• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 춘계학술대회 논문집
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• pp.125-128
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• 2002

The automotive industry have made an effort to reduce the weight of vehicle structures with increased safety, while initial model of the final product does not contain any prehistoric effects in a design stave. It takes lots of time to calculate forming effects that have great influences on the energy absorption of structures. In this paper, finite element inverse analysis is adopted to calculate forming effects, such as thickness variation and effective plastic strain as well as an initial blank shape with small amount of computation time. Crash analysis can be directly performed after inverse analysis of the forming process without remeshing scheme. The direct mesh mapping method is used to calculate an initial guess from the sliding constraint surface that is extracted from the die and punch set. Analysis results show that energy absorption of structures is increased with consideration of forming effects and finite element inverse analysis is usefully applicable to calculate forming erects of vehicle structures for the crash analysis.

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

• 한국주조공학회지
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• 제29권5호
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• pp.238-243
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• 2009

This study has been carried out to investigate the cooling ability improvement of diecasting mold by decompression cooling system. The decompression cooling system was applied to the new/used oil pump cover molds. The temperature of the surface mold applied the decompression cooling system fell to 15 degrees, especially in case of the used mold. The defect ratio of the oil pump cover manufactured by decompression cooling system has decreased from 2.8 percent to 0.2 percent. According to the results of the cooling ability improvement of diecasting mold by decompression cooling system, the decompression degree and supply pressure were set up the control item to apply the decompression cooling system to the diecasting mold in the industry field.

• 소성∙가공
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• 제20권4호
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• pp.273-278
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• 2011

Employing the TRIZ problem solving technique, a hybrid-type center plate for the molten carbonate fuel cell(MCFC) was developed for the purpose of improving gas sealing and maintenance. The manufacturing method of the hybrid-type center plate was divided into a trimming operation and a two-step bending process. In the latter, a modified punch shape was used to reduce springback. Using finite element(FE) simulations, bending stresses in the thickness and the in-plane directions were computed and the bending conditions were optimized. The optimized results of the two-step bending process were used as a basis for the design of the trimming process of the hybrid-type center plate. Finally, the external manifold-type center plate and the hybrid-type center plate were fabricated using a die set that accounts for the optimized conditions. It was found that the numerical simulation results were in good agreement with the experiments.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1276-1277
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• 2006

The ever increasing requirements on today's compacts with regard to their geometry and precision call for flexible high-precision and most capable production systems. DORST Technologies has coped with these requirements by developing the new HP series for pressing forces between 1600 kN and 16000 kN and the new HS series for pressing forces between 150 kN and 1200 kN. These fully hydraulic presses featuring upper ram, lower ram, core rod, filler, up to 4 lower tool levels and up to 4 upper tool levels with closed-loop controlled movements. Thanks to latest servo technology and an electronic bus system it is possible to have all movements closed-loop controlled in the desired relation to each other. Thus, today's hydraulic presses provide high stroke rates, low energy consumption and a user-friendly interface. The input of data is carried out via clearly arranged screen masks on a touch-screen. The innovative DORST $IPG^{(R)}$ (Intelligent Program Generator) has been designed to support the set-up staff in preparing and optimizing the toolprogram. The combination of the machine type with the hydraulic unit determines the productivity in consideration of the specific application and the part to be pressed. Thanks to the closed-loop control circuits, DORST hydraulic automatic presses of the latest generation ensure unmatched precision and repeatability - and consequently process reliability - often without necessitating subsequent machining steps.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• 소성∙가공
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• 제13권7호
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• pp.586-593
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• 2004

A terminal pin, which is a part of high-voltage capacitors, has a plate-shaped head section with thickness of 0.8mm. The current manufacturing process, in which the head section is welded on the body part, has given wide deviations of part qualities such as geometrical accuracy, mechanical strength and electrical stability. In this study, a cold forging process sequence was designed in order to produce the terminal pin as one piece. The plate-shaped head section requires an upsetting in the lateral direction of a cylindrical billet, which is followed by a blanking process. The deformed geometry of the lateral upsetting, however, could not be predicted precisely by intuition since metal flows of an