• Title/Summary/Keyword: Direct Fabrication

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Effect of Laser Scanning Speed on the Laser Direct Patterning of T-shaped Indium Tin Oxide (ITO) Electrode for High Luminous AC Plasma Display Panels (고효율 플라즈마 디스플레이 패널을 위한 T-형 ITO 전극의 레이저 직접 패터닝시 레이저 스캔 속도의 영향)

  • Li, Zhao-Hui;Cho, Eou-Sik;Kwon, Sang-Jik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.2
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    • pp.133-136
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    • 2010
  • Laser direct patterning is one of new methods which are able to replace a conventional photolithography. In order reduce the fabrication cost and to improve the luminous efficiency of AC plasma display panels (PDPs), in this experiment, a Q-switched Nd:$YVO_4$ laser was used to fabricate T-shaped indium tin oxide (ITO) display electrodes. For the laser beam scanning speed from 100 mm/sec to 800 mm/sec, T-shaped ITO patterns were clearly obtained and investigated. The experimental results showed that the optimized T-shaped ITO electrode was obtained when the lasers scanning speed was 300 mm/s.

Fabrication of Nano-sized WC/Co Composite Powder by Direct Reduction and Carburization with Carbon

  • Lee, Dong-Ryoul;Lee, Wan-Jae
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.642-643
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    • 2006
  • Direct reduction and carburization process was thought one of the best methods to make nano-sized WC powder. The oxide powders were mixed with graphite powder by ball milling in the compositions of WC-5,-10wt%Co. The mixture was heated at the temperatures of $600{\sim}800^{\circ}C$ for 5 hours in Ar. The reaction time of the reduction and carburization was decreased as heating temperatures and cobalt content increased. The mean size of WC/Co composite powders was about 260 nm after the reactions. And the mean size of WC grains in WC/Co composite powders was about 38 nm after the reaction at $800^{\circ}C$ for 5 hours.

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Characteristics of Laser Aided Direct Metal Powder Deposition Process for Nickel-based Superalloy

  • Zhang, Kai;Liu, Weijun;Shang, Xiaofeng
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.521-522
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    • 2006
  • Laser additive direct deposition of metals is a new rapid manufacturing technology, which combines with computer aided design, laser cladding and rapid prototyping. The advanced technology can build fully-dense metal components directly from CAD files with neither mould nor tool. Based on the theory of this technology, a promising rapid manufacturing system called "Laser Metal Deposition Shaping (LMDS)" is being developed significantly. The microstructure and mechanical properties of the LMDS-formed samples are tested and analyzed synthetically. As a result, significant processing flexibility with the LMDS system over conventional processing capabilities is recognized, with potentially lower production cost, higher quality components, and shorter lead time.

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The Effect of Shielding Gas on Forming Characteristics for Direct Laser Melting (Direct Laser Melting 공정시 차폐가스가 성형 특성에 미치는 영향)

  • Han, S.W.;Shin, S.G.R.;Joo, B.D.;Lee, C.H.;Moon, Y.H.
    • Transactions of Materials Processing
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    • v.22 no.6
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    • pp.334-339
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    • 2013
  • Direct Laser Melting is a prototyping process whereby a 3-D part is built layer wise by melting the metal powder with laser scanning. This process is strongly influenced by the shielding gas and the laser operating parameters such as laser power, scan rate, layering thickness, and rescanning. The shielding gas is especially important in affecting the microstructure and mechanical properties. In the current study, fabrication experiments were conducted in order to analyze the effect of shielding gas on the forming characteristics of direct laser melting. Cylindrical parts were produced from a Fe-Ni-Cr powder with a 200W fiber laser. Surface quality, porosity and hardness as a function of the layering thickness and shield gas were evaluated. By decreasing the layering thickness, the surface quality improved and porosity decreased. The selection of which shield gas, Ar or $N_2$, to obtain better surface quality, lower porosity, and higher hardness was examined. The formability and mechanical properties with a $N_2$ atmosphere are better than those parts formed under an Ar atmosphere.

