• Korean Journal of Materials Research
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• v.2 no.4
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• pp.257-262
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• 1992

The cure kinetics of a diglycidyl ether of bisphenol A (DGEBA) with 4, 4'-methylene dianiline (MDA) added succinonitrile was studied through the dynamic run method by applying the data to the Kissinger equation which analyses the effect of the heating rate on the temperature at maximum reaction rate using Differential Scanning Calorimetry (DSC) analyzer in the range of 3$0^{\circ}C$-35$0^{\circ}C$. In the DGEBA/MDA system with SN, the activation energy ($E_a$) and the pre-exponential factor (A) were calculated. From these results, the rate constants (k) were obtained according to the different SN contents.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.145-150
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• 1993

Abstract In order to improve the brittleness of diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA) system, the reactive additive, succinonitrile(SN) was added to DGEBA/MDA system. In this case, thermal properties, glass transition temperature(Tg), thermal decomposition temperature(Td) and 5% weight loss temperature($T_{-5%}$)were investigated according to the different SN contents and cure temperatures. Tg, Td and $T_{-5%}$ decreased as the SN content was increased, but increased as the cure temperature was increased.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.467-472
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• 1999

The isothermal cure behavior of diglycidyl ether of bisphenol A(DGEBA) 4,4'-methylene dianiline(MDA) system with various contents of neopentyl glycol(NPG) has been analyzed by differential scanning calorimetry(DSC). TO increase the cure rate of DGEBA/MDA system, NPG was introduced as an accelerator. Regardless of the NPG content, the shape of the conversion curves showed sigmoid indication that DGEBA/MDA/NPG system followed autocatalytic cure reaction. The cure reaction of DGEBA/MDA system increased with the increment of NPG content and it was due to the catalytic role of hydroxyl groups of NPG.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.667-672
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• 1995

Cure kinetics of DGEBA(diglycidyl ether of bisphenol A)/MDA(4, 4'-methylene dianiline)/SN(succinonitrile) system and DGEBA/MDA/SN/HQ(hydroquinone) system was studied by Kissinger equation and Fractional life method through DSC in the temperature range of 85∼150$^{\circ}C$. As cure temperature was increased, reaction rate increased and reaction order was almost constant. The reaction rate of the system with HQ as a catalyst was more higher and activation energy of that was lower about 20% than those of the system without HQ. Starting temperature of cure reaction for DGEBA/MDA/SN/HQ system decreased about 30$^{\circ}C$ than that of DGEBA/MDA/SN system.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.191-196
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• 1992

The new epoxy resin, diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline (MDA)/succinonitrile system, containing the reactive additive succionitrile was investigated through the impact test and the stress-strain test on the basis of the behavior of cure reaction and the cure mechanism. The new epoxy resin system, having the different succinonitrile contents, were cured at $80^{\circ}C$for 1.5 hour and then in order to cure completely at $150^{\circ}C$ for 1 hour. It was shown that as the succinonitrile content increased, impact strength was gradually increased, tensile strength was decreased, almost constantly Young's modulus was sustained and elongation was increased until the succinonitrile content was increased to 10phr, and then decreased. From the experimental results, it can be concluded that the chemical bonding length between the main chains was extended by adding the reactive additive succinonitrile. It was also found that the flexibility of epoxy resin was improved by adding the succinonitrile.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.797-801
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• 1998

The cure kinetics for diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA) system with or without lOphr of phenyl glycidyl ether(PGE)-acetamide(AcAm) was studied by autocatalytic cure expression. On the dynamic DSC curves, the exothermic peak temperature and the onset temperature of reaction decreased with the addition of PGE-AcAm. Regardless of the addition of PGE-AcAm, the shape of the conversion curve showed sigmoid, and this meant that DGEBA/MDA and DGEBA/MDA/PGE-AcAm systems followed autocatalytic cure reaction. When PGE-AcAm was added to DGEBA/MDA system, the cure rate increased about 1.2~1.4 times due to the catalytic role of hydroxyl groups in PGE-AcAm.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.317-320
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• 2013

Partial discharge resistance for the epoxy systems with two diluents was investigated in the rod-plane electrodes arrangement, and the effect of electric frequency on the partial discharge resistance was also studied. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and 1,4-butanediol diglycidyl ether (BDGE) or polyglycol (PG) as a reactive diluent was introduced to the DGEBA system, in order to decrease the viscosity of the DGEBA epoxy system. BDGE was acted as a chain extender, and PG acted as a flexibilizer, after the curing reaction. To measure the partial discharge resistance, 5 kV alternating current (ac) with three different frequencies (60, 500 and 1,000 Hz) was applied to the specimen in a rod-plane electrode arrangement, at $30^{\circ}C$. PG had a good effect, while BDGE had a bad effect on the partial discharge resistance of the DGEBA system, regardless of the electric frequency.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• Applied Chemistry for Engineering
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• v.5 no.3
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• pp.517-523
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• 1994

The effects of cure kinetics and mechanism of DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline) with SN(succinonitrile) and HQ(hydroquinone) as an additive and accelerator were investigated. Cure kinetics was evaluated by Kissinger equation and fractional-life method through DSC analysis. The activation energy has hydroxyl group as an accelerator, the activation energy and the starting cure-temperature were lower than those of DGEBA/MDA/SN system. Cure mechanism of those systems was investigated through FT-IR according to the various SN contents. The ratio was SN : HQ = 4 : 1. It has been known that the cure reactions of an epoxy-diamine system are composed of primary amine-epoxy reaction, secondary amino-epoxy reaction and epoxy-hydroxyl group reaction. But in DGEBA/MDA/SN system, primary amino-CN group reaction and CN group-hydroxyl group reaction were added to the above mentioned reactions. These reactions attributed to the long main chain and the low crossliking density. And in DGEBA/MDA/SN/HQ system, hydroxyl group of HQ formed a transition state with epoxide group and amime group and also opened the ring of the epoxide group rapidly, then amino-epoxy reaction took place easily.

• Macromolecular Research
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• v.13 no.3
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• pp.223-228
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• 2005

In the present work, a low-density polyethylene (LDPE) composite, filled with Zn-ion coated structural silica encapsulated with the diglycidyl ether of bisphenol-A (DGEBA), was synthesized using the conventional melt-blending technique in a sigma internal mixer. The catalytic activity of the Zn-ions (originating from the structural silica) towards the oxirane group (diglycidyl ether of bisphenol-A (DGEBA): encapsulating agent) was assessed by infrared spectroscopy. Two composites, each with a filler content of $2.5 wt\%$ were developed. The first one was obtained by melt blending the Zn-ion coated structural silica with LDPE in a co-rotating sigma internal mixer. The second one was obtained by melt blending the same LDPE, but with DGEBA encapsulated Zn-ion coated structural silica. Epoxy resin encapsulation of the Zn-ion coated structural silica resulted in its having good interfacial adhesion and a homogeneous dispersion in the polymer matrix. Furthermore, the encapsulation of epoxy resin over the Zn-ion coated structural silica showed improvements in both the mechanical and thermal properties, viz. a $33\%$ increase in the elastic modulus and a rise in the onset degradation temperature from 355 to $371^{\circ}C$, in comparison to the Zn-ion coated structural silica.