• 한국식품영양과학회지
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• 제35권9호
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• pp.1224-1231
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• 2006

고급불포화지방산인 docosahexaenoic acid ethylester (DHAEE)와 sucrose를 transesterification반응을 하여 sucrose ester를 기질 및 촉매의 비율, 반응시간, 용매사용 및 기압 등을 달리하여 합성하고, 합성율을 살펴보았고, 특히, 섭취 시 인체 내에서 이용 가능한 DHA를 함유하고 있으며, hydrophilic한 유화제로써 sucrose fatty acid mono ester의 합성율을 높이는 합성조건을 연구하였다. 무용매 상태에서의 sucrose ester의 합성율이 낮았기 때문에 반응용매로써 dimethyl sulfoxide(DMSO)를 사용하여 몰비율과 반응시간에 따른 합성을 실시하였다. 여러 반응조건 중 DHAEE의 전환율(%)은 sucrose:DHAEE의 몰비율이 1:0.98, 1:0.60, 1:0.40, 1:0.20인 SE#4, SE#5, SE#6, SE#7에서 모두 96% 이상을 나타내었다. 특히, SE#6(1:0.4 mole)에서 반응시간에 따른 전환율과 sucrose ester의 조성변화를 살펴본 결과, 반응시간 1시간일 때 55.3%의 전환율(mono ester 91.6%)을 보였고, 이후 반응 3.5시간일 때에는 97.1%(mono ester 66%)의 전환율을 보였다. 따라서 반응초기에 대부분의 sucrose ester가 합성되며, 특히 반응시간이 길어짐에 따라 mono ester에서 di-, tri- 및 polyester로 그 조성이 점차 변화됨을 확인하였고, 기질 중 DHAEE의 비율이 증가할수록 sucrose mono ester의 생성은 감소한 반면에, sucrose di-, tri- 및 polyester의 생성은 증가함을 확인하였다. 연구된 합성조건 중 sucrose mono ester의 합성은 1:0.2(sucrose:DHAEE)의 몰비율로 2.5시간동안 반응(SE#7)하였을 때 98.5%의 높은 전환율을 보이면서 그 조성은 87.3%로 가장 높게 합성되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.86.1-86.1
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• 2015

As the feature size of Si-based semiconductor shrinks to nanometer scale, we are facing to the problems such as short channel effect and leakage current. One of the solutions to cope with those issues is to bring III-V compound semiconductors to the semiconductor structures, because III-V compound semiconductors have much higher carrier mobility than Si. However, introduction of III-V semiconductors to the current Si-based manufacturing process requires great challenge in the development of process integration, since they exhibit totally different physical and chemical properties from Si. For example, epitaxial growth, surface preparation and wet etching of III-V semiconductors have to be optimized for production. In addition, oxidation mechanisms of III-V semiconductors should be elucidated and re-growth of native oxide should be controlled. In this study, surface preparation methods of various III-V compound semiconductors such as GaAs, InAs, and GaSb are introduced in terms of i) how their surfaces are modified after different chemical treatments, ii) how they will be re-oxidized after chemical treatments, and iii) is there any effect of surface orientation on the surface preparation and re-growth of oxide. Surface termination and behaviors on those semiconductors were observed by MIR-FTIR, XPS, ellipsometer, and contact angle measurements. In addition, photoresist stripping process on III-V semiconductor is also studied, because there is a chance that a conventional photoresist stripping process can attack III-V semiconductor surfaces. Based on the Hansen theory various organic solvents such as 1-methyl-2-pyrrolydone, dimethyl sulfoxide, benzyl alcohol, and propylene carbonate, were selected to remove photoresists with and without ion implantation. Although SPM and DIO3 caused etching and/or surface roughening of III-V semiconductor surface, organic solvents could remove I-line photoresist without attack of III-V semiconductor surface. The behavior of photoresist removal depends on the solvent temperature and ion implantation dose.