Fabrication of Flexible OTFT Array with Printed Electrodes by using Microcontact and Direct Printing Processes

  • Jo, Jeong-Dai;Lee, Taik-Min;Kim, Dong-Soo;Kim, Kwang-Young;Esashi, Masayoshi;Lee, Eung-Sug
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.155-158
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    • 2007
  • Printed organic thin-film transistor(OTFT) to use as a switching device for an organic light emitting diode(OLED) were fabricated in the microcontact printing and direct printing processes at room temperature. The gate electrodes($5{\mu}m$, $10{\mu}m$, and $20{\mu}m$) of OTFT was fabricated using microcontact printing process, and source/drain electrodes ($W/L=500{\mu}m/5{\mu}m$, $500{\mu}m/10{\mu}m$, and $500{\mu}m/20{\mu}m$) was fabricated using direct printing process with hard poly(dimethylsiloxane)(h-PDMS) stamp. Printed OTFT with dielectric layer was formed using special coating system and organic semiconductor layer was ink-jet printing process. Microcontact printing and direct printing processes using h-PDMS stamp made it possible to fabricate printed OTFT with channel lengths down to $5{\mu}m$, and reduced the process by 20 steps compared with photolithography. As results of measuring he transfer characteristics and output characteristics of OTFT fabricated with the printing process, the field effect characteristic was verified.

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Silicon-Wafer Direct Bonding for Single-Crystal Silicon-on-Insulator Transducers and Circuits (단결정 SOI트랜스듀서 및 회로를 위한 Si직접접합)

  • Chung, Gwiy-Sang;Nakamura, Tetsuro
    • Journal of Sensor Science and Technology
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    • v.1 no.2
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    • pp.131-145
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    • 1992
  • This paper has been described a process technology for the fabrication of Si-on-insulator(SOI) transducers and circuits. The technology utilizes Si-wafer direct bonding(SDB) and mechanical-chemical(M-C) local polishing to create a SOI structure with a high-qualify, uniformly thin layer of single-crystal Si. The electrical and piezoresistive properties of the resultant thin SOI films have been investigated by SOI MOSFET's and cantilever beams, and confirmed comparable to those of bulk Si. Two kinds of pressure transducers using a SOI structure have been proposed. The shifts in sensitivity and offset voltage of the implemented pressure transducers using interfacial $SiO_{2}$ films as the dielectrical isolation layer of piezoresistors were less than -0.2% and +0.15%, respectively, in the temperature range from $-20^{\circ}C$ to $+350^{\circ}C$. In the case of pressure transducers using interfacial $SiO_{2}$ films as an etch-stop layer during the fabrication of thin Si membranes, the pressure sensitivity variation can be controlled to within a standard deviation of ${\pm}2.3%$ from wafer to wafer. From these results, the developed SDB process and the resultant SOI films will offer significant advantages in the fabrication of integrated microtransducers and circuits.

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Direct Fabrication of a-Si:H TFT Arrays on Flexible Substrates;Principal Manufacturing Challenges and Solutions

  • O’Rourke, Shawn M.;Loy, Douglas E.;Moyer, Curt;Ageno, Scott K.;O’Brien, Barry P.;Bottesch, Dirk;Marrs, Michael;Dailey, Jeff;Bawolek, Edward J.;Trujillo, Jovan;Kaminski, Jann;Allee, David R.;Venugopal, Sameer M.;Cordova, Rita;Colaneri, Nick;Raupp, Gregory B.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.251-254
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    • 2007
  • Principal challenges to $\underline{direct\;fabrication}$ of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. Viable solutions to address these challenges are described.

