• Title/Summary/Keyword: Dismantling Process

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Technique to Evaluate Safety and Loaded Heavy Equipment Grade in RC Building during Demolition Work (RC건축물 해체공사의 안전성 평가기법 및 탑재장비 등급 제안)

  • Park, Seong-Sik;Lee, Bum-Sik;Kim, Hyo-Jin;Sohn, Chang-Hak
    • Land and Housing Review
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    • v.2 no.2
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    • pp.195-204
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    • 2011

  • During mechanical demolition of RC structures, weights of dismantling equipment and demolition waste of building are applied to unexpected load which did not be considered during the design of structural member. Nevertheless, the loading of dismantling equipment and dismantling process are mainly dependent on field managers' field workers' or experiences without considering safety of structural member by a structural engineer. It is urgently required that reflecting actual circumstance of mechanical demolition, safety evaluation method to evaluate the safety and the guideline for appropriate capacity of structural member to support dismantling equipment weight, be provided. Through site investigation and questionnaire on field workers, this paper proposed demolition waste load, load factor, strength reduction factor, and so on. These are essential to safe evaluation of a building, ready to demolition. Considering actual circumstance of mechanical demolition, safety evaluation method of building and design method of slab and beam was suggested to a dilapidated building. An capability to loading of dismantling equipment was proposed, applied to RC slab and RC beam. Therefore, the suggested safety evaluation method and the guideline for an capability to loading of dismantling equipment weight can reasonably evaluate the capacity of structural member in demolition and use effectively as increasing efficiency and improving safety of demolition through proper management of dismantling equipments.

  • https://doi.org/10.5804/LHIJ.2011.2.2.195 인용 PDF

Manufacture of Dismantling Apparatus for Waste CPU Chip and Performance Evaluation (폐 CPU 칩의 해체장치 제작 및 성능 평가)

  • Joe, Aram;Park, Seungsoo;Kim, Boram;Park, Jaikoo
    • Resources Recycling
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    • v.25 no.6
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    • pp.3-12
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    • 2016

  • In this study, Au distribution in F-PGA chip and W-BGA chip were examined to recover Au effectively from CPU chips. The result showed that 80.8% and 89.8% of Au exist in terminal of F-PGA chip and bare die of W-BGA chip, respectively. Based on the fact that Au exists in specific parts of the chips, an CPU chip dismantling apparatus was developed. The experimental variables were roller rotating speed, heat temperature of IR heater and heating time. Terminals of F-PGA chips were completely recovered under the temperature of $300^{\circ}C$ and the residence time of 90 s. Bare dies of W-BGA chips were completely recovered as well under the temperature of $300^{\circ}C$, the roller rotating rate of 90 rpm and the residence time of 90 s.

  • https://doi.org/10.7844/kirr.2016.25.6.3 인용 PDF KSCI