• Title/Summary/Keyword: Display IC

Search Result 151, Processing Time 0.027 seconds

New Charge-Recycling Structure and Driving Scheme for TFT-LCD Source-Driver IC Application

  • Lu, Chih-Wen;Hsu, Kuo-Jen;Liao, Hsueh-Chih;Chen, Chun-Hung
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2005.07a
    • /
    • pp.653-656
    • /
    • 2005
  • New charge-recycling structure and driving scheme for TFT-LCD source-driver IC application are proposed. The number of additional switches for the charge recycling is greatly reduced. An experimental prototype 6-bit source driver with five-level seven-phase charge recycling implemented in a $0.35-{\mu}m$ CMOS technology demonstrates that the quiescent current is only 3.1 mA, dynamic power saving is 75 %, and the settling time, which includes the charge-recycling and data driving, is within 25 $25{\mu}s$.

  • PDF

A Data-line Sharing Method for Lower Cost and Lower Power in TFT-LCDs

  • Park, Haeng-Won;Moon, Seung-Hwan;Kang, Nam-Soo;Lee, Sung-Yung;Park, Jin-Hyuk;Kim, Sang-Soo
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2005.07a
    • /
    • pp.531-534
    • /
    • 2005
  • This paper presents a new data line sharing technique for TFT-LCD panels. This technique reduces the number of data driver IC's to half by having two adjacent pixels share the same data line. This in turn doubles the number of gate lines, which are integrated directly on the glass substrate of amorphous silicon for further cost reduction and more compactness. The proposed technique with new pixel array structure was applied to 15.4 inch WXGA TFT-LCD panels and has proven that the number of driver IC's were halved with nearly 41% circuit cost reduction and 5.3% reduction in power consumption without degrading the image quality.

  • PDF

미세 피치를 갖는 bare-chip 공정 및 시스템 개발

  • 강희석;정훈;조영준;김완수;강신일;심형섭
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
    • /
    • 2005.05a
    • /
    • pp.79-83
    • /
    • 2005
  • IT 기술, 반도체 산업 등의 급격한 발전에 힘입어 최근의 첨단 전자, 통신제품은 초경량 초소형화와 동시에 고기능 복합화의 발전 추세를 보이고 있다. 이런 추세에 발맞추어 전자제품, 통신제품의 핵심적인 부품인 IC chip도 소형화되고 있다. IC chip 패키징 기술의 하나인 Filp Chip Package는 Module Substrate 위에 Chip Surface를 Bumping 시킴으로서 최단의 접속길이와 저열저항, 저유전율의 특성도 가지면서 초소형에 높은 수율의 저 원가생산성을 갖는 첨단의 패키징 기술이다. 이런 패키징 기술은 수요증가와 더불어 폭발적으로 늘어나고 있으나 까다로운 공정기술에 의해 아직 여러 회사에서 장비가 출시되고 있지 못한 상태이다. 이에 본 연구에서는 최근 수요가 증가하는 LCD Driver IC용 COF 장비를 위한 Flip chip Bonding 장비 및 시스템을 설계, 제작하였다.

  • PDF

Dynamic Slew-Rate Control for High Uniformity and Low Power in LCD Driver ICs

  • Choi, Sung-Pil;Lee, Mira;Jin, Jahoon;Kwon, Kee-Won;Chun, Jung-Hoon
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.14 no.5
    • /
    • pp.688-696
    • /
    • 2014
  • A slew-rate control method of LCD driver ICs is introduced to increase uniformity between adjacent driver ICs and reduce power consumption. The slew rate of every voltage follower is calibrated by a feedback algorithm during the non-displaying period. Under normal operation mode, the slew rate is dynamically controlled for improving power efficiency. Experimental results show that the power consumption is reduced by 16% with a white pattern and by 10% with a black pattern, and display defects are successfully eliminated.

Automatic control method of the TFT LCD's Contrast Ratio according to ambient light (주변 조도 변화에 따라서 TFT LCD의 Contrast Ratio를 자동 조절하는 방법)

  • Kim, S.H.;Son, J.S.;Han, K.Y.;Lee, J.S.
    • Proceedings of the KIEE Conference
    • /
    • 2005.11a
    • /
    • pp.125-129
    • /
    • 2005
  • Mobile display는 사용자가 이동하면서 화면을 보기 때문에 주변 luminance의 변화에 따라서 contrast ratio 변화가 심하다. 특히 햇빛 아래에서는 Mobile display의 화면을 알아보기 어렵다. 본 연구에서는 주변 조도가 증가할수록 TFT LCD의 black 휘도의 변화율이 white 휘도 변화율보다 크게 작용하여 전체 contrast ratio(이하 CR)가 크게 감소함올 확인하였다. 또한, 반투과형 LCD는 반사창을 통해서 외부 빛올 반사시키기 때문에 주변 조도가 높아도 일정 수준의 CR은 유지할 수 있다. 그러나 투과형 LCD보다 CR이 낮았다. 본 논문에서는 투과형 TFT LCD에 back light 광원으로 LED를 사용하고, photo diode와 LED drive IC를 이용하여 주변 조도의 광량에 따라서 LCD의 back light LED의 휘도를 3단계 조절할 수 있는 회로를 구성하였다. 이렇게 함으로써 주변 조도에 따라 자동으로 back light 휘도 조절이 가능한 결과을 얻었다.