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Laboratorial technique for fabrication of outer diameter stress corrosion cracking on steam generator tubing (증기발생기 전열관 2차측 응력부식균열의 실험실적 모사 방법)

  • Lee, Jae-Min;Kim, Sung-Woo;Hwang, Seong-Sik;Kim, Hong-Pyo;Kim, Hong-Deok
    • Corrosion Science and Technology
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    • v.13 no.3
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    • pp.112-119
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    • 2014
  • In this work, it is aimed to develop the fabrication method of axial stress corrosion cracking (SCC) defects having various sizes, on the outer diameter surface of the steam generator (SG) tubings. To control the length of the artificial SCC defect, the specific area of the SG tubing samples was exposed to an acidic solution after a sensitization heat treatment. During the exposure to an acidic solution, a direct current potential drop (DCPD) method was adopted to monitor the crack depth. The size of the SCC defect was first evaluated by an eddy current test (ECT), and then confirmed by a destructive examination. From the comparison, it was found that the actual crack length was well controlled to be similar to the length of the surface exposed to an acidic solution (5, 10, 20 or 30 mm in this work) with small standard deviation. From in-situ monitoring of the crack depth using the DCPD method, it was possible to distinguish a non-through wall crack from a through wall crack, even though the depth of the non-through wall crack was not able to be precisely controlled. The fabrication method established in this work was useful to simulate the SCC defect having similar size and ECT signals as compared to the field cracks in the SG tubings of the operating Korean PWRs.

Development of Implantable Blood Pressure Sensor Using Quartz Wafer Direct Bonding and Ultrafast Laser Cutting (Quatrz 웨이퍼의 직접접합과 극초단 레이저 가공을 이용한 체내 이식형 혈압센서 개발)

  • Kim, Sung-Il;Kim, Eung-Bo;So, Sang-kyun;Choi, Jiyeon;Joung, Yeun-Ho
    • Journal of Biomedical Engineering Research
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    • v.37 no.5
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    • pp.168-177
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    • 2016
  • In this paper we present an implantable pressure sensor to measure real-time blood pressure by monitoring mechanical movement of artery. Sensor is composed of inductors (L) and capacitors (C) which are formed by microfabrication and direct bonding on two biocompatible substrates (quartz). When electrical potential is applied to the sensor, the inductors and capacitors generates a LC resonance circuit and produce characteristic resonant frequencies. Real-time variation of the resonant frequency is monitored by an external measurement system using inductive coupling. Structural and electrical simulation was performed by Computer Aided Engineering (CAE) programs, ANSYS and HFSS, to optimize geometry of sensor. Ultrafast laser (femto-second) cutting and MEMS process were executed as sensor fabrication methods with consideration of brittleness of the substrate and small radial artery size. After whole fabrication processes, we got sensors of $3mm{\times}15mm{\times}0.5mm$. Resonant frequency of the sensor was around 90 MHz at atmosphere (760 mmHg), and the sensor has good linearity without any hysteresis. Longterm (5 years) stability of the sensor was verified by thermal acceleration testing with Arrhenius model. Moreover, in-vitro cytotoxicity test was done to show biocompatiblity of the sensor and validation of real-time blood pressure measurement was verified with animal test by implant of the sensor. By integration with development of external interrogation system, the proposed sensor system will be a promising method to measure real-time blood pressure.

Femtosecond laser induced photo-expansion of organic thin films

  • Chae, Sang-Min;Lee, Myeong-Su;Choe, Ji-Yeon;Lee, Hyeon-Hwi;Kim, Hyo-Jeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.120.2-120.2
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    • 2015
  • We propose a novel direct writing technique with a femtosecond laser enabling selective modification of not only the morphology of conducting polymer thin films but also the orientation and alignment of the polymer crystal. Surface relief gratings resulting from photoexpansion on P3HT:PCBM and PEDOT:PSS thin films were fabricated by femtosecond laser direct writing. The photoexpansion was induced at laser fluence below the ablation threshold of the thin film. The morphology (size and shape) of photoexpansion could be quantitatively controlled by laser writing parameters such as focused beam size, writing speed, and laser fluence. GIWAX results showed that face-on P3HT crystals were largely increased in the photoexpansion in comparison with pristine region of the thin film. In addition, the face-on P3HTs in the photoexpansion were aligned with their orientation along the polarization of the laser. The micro-RAMAN spectra confirmed that neither chemical composition change nor the polymer chain breaking was observable after femtosecond laser irradiation. We believe that this laser direct writing technique opens a new door to the fabrication of more efficient OPVs via non-contact, toxic-free approach.

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