• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.29-29
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• 2005

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.257-262
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• 2005

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.33-38
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• 2004

In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

• Transactions of Materials Processing
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• v.21 no.3
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• pp.186-194
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• 2012

Hot stamping is a forming method that offers various advantages such as superior mechanical properties, good formability, and very small springback. However, relatively large-sized parts, such as front pillars, exhibit poor formability when hot stamped due to the limited material flow and thickness reduction imparted by the process. This reduction in thickness can also lead to cracks. One of the reasons is the relatively high friction between the sheet and the die. In this study, in order to obtain the optimal conditions for hot stamping of front pillars, various process parameters were studied and analyzed using the sheet forming software, J-STAMP. The effects of various parameters such as the die structure, blank shape, blank holding force, punch speed, clearance(upper and lower dies) and distance block were analyzed and compared.

• Transactions of Materials Processing
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• v.17 no.6
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• pp.436-442
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• 2008

As the structure of a mobile phone becomes thin to catch up with a slim product trend, the structural strength and resistance to shock of TFT-LCD module are getting to be reduced. Hence, TFT-LCD module is the strength reinforced by bezel frame. The bezel frame was produced by the multi hemming processes with several folding parts. The determination of the optimal number of hemming part and structure of bezel frame are very important process parameter to obtain the strength of that. The effect of process parameters on strength of bezel frame was investigated by FEA. Based on the result of FEA, the experiment was performed using manufactured hemming die, the result of the experiment was compared with FEA and verified. Also, three point bending tests were performed to check the strength of bezel frame.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

• Transactions of Materials Processing
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• v.26 no.2
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• pp.115-120
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• 2017

Porthole extrusion process is a very effective metal forming process to produce aluminum profiles with hollow sections. The structure of porthole extrusion die is very complex. In this process, the billet is divided by porthole bridge, and then the divided billet is welded in the welding chamber. The welding pressure in the welding chamber is very important. The higher welding pressure improves the quality of the aluminum profiles. Therefore, the objective of this study is to develop a new porthole extrusion die for improving the welding pressure in the welding chamber by using numerical analysis. The effectiveness of the new porthole extrusion die was verified by using numerical analysis. Through numerical analysis, the welding pressures in the welding chamber between the new porthole die and the conventional porthole die were compared with each other.

• Transactions of Materials Processing
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• v.23 no.5
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• pp.303-310
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• 2014

Functionally graded properties are characterized by the gradual variation in composition and structure through the volume of the material, resulting in corresponding gradation in properties of the material. Direct laser melting (DLM) is a prototyping process whereby a 3-D part is built layer-wise by melting metal powder with laser scanning. Studies have been performed on the functionally graded properties induced by direct laser melting of compositionally selected metallic powders. For the current study, quadrangle structures were fabricated by DLM using Fe-Ni-Cr powders having variable compositions. Hardness and EDX analysis were conducted on cross-sections of the fabricated structure to characterize the properties. From the analysis, it is shown that functionally graded properties can be successfully obtained by DLM of selected metallic powders with varying compositions.

• Design & Manufacturing
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• v.16 no.2
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• pp.53-59
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• 2022

Unlike other press forming processes, ISF (Incremental sheet forming) doesn't require a punch and die set. However, during the ISF processes unwanted bending deformation occurred around the target geometry. This paper is aimed to analyze the effect of the die structure, which is supported by bolts, on the geometric accuracy of the ISF processes. In this research, the ISF processes with Al5052 sheet of 0.5 mm, the tool diameter of 6 mm and the stepdown of 0.4 mm was employed. L-shaped, step-shaped, relief-shaped geometry were employed in experiments. Sectional view and the plastic strain were compared. From this research we find out that the bolt supported ISF processes increases the geometric accuracy of products very effectively.