• 한국주조공학회지
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• 제27권4호
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• pp.153-158
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• 2007

Molten metal flow in vacuum die casting was characterized by a numerical analysis. The VOF method was used to simulate the filling behaviors of molten metal during filling process. The various vacuum degrees of no vacuum(760 mmHg), 650, 500, 250 and 60mmHg were artificially applied in cavity. And the filling behaviors of molten metal with the applied vacuum conditions were simulated and compared with those of experiment. The results showed that molten metal was partially filled into cavity when vacuum was applied and the filling length of molten metal in cavity was increased with increasing applied reduced pressure in cavity. Also, the simulated filling behaviors of molten metal were apparently similar to those of experiment, indicating the numerical analysis developed in this study was highly effective. Through the result of fluid flow simulation, both relation equations of filling length and filling velocity with the variation of pressure conditions in cavity were calculated respectively and the internal gas contents of casting was significantly reduced by the modification of vacuum gate system.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

• Design & Manufacturing
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• 제6권2호
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• pp.79-83
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• 2012

Inner part is used as an insulator in wire fuses. After injection molding, inner part has been showed flashes, filling defects and deformation. After production, operators have to cut off flashes, one by one. this process leads to continuous low productivity and loss of source materials. This study focuses on identifying the causes for flashes, filling defects, clamping force of injectors, mold adhesion, resin of liquidity and others, and on resolving those issues.

• Design & Manufacturing
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• 제8권2호
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• pp.50-55
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• 2014

Recently, semi-stack mold have been developed for satisfying the various elements required in the mold industry. The mold is possible using with general-purpose injection molding machine by weight reduction through the improvement of the mold structure. In order to do that, tension core, spiral cooling system and half runner system were applied. It is effective for increased productivity and decreased of loss to the materials. However, the mold is required the filling balance in order to improve the quality and efficiency. Thus this study performed that optimum design and analysis of semi-stack mold for filling balance.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.425-428
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• 2006

A semi-solid forming technology has some advantages compared with conventional forming processes such as die casting, squeeze casting and hot/cold forging. In this study, the numerical analysis of semi-solid filling has been studied with solid fraction fs = 30% of A356 aluminum alloys. The finite difference program of two-phase flow model of Navier Stokes' equation coupled with heat transfer and solidification has been developed to predict a filling pattern, liquid segregation and temperature distribution of semi-solid metals. It gives die filling patterns and final solidification area. It can predict mechanical properties of semi-solid forming processes.

• Design & Manufacturing
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• 제2권3호
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• pp.6-9
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• 2008

This paper describes the process of structure analysis and injection molding analysis to manufacture the forming injection dies for huge glass insert. Factors such as filling time, filling pressure, material temperature, shrinkage, warpage were investigated by using the analysis software, Moldflow. Runner system and cavity structure were designed and manufactured through the results of deformation analysis data for glass insert. Filling time and filling pressure were analyzed in 3.756sec and 43.37MPa.

• Design & Manufacturing
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• 제6권2호
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• pp.31-36
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• 2012

Now days CAE has been used for almost all injection molding designs in order to find the best injection conditions. Almost all CAE use 2-D mesh, but the CAE with 2-D mesh can't indicate such as jetting, flow-mark and filling imbalance in multi cavity mold. In this study, we suggested a new 3D meshing. the method which can indicate the filling imbalance in geometrically balanced runner system with Mold Flow MPI 6.1 and we found out that the calculation times are saved. As a feasibility study, we verified that Melt Flipper, RC Pin etc appeared the balanced filling behaviors. of geometrically balanced runner system and Melt Flipper, filling imbalance was indicated more accurately.

• Journal of Welding and Joining
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• 제32권3호
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• 소성∙가공
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• 제6권3호
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• pp.239-249
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• 1997

The behaviour of alloys in the semi-solid state strongly depends on the imposed stress state and on the morphology of the phase which can vary from dendritic to globular. To optimal net shape forging of semi-solid materials, it is important to investigate for filling phenomena in forging process of arbitrarily shaped dies. To produce a automotive part which has good mechanical property, the filling pattern according to die velocity and solid fraction distribution has to be estimated for arbitrarily shaped dies. Therefore, the estimation of filling characteristic in the forging simulation with arbitrarily shaped dies of semi-solid materials are calculated by finite element method with proposed algorithm. The proposed theoretical model and a various boundary conditions for arbitrarily shaped dies is investigated with the coupling calculation between the liquid phase flow and the solid phase deformation. The simulation process with arbitrarily shaped dies is performed to the isothermal conditions of two dimensional problems. To analysis of forging process by using semi-solid materials, a new stress-strain relationship is described, and forging analysis is performed by viscoelastic model for the solid phase and the Darcy's law for the liquid flow. The calculated results for forging force and filling limitations will be compared to experimental data. The filling simulation of simple products performed with the uniform billet temperature(584$^{\circ}C$) from the induction heating by the commercial package MAGMAsoft. The initial step of computation is the touching of semi-solid material with the end of die gate and the initial concept of proposed system just fit with the capability of MAGMAsoft.

• Design & Manufacturing
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• 제2권6호
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• pp.23-27
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• 2008

It is well known that the family-mold has an advantage to reduce the cost for production and mold. However, defects are frequently occurred by over packing the smaller volume cavity during molding, especially when the family-mold has a volumetric difference between two cavities. In this study, the cavity-filling imbalance was confirmed by the temperature and the pressure sensors, and a variable-runner system was developed for balancing the cavity-filling. Experiments of balancing the cavity filling was carried out in the family-mold with the variable-runner system, and balancing the cavity-filling was confirmed by changing the cross-sectional area of a runner in the variable-runner system with the temperature and pressure sensors. The influence of the injection speed to the balancing-capability of the variable-runner system was also examined in the experiment.