscera. So the interior febrile disease of Taeumin is divided to Liver-febrile symptom and Dry-febrile symptom. Because Liver-febrile symptom is reasonable symptom but Dry-febrile symptom is contrary symptom.

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Dry Etch Process Development for TFT-LCD Fabrication Using an Atmospheric Dielectric Barrier Discharge

  • Choi, Shin-Il;Kim, Sang-Gab;Choi, Seung-Ha;Kim, Shi-Yul;Kim, Sang-Soo;Lee, Seung-Hun;Kwon, Ho-Cheol;Kim, Gon-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1272-1275
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    • 2008
  • We present the development of dry etch process for the liquid crystal display (LCD) fabrication using a dielectric barrier discharge (DBD) system at atmospheric pressure. In this experimental work, the dry etch characteristics and the electrical properties of thin film transistor are evaluated by using the scanning electron microscopy and electric probe, and TFT-LCD panel ($300\;mm\;{\times}\;400\;mm$) is manufactured with the application of the amorphous silicon etch step in the 4 mask and 5 mask processes.

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Design of the Dry Powder Device and Slitting Machine Device (탈피복 기계 장치와 건식 분말화 장치 설계)

  • 정재후;윤지섭;김영환;이종열;홍동희
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.630-633
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    • 1997
  • Spent fuel decladding device and dry voloxidizer is to separate the spent pellet from spent fuel rod cut by 250mm and to convert the spent pellet into powder form for reuse and/or disposal of the spent fuel. There are two methods in decladding and voloxidation of spent fuel, that is, wet method with chemical material and dry method with mechanical device. In this study, to examine the fuel rod decladding process and the pellet voloxidation process, the devices for the spent fuel decladding and the pellet voloxidation with dry method are developed. The decladding machine is designed to separate pellets from fuel rod by slitting device. And, the voloxidizer is designed to convert the spent pellet which is ceramic form into powder form by oxidation using the multi step mesh, vibrator, and air in the high temperature environment. The result of this study, such as operation condition et., will be utilized in the design of the machine for demonstration.

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Dry Shrinkage Characteristic according to the Ternary System Inorganic Binder Panel Size (3성분계 무기결합재 패널크기에 따른 건조수축 특성)

  • Lee, Jin-Woo;Lee, Sang-Soo
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2014.11a
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    • pp.144-145
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    • 2014
  • In the cement,that is the main materials of the panel, as to the cofired process, more than 1,300 enormous energies is consumed, in addition the greenhouse gas generated in the process of producing the cement occupies 6.3% of the country whole emission quantity. And the carbon dioxide of about 0.8 ton is the cement ejected in 1 production. Accordingly, the panel utilizing the industrial byproduct is developed. Accordingly, this research is the experiment which makes the individual size into the environment-friendly inorganic binder panel and by using the blast furnace slag, which is the industrial byproduct with the cement substitute material red mud, silica fume, and etc. looks at the dry shrinkage. The length variation in which the panel which is 450 with the dry shrinkage result of measurement, thickness 12mm, and size 450mm is the smallest was shown.

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Multilayer Coatings on Flexible substrate for Electromagnetic Shielding by Using Dry/Wet Hybrid Processes (건습식 혼합공정을 이용한 유연소재 상 전자파 차폐용 다층막 코팅)

  • Lee, Hoon-Seung;Lee, Myeong-Hoon
    • Journal of the Korean institute of surface engineering
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    • v.50 no.5
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    • pp.373-379
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    • 2017
  • Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared $2{\mu}m$ Zn/Cu/Ni multilayers coated on $12{\mu}m$ polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around $0.2{\Omega}$ by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.

INDUSTRIAL STATUS OF DRY PLATING AS AN ALTERNATIVE TO WET PLATING PROCESS IN KOREAN SURFACE FINISHING INDUSTRY

  • Kwon, Sik-Chol;Baek, Woon-Sung;Lee, Gun-Hwan;Rha, Jong-Joo
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.253-256
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    • 1999
  • Wet plating has been initiated and developed as a major surface finishing technology as of the long customized and highly productive process until now. As the external compression by virtue of the environmental preservation becomes stricter, there has been new move to adapt dry plating line instead of conventional wet plating one in domestic surface finishing industry. Dry plating, so-called, plasma surface technology has been developed in semiconducting industry and becomes a key technology to be useful as an alternative to wet plating in surface finishing industry. The historical progress of domestic surface finishing industry was outlined with the background on the adaptation of three dry plating processes-plasma spraying, plasma nitriding and ion plating. The present status of domestic industrial activity was covered on major alternative to wet plating.

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A Study on The Wear Process and Wear Mechanism of the Alumina Ceramics with Different Alumina Purity (순도를 달리한 알루미나 세라믹스의 마멸과정 및 이의 기구에 관한 연구)

  • 전태옥;진동규
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.12
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    • pp.3404-3412
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    • 1994
  • The present study was undertaken to investigate the dry wear process and wear mechanism of the alumina ceramics in the purity variation which are used for the mechanical seal, roll, liner and dies. The wear test was carried out under different experimental condition using the wear testing device and in which the annular surface rubbed on dry sliding condition various sliding speed, contact pressure and sliding distance. In case of alumina purity 95%, there was speed range which wear loss increased rapidly owing to enlargement of heat impact force and temperature rise of wear surface. According as the alumina purity increased, wear loss decreased but alumina purity 85% with much void and defect had the most wear loss than any other alumina purity. The friction coefficient of sliding initial stage of wear curves has a large value but according to increase of sliding distance, it decreased owing to drop of the shear strength of wear surfaces.

Comparison of the Existing Wet Etching and the Dry Etching with the ICP Process Method (새로운 ICP 장치를 이용한 고온 초전도체의 Dry Etching과 기존의 Wet Etching 기술과의 비교)

  • 강형곤;임성훈;임연호;한윤봉;황종선;한병성
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.2
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    • pp.158-162
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    • 2001
  • In this report, a new process for patterning of YBaCuO thin films, ICP(inductively coupled plasma) method, is described by comparing with existing wet etching method. Two 100㎛ wide and 2mm long YBaCuO striplines on LaAlO$_3$ substrates have been fabricated using two patterning techniques. And the properties were compared with the critical temperature and the SEM photography. Then, the critical temperatures of two samples were about 88 K, but the cross section of sample using ICP method was shaper than that using the wet etching method. ICP method can be used as a good etching technique process for patterning of YBaCuO superconductor.

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