• Bulletin of the Korean Chemical Society
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• 제24권8호
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• pp.1181-1187
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• 2003

Condensation of 4-cyano-5,6-dimethyl-3-pyridazinone 1 with aromatic aldehydes gave the novel styryl derivatives 2a-c. Refluxing of compound 2a with phosphorus oxychloride furnished 3-chloropyridazine derivative 3. Compound 3 was reacted with thiourea and produced pyridazine-3(2H)thione 4. Thieno[2,3-c]- pyridazines 5a-e were achieved by cycloalkylation of compound 4 with halocompounds in methanol under reflux and in the presence of sodium methoxide. Also, refluxing of compound 4 with N-substituted chloroacetamide in the presence of potassium carbonate afforded thienopyridazines 6a-e. Cyclization of compound 6 with some electrophilic reagents as carbon disulfide and triethyl orthoformate furnished the novel pyrimido[4',5':4,5]thieno[2,3-c]pyridazines 12 and 13a-c, respectively. Diazotisation of compound 6 with sodium nitrite in acetic acid produced the pyridazino[4',3':4,5]thieno[3,2-d][1,2,3]triazines 14a-c. Ternary condensation of compound 1, aromatic aldehydes and malononitrile in ethanol containing piperidine under reflux afforded the novel phthalazines 16a-c. Compound 3 was subjected to some nucleophilic substitution reactions with amines and sodium azide and formed the aminopyridazines 17a, b and tetrazolo[1,5-b]-pyridazine 19, respectively. The structures of the synthesized compounds were established by elemental and spectral analyses.

• 한국환경보건학회지
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• 제18권2호
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• pp.102-105
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• 1992

냉각탑, 제지산업, 일반 산업용수 등에 사용되는 산업용 방부제의 유효 성분 isothiazolinone components 즉, 2-methyl-4-isothiazolin-3-one(unchlorinated compound)과 5-chloro-2-methy14-isothiazolin-3-one(chlorinated compound)을 고성능액체크로마토그래피로서 분리, 정량하였다. 역상의 C$_{18}$ column (15 cmX3.9 mm I.D.)을 사용하였으며 자외선 검출기의 파장 254 nm에서 methanol-0.4% acetic acid(40 : 60)의 이동상, methanol-0.4% acetic acid(30: 70)의 추출 및 주입용매 조건으로 HPLC 분리를 시도한 결과 unchlorinated compound는 10~32,400 mg/l 범위에서, 그리고 chlorinated compound는 120~107,400 mg.l의 범위에서 직선성을 보였다. 내부 표준물질로서 dimethyl phthalate를 사용하였으며, unchlorinated compound, chlorinated compound 및 내부 표준물질의 순서로 븐리가 일어났고 총 분리시간은 6.41분이었다. 상기의 조건으로 시험물질을 분석, 정량한 결과 예측농도치에 근접한 수치를 얻었다.

• 보존과학회지
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• 제37권4호
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• pp.370-379
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• 2021

In the past, PVAc [poly(vinyl acetate)] was used as a fixative for the conservation of the murals in the murals of the Payathonzu temple located in Bagan, Myanmar. In this study, attention was paid to gel cleaning as a method for stably removing such PVAc fixatives. Based on the recent research trend related to the cleaning of murals in Bagan ruins, 3 types of gelling agents (Nevek^®, Laponite^®RD, Carbopol^®980) and 2 types of organic solvents (Acetone, Dimethyl carbonate) were selected. Six types of gel cleaners were prepared by mixing gelling agents and organic solvents, and the properties and fixative removability of these cleaners were compared. As a result of confirming the properties of the prepared gel cleaners, the pH of the cleaners was all in the weak acidic to weakly alkaline range, which was a stable condition for mural application. Also, there was no difference in the viscosity of the cleaners depending on the type of solvent, but there was a difference depending on the type of gelling agent used. Regarding the weight loss ratio of PVAc, which is an indicator of removability, the exposure conditions of the gel cleaners, the boiling point of the solvent used, and the viscosity of the gelling agent acted as factors affecting. As a result of comparing the removability of gel cleaners, it was confirmed that the solvent's fixative solubility, the volatility of the solvent itself, and the solvent release control properties of the gelling agent had a great effect on the removability of the gel cleaners. In Part 2, the stability and the running applicability of the gel cleaners will be investigated by making mockup samples reflecting the properties of the materials and techniques used to produce the mural paintings in the Payathonzu Temple.

