• The Journal of Advanced Prosthodontics
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• v.12 no.3
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• pp.124-130
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• 2020

PURPOSE. The aim of this in vitro study was to evaluate the effect of sintering procedures on marginal discrepancies of fixed partial metal frameworks fabricated using different sintering-based computer-aided design and computer/aided manufacturing (CAD/CAM) techniques. MATERIALS AND METHODS. Forty resin die models of prepared premolar and molar abutment teeth were fabricated using a three-dimensional (3D) printer and divided into four groups (n = 10) according to the fabrication method of metal frameworks used: HM (via hard milling), SM (via soft metal milling), L25 (via direct metal laser melting [DMLM] with a 25 ㎛ layer thickness), and L50 (via direct DMLM with a 50 ㎛ layer thickness). After the metal frameworks were fabricated and cemented, five vertical marginal discrepancy measurements were recorded in each site (i.e., buccal, facing the pontic, lingual, and facing away from the pontic) of both abutment teeth under a stereomicroscope (×40). Data were statistically analyzed at a significance level of 0.05. RESULTS. No statistically significant differences (P>.05) were found among the four axial sites of metal frameworks fabricated by sintering-based CAD/CAM techniques. The HM and L25 groups showed significantly (P<.001) lower marginal discrepancy values than the SM and L50 groups. CONCLUSION. Marginal discrepancy in the sites facing the pontic was not influenced by the type of sintering procedure. All fabrication methods exhibited clinically acceptable results in terms of marginal discrepancies.

• Particle and aerosol research
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• v.6 no.3
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• pp.131-138
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• 2010

Flexible electronics are the electronics on flexible substrates such as a plastic, fabric or paper, so that they can be folded or attached on any curved surfaces. They are currently recognized as one of the most innovating future technologies especially in the area of portable electronics. The conventional vacuum deposition and photolithographic patterning methods are well developed for inorganic microelectronics. However, flexible polymer substrates are generally chemically incompatible with resists, etchants and developers and high temperature processes used in conventional integrated circuit processing. Additionally, conventional processes are time consuming, very expensive and not environmentally friendly. Therefore, there are strong needs for new materials and a novel processing scheme to realize flexible electronics. This paper introduces current research trends for flexible electronics based on (a) nanoparticles, and (b) novel processing schemes: nanomaterial based direct patterning methods to remove any conventional vacuum deposition and photolithography processes. Among the several unique nanomaterial characteristics, dramatic melting temperature depression (Tm, 3nm particle~$150^{\circ}C$) and strong light absorption can be exploited to reduce the processing temperature and to enhance the resolution. This opens a possibility of developing a cost effective, low temperature, high resolution and environmentally friendly approach in the high performance flexible electronics fabrication area.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.2
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• pp.83-88
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• 2018

Additive manufacturing (AM) technologies have attracted wide attention as key technologies for the next industrial revolution. Among AM technologies using various materials, powder bed fusion (PBF) processes and direct energy deposition (DED) are representative of the metal 3-D printing process. Both of these processes have a common feature that the laser is used as a heat source to fabricate the 3-D shape through melting of the metal powder and solidification. However, the material properties of the deposited metals differ when produced by different process conditions and methods. 17-4 precipitation-hardening stainless steel (17-4PH SS) is widely used in the field of aircraft, chemical, and nuclear industries because of its good mechanical properties and excellent corrosion resistance. In this study, we investigated the differences in microstructure and mechanical properties of deposited 17-4PH SS by PBF and DED processes, including the heat treatment effect.