  • PDF

3-Dimensional Finite Element Method Analysis of Blanking Die for Lead Frame (리드프레임의 전단용 금형에 대한 3차원 FEM 해석)

  • Choi, Man-Sung
    • Journal of the Semiconductor & Display Technology
    • /
    • v.10 no.3
    • /
    • pp.61-65
    • /
    • 2011
  • The capabilities of finite elements codes allow now accurate simulations of blanking processes when appropriate materials modelling are used. Over the last decade, numerous numerical studies have focused on the influence of process parameters such as punch-die clearance, tools geometry and friction on blanking force and blank profile. In this study, three dimensional finite element analysis is carried out to design a lead frame blanking die using LS-Dyna3D package. After design of the blanking die, an experiment is also carried out to investigate the characteristics of blanking for nickel alloy Alloy42, a kind of IC lead frame material. In this paper, it has been researched the investigation to examine the influence of process parameters such as clearance and air cylinder pressure on the accuracy of sheared plane. Through the experiment results, it is shown that the quality of sheared plane is less affected by clearance and air cylinder pressure.

Development of Ubiquitous based Digital Switchgear Prototype for Home Automation (주택 자동화를 위한 유비쿼터스 기반의 디지털 분전반 프로토타입 개발)

  • Ko, Yun-Seok;Yun, Tae-Min;Yun, Seok-Ryul
    • Proceedings of the KIEE Conference
    • /
    • 2007.07a
    • /
    • pp.555-556
    • /
    • 2007
  • This paper proposes a new concept's IDSFHA(Intelligent Digital Switchgear For Home Automation) which can obtain the safety, the reliability and the easy to correspond to the request of the general electric customer or electric power company under the ubiquitous-based home automation environments The IDSFHA is designed by analyzing their requirement functions, a 32-bit micro processor is adopted as main controller to support efficiently the designed functions. The single phase power IC(ADE7753) is utilized to collect the electric power information, and makes it possible to communicate as internet among the IDSFHA and their using the ethernet convertor. In the proposed IDSFHA, the several functions are implemented such as the earth leakage level display and waveform transmitting, the electric power using fee display, voltage management, load management and load control function. Finally, the prototype of the IDSFHA is made experimently based on the designed results.

  • PDF

The design and FPGA implementation of a general-purpose LDI controller for the portable small-medium sized TFT-LCD (중소형 TFT-LCD용 범용 LDI 제어기의 설계 및 FPGA 구현)

  • Lee, Si-Hyun
    • Journal of the Korea Society of Computer and Information
    • /
    • v.12 no.4
    • /
    • pp.249-256
    • /
    • 2007
  • AIn this paper, a new desist of LDI controller IC for general purpose is proposed for driving the LDI(LCD Driver Interface) controller in $4{\sim}9$ inches sized portable small-medium TFT-LCD(Thin Film Transistor addressed -Liquid Crystal Display) panel module. The designed LDI controller was verified on the FPGA(Reld Programmable Gate Array) test board, and was made the interactive operation with the commercial TFT-LCD panel successfully. The purpose of design is that it is standardized the LDI controller's operation by one LDI controller for driving all TFT-LCD panel without classifying the panel vendor, and size. The main advantage for new general-purpose LDI controller is the usage for the desist of all panel's SoG(System on a Glass) module because of the design for the standard operation. And in the previous method, it used each LDI controller for every LCD vendor, and panel size, but because a new one can drive all portable small-medium sized panel, it results in reduction of LDI controller supply price, and manufacturing cost of AV(Audio Video) board and panel. In the near future, the development of SoG IC(Integrated Circuit) for manufacturing more excellent functional TFT-LCD panel module is necessary. As a result of this research, the TFT-LCD panel can make more small size, and light weight, and it results in an upturn of domestic company's share in the world market. With the suggested theory in this paper, it expects to be made use of a basic data for developing and manufacturing for the SoG chip of TFT-LCD panel module.

  • PDF

Roll-to-Roll Printing Techniques and Materials for Large-Area Electronics

  • Jo, Gyu-Jin
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2011.05a
    • /
    • pp.2.2-2.2
    • /
    • 2011
  • In this talk, the general concept of roll-to-roll printing technologies will be introduced with basic fundamentals of ink formulations for printing electronic devices as the first part of the talk. As the second part, based on the R2R printing process, key factors for printing TFTs, IC, PV and display would be presented using the information from the case study of R2R gravure and offset.

  • PDF

A study on the reliability test of Symmetric high voltage MOSFET under the extended source/drain length (Symmetric high voltage MOSFET의 extended source/drain 길이에 따른 전기적 특성의 고온영역 신뢰성 분석)

  • 임동주;최인철;노태문;구용서
    • Proceedings of the IEEK Conference
    • /
    • 2003.11c
    • /
    • pp.309-312
    • /
    • 2003
  • In this study, the electrical characteristic of Symmetric high voltage MOSFET (SHVMOSFET) for display driver IC were investigated. Measurement data are taken over range of temperature (300K-400K) and various extended drain length. In high temperature condition(>400K), drain current decreased over 20%, and specific on-resistance increased over 30% in comparison with room temperature.

  • PDF