• 청정기술
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• 제12권3호
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• pp.128-137
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• 2006

초임계이산화탄소 내에서 이온성액체의 부피 변화와 상온 이온성액체와 유기화합물의 혼합물이 두 상으로 분리되는 현상을 고압 view cell을 이용하여 측정하였다. 이온성액체(ionic liquid, IL)로는 1-butyl-3-methylimidazolium hexafluorophosphate ([bmim][$PF_6$])와 1-butyl-3-methylimidazolium tetrafluoroborate ([bmim][$BF_4$])를 사용하였으며, 유기화합물로는 methanol과 dimethyl carbonate를 사용하였다. 일정한 양의 [bmim][$PF_6$]에 대하여 유기화합물의 양을 증가시킴에 따라 상이 나누어지는 지점인 lower critical end point (LCEP) 압력이 감소하였다. 이온성액체의 수분함량이 증가함에 따라 LCEP가 높게 나타났으며, 일정량 이상의 수분이 함유되어 있으면 LCEP가 나타나지 않았다. LCEP는 같은 부피의 [bmim][$PF_6$]에서보다 [bmim][$BF_4$]에서 약 1.0 MPa 정도 높게 나타났으며, K-point는 이온성액체의 종류와 유기화합물의 양에 따라 거의 변화하지 않았다. 초기시료 중 이온성액체([bmim][$PF_6$])의 농도 (IL/(IL+MeOH))가 7.23 mol% 보다 크면 혼합물의 LECP에서 $L_1$의 부피가 $L_2$의 부피보다 크게 나타났으며, 반대로 작으면 작게 나타났다. 이산화탄소의 존재 하에서 이온성액체의 부피변화는 온도가 증가함에 따라 감소하였으며, 313.15 와 343.15 K 사이에서는 압력이 증가함에 따라 증가하여 300 bar에서는 원래 부피의 123~126 %가 되었다.

• 한국산업보건학회지
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• 제33권4호
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• pp.517-527
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• 2023

Objectives: We examine cases of chemical poisoning that occurred in the cleaning of metal parts and the regulations on halogenated solvents in other countries and propose regulations necessary to prevent chemical poisoning from halogenated solvents. Methods: We collected cases of chemical poisoning through the website of the Korea Occupational Safety and Health Agency. A review of the literature was conducted focusing on regulations related to halogenated solvents in the United States and the European Union, particularly for cleaning metal parts. Among the Material Safety Data Sheets submitted to the government, MSDS containing eleven substances were extracted to confirm the composition and product use. We investigated cleaning methods for metal parts used in South Korea. For the hazard classification, the European Chemicals Agency or Japan's NITE's website was used. Results: In the case of poisoning, the cleaning methods involving trichloromethane were dipping and dry, which was not found in the literature. It was confirmed that many halogenated solvents and dimethyl carbonate were used for metal cleaning in South Korea. In vapor degreasing using TCE in the USA, even if the facility is strictly managed, such as by installing cooling coils in open cleaning facilities, the risk of exposure to TCE is considered to be not only carcinogenic but also a concern for acute and chronic effects. In comparison, exposure through Korean work methods such as dipping and drying operations is inevitably much higher. Conclusions: The transition to water-based cleaning with low-hazard chemicals should be a priority in the cleaning process. In the case of metal parts that require precise cleaning, if the use of a halogenated solvent is inevitable, a closed degreasing facility should be used to minimize exposure. The current regulations in the Occupational Safety and Health Act, the Chemical Substances Control Act, and the Air Environment Conservation Act do not require cleaning facilities to minimize emissions. To protect the health of workers using halogenated solvents to clean metal parts, regulations that require a fundamental reduction in exposure will be necessary.