• 반도체디스플레이기술학회지
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• 제5권3호
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• pp.29-32
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• 반도체디스플레이기술학회지
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• 제11권4호
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• pp.49-55
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• 2012

This paper proposes an efficient method of object identification and localization for image recognition. The new proposed algorithm utilizes correlogram back-projection in the YCbCr chromaticity components to handle the problem of sub-region querying. Utilizing similar spatial color information enables users to detect and locate primary location and candidate regions accurately, without the need for additional information about the number of objects. Comparing this proposed algorithm to existing methods, experimental results show that improvement of 21% was observed. These results reveal that color correlogram is markedly more effective than color histogram for this task. Main contribution of this paper is that a different way of treating color spaces and a histogram measure, which involves information on spatial color, are applied in object localization. This approach opens up new opportunities for object detection for the use in the area of interactive image and 2-D based augmented reality.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.42-48
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• 2020

As global warming accelerates, eco-friendly electric cars are being developed to reduce carbon dioxide emissions, and power conversion inverters are used to drive motors. Among inverter components, DC-link capacitor is heated by high current usage, which causes problems such as performance and life-saving of inverter. Although metal cases with good thermal performance have been used to solve this problem, it is difficult to apply them in practice due to insulation problems with other parts. In this paper, the Heat-Generation influence factor of DC-link capacitor is analyzed. Variables on heat-generation are set at 3 levels for film width, inductance, and film thickness. Box-Behnken to 13 tests using the design and minimal deviations, e.g. through the experiment three times by each level. The surface of the film k type by attaching the sensor current is measured temperature. Capacitance was set to a minimum level of 200 ㎌ and had a frequency of 16 kHz with Worst case, ambient temperature of 85℃ and a ripple current of 50 Ams was applied. The temperature at the measurement point was collected in the data logger after sampling at 1 minute intervals for 2 hours after saturation with the ambient temperature. This experiment confirmed that setup factors are correlated with heat-generation.

• 대한전자공학회논문지SD
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• 제41권10호
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• pp.17-22
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• 2004

본 논문에서는 진폭 변조와 펄스 폭 변조를 모두 사용하는 새로운 AMOLED 디스플레이 구동 방식을 개발하였다. 펄스 폭 변조를 위해서 다섯 개의 서브 프레임으로 화상 프레임을 나누었고 진폭 변조를 위해 TFT 게이트 전압에 의해 제어되는 3가지의 OLED 휘도(전류) 레벨을 사용하였다. 이 두 종류의 변조를 조합하여 35(=243) 계조를 얻었다. 그리고 DAC를 사용하지 않고 2개의 쉬프트 레지스터를 갖는 새로운 데이터 전극 구동 회로를 설계하였다. 회로 동작은 6㎛ 채널 길이 다결정 TFT의 전류-전압 특성에서 추출된 TFT 파라미터를 이용한 HSpice 시뮬레이션을 통하여 검증하였다. 시뮬레이션 결과로부터 320×240, 이중 스캔, 243 계조 AMOLED 디스플레이를 구현할 수 있음을 확인하였다.

• Journal of Information Display
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• 제2권4호
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• pp.34-38
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• 2001

We suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 $cd/m^2$. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.105-109
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• 2020

Today's placement machines can pick and place thousands of components per hour with a very high degree of accuracy. The packaged semiconductor chips are inserted into a carrier at regular intervals, covered with a tape to protect the chips from external impact, and supplied in a roll form. These packaging processes also progress rapidly in a consistent direction, affecting the peelback strength between the cover tape and carrier depending on the main process conditions. In this paper, we analyzed the main process variables that affect peelback strength in the reel tape packaging process for packaging semiconductor chips. The main effects and interactions were analyzed. The peelback strength range required in the packaging process was set as the nominal the best characteristics, and the optimum process condition satisfying this was derived.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.184-187
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• 2005

This paper is described about the technique of ultra-precision machining for optical parts in HMD system. Machining technique for PMMA and BK7 with single point diamond turning machining is reported in this paper. The main factors influencing on the machined surface quality are discovered and regularities of machining process are drawn. The purpose of our research is to find the optimum machining conditions fur cutting of PMMA and grinding of BK7. Also, apply the SPDTM technique to the manufacturing of ultra precision optical components of HMD system. Aspheric PMMA lens without a polishing process, the surface roughness of 5 nm Ra, and the form error of ${\lambda}/2\;({\lambda}=632.8nm)$ for reference curved surface 30 mm has been required.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.41-46
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• 2017

This study aims to select suitable co-solvents and to obtain optimal process conditions in order to improve process efficiency and productivity through experimental results obtained under various experimental conditions for the etching and rinsing process using liquid carbon dioxide and supercritical carbon dioxide. Acetone was confirmed to be effective through basic experiments and used as the etching solution for MEMS-wafer etching in this study. In the case of using liquid carbon dioxide as the solvent and acetone as the etching solution, these two components were not mixed well and showed a phase separation. Liquid carbon dioxide in the lower layer interfered with contact between acetone and Mems-wafer during etching, and the results after rinsing and drying were not good. Based on the results obtained under various experimental conditions, the optimum process for treating MEMS-wafer using supercritical CO2 as the solvent, acetone as the etching solution, and methanol as the rinsing solution was set up, and MEMS-wafer without stiction can be obtained by continuous etching, rinsing and drying process. In addition, the amount of the etching solution (acetone) and the cleaning liquid (methanol) compared to the initial experimental values can be greatly reduced through optimization of process conditions.

• 전기전자학회논문지
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• 제23권3호
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• pp.1038-1045
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• 2019

본 논문에서는 데이터 전송 속도를 제한하는 채널의 대역폭 문제를 해결하기 위한 방법으로 널리 사용되는 고속 듀오바이너리(duobinary) 송수신단 설계기술 동향을 서술한다. 고속 전송 환경에서는 전송 신호의 주파수가 채널의 대역폭보다 커지게 되어 신호의 손실이 극심해지는 문제가 생긴다. 듀오바이너리 신호는 같은 전송속도를 가지는 Non-Return-to-Zero 신호와 비교했을 때 수식적으로 더 낮은 주파수 대역폭을 가진다. 따라서 고주파 신호일수록 손실정도가 커지는 실제 데이터 채널 환경에서 듀오바이너리 신호기법을 사용함으로써 신호 손실을 효과적으로 줄일 수 있다. 이러한 듀오바이너리 신호기법의 수학적 분석과 더불어 듀오바이너리 신호기법을 고속 송수신단 설계에 적용한 여러 방법들에 대해 탐구한다.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.92-98
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• 2022

This paper proposes a new method of the traffic signal detection and the recognition in an HSI color model. The proposed method firstly converts a ROI image in the RGB model to in the HSI model to segment the color of a traffic signal. Secondly, the segmented colors are dilated by the morphological processing to connect the traffic signal light and the signal light case and finally, it extracts the traffic signal light and the case by the aspect ratio using the connected component analysis. The extracted components show the detection and the recognition of the traffic signal lights. The proposed method is implemented using C language in Raspberry Pi 4 system with a camera module for a real-time image processing. The system was fixedly installed in a moving vehicle, and it recorded a video like a vehicle black box. Each frame of the recorded video was extracted, and then the proposed method was tested. The results show that the proposed method is successful for the detection and the recognition of traffic signals.