• Laser Solutions
• /
• v.9 no.1
• /
• pp.17-23
• /
• 2006

The technologies of laser micromachining are changed toward more complex-micropatterning, from the micro circle-shaped hole drilling to the micro arbitrary-shaped hole drilling. In this paper, the fundamental experiments by using DPSS 3rd harmonic $Nd:YVO_4\;laser({\lambda}=355nm)$ were carried out in order to obtain the feasibility of flexible micropatterning by various fixed masks. Fixed masks and Galvano scanners were investigatde to make micro patterns. from these experimental results, micropatterns on PEN film were rapidly manufactured in large area.

• Laser Solutions
• /
• v.15 no.4
• /
• pp.6-11
• /
• 2012

Laser beam can be either absorbed or scattered in porous ceramic material and its optical characteristics need to be understood. Electro-magnetic multiphysics software was used to simulate and understand the actual scattering phenomena in porous materials. 785nm femtosecond laser was irradiated on the surface of ceramic material and strong scattering occurred in drilling process. The computer results showed the scattering and absorption phenomena of Aluminum oxide were a mixture of dielectric and metallic material. The computer simulation showed the laser beam was almost extinct at the aspect rate of 5 approximately.

• IE interfaces
• /
• v.7 no.3
• /
• pp.155-168
• /
• 1994

In computer integrated manufacturing environment, tool management plays an important role in controlling tool performance for machining operations. Knowledge of tool behavior during the cutting process and effective tool-behavior prediction contribute to controlling machine costs by avioding production delays and off-target parts due to tool failure. The purpose of this paper is to review and develop the tool condition monitoring scheme for drilling operation to assure a fast corrective response to minimize the damage if tool failures occur. If one desires to maximize system through-put and product quality as well as tooling resources, within an economic environment, real-time tool sensing system and information processing system can be coupled to provide the necessary information for the effective tool management. The example is demonstrated as to drilling operation when the aluminum composites are drilled with carbide-tipped HSS drill bits. The example above is limited to the situation that the tool failure mode of drill bits is wear.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.1475-1480
• /
• 2007

In the last few years, lasers have found new applications in production engineering as tools for surface treatment, cutting, welding, drilling and marking. So far, the laser has mainly been used in special laser processing machines ('laser-only') directly integrated into a production line or serving as stand-alone stations in the workshop. By combining conventional metal cutting technologies with laser processes in one machine, complete processing of a workpiece with different technologies in one setting can be realized. The main advantages are a reduction of the material flow between the production machines, which leads to a reduction in processing time and logistics, and an enhancement of manufacturing quality due to the processing in one setting. In addition to this approach new processing technologies such as laser-assisted machining are possible.

• Geophysics and Geophysical Exploration
• /
• v.13 no.4
• /
• pp.336-348
• /
• 2010

The Single-channel seismic survey with the source of bubble pulser and drilling survey was carried out in 2008 and 2009 for the site survey of Daecheon-Wonsando area, which was a proposed area of Korea-China subsea tunnel. The goal of this study is to analyze the depth and characteristics of acoustic basement for the stability assessment and tunnel design in this proposed area through combining drilling data with this single-channel seismic data after detailed processing. For this purpose, among the data processing schemes which are usually applied to multi-channel seismic data, we applied the F-K filtering to eliminate the AC(alternating current) noise and the post-stack depth migration to produce depth section. As a result, we verified that the improved depth section could be obtained from single-channel seismic data, and the distribution and characteristics of basement could be analyzed in survey area through the combined analysis with drilling data. However, we could not interpret the detailed structures, fault and fracture zone, due to the quality of bubble pulser source and single-channel data. We expect that those detailed structures can be analyzed when higher resolution seismic data is provided. Therefore, we recommend some items for future seismic survey of subsea tunnel to obtain the high resolution seismic data.

• Composites Research
• /
• v.24 no.4
• /
• pp.23-28
• /
• 2011

Recently CFRP laminate joints process by bolts and nets are developed rapidly in aircraft industries. However, there are serious drawback during jointing process. Many hole processes are needed for the manufacturing and structural applications using composite materials. Generally, very durable polycrystalline crystalline diamond (PCD) drill has been used for the CFRP hole process. However, due to the expensive price and slow process speed, chemical vapor deposition (CVD) diamond drill has been used increasingly which are relatively-low durability but easily-adjustable process speed via drill shape change and price is much lower. In this study, the comparison of hole process between PCD and CVD diamond coated drills was done. First of all, CFRP hole processbility was evaluated using the equations of hole processing conditions (feed amount per blade, feed speed). The comparison on thermal damage occurring from the CFRP specimen was also studied during drilling process. Empirical equation was made from the temperature photo profile being taken during hole process by infrared thermal camera. In addition, hole processability was compared by checking hole inside condition upon chip exhausting state for two drills. Generally, although the PCD can exhibit better hole processability, hole processing speed of CVD diamond drill exhibited faster than PCD case.

• Geophysics and Geophysical Exploration
• /
• v.12 no.1
• /
• pp.143-153
• /
• 2009

Using a discrete wavenumber method, we examine the effects on Logging-While-Drilling (LWD) logs when a mismatch exists between the amplitudes or generating times of the signals from individual monopoles in a LWD multipole source. An amplitude-mismatched LWD dipole/quadrupole source produces non-dipole/non-quadrupole modes as well as flexural and screw modes. The strongest of non-dipole/non-quadrupole modes is the Stoneley mode, whose amplitude increases with increasing mismatch. However, we can recover the flexural mode signals by A-C processing, and the screw mode by A-B+C-D processing, respectively. The Stoneley mode, which has the same amplitude at the same radial distance from the borehole axis, is cancelled out by A-C and A-B+C-D processing as long as the tool is placed at the centre of the borehole. The responses from a time-mismatched LWD multipole source look like the summation of responses by two or four monopole sources off the borehole axis. However, we can avoid the misinterpretation of the formation velocities by referring to the computed dispersion curves, which are independent of the arrival times of the modes, on the frequency semblance plot.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.6
• /
• pp.32-38
• /
• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• Design & Manufacturing
• /
• v.14 no.2
• /
• pp.62-68
• /
• 2020

Recently, research on precise parts required in aerospace, ship, and automobile industries has been actively conducted. In this paper, electron beam drilling machining parameters were selected and experiments were conducted to compare processing characteristics analysis according to machining parameters through machining experiments of a vaporization amplification sheet to which STS 304 was applied. Also, as a result of measuring the machining. As the thickness gradually increased, it was confirmed that the electron beam could not reach the vaporization amplification sheet and thus melted on the surface of the material. As a result of the experimental analysis, it was analyzed that the vaporization explosion reaction of the vaporization amplification sheet was not normally performed due to the working distance (WD) according to the material thickness.

• Design & Manufacturing
• /
• v.14 no.3
• /
• pp.44-49
• /
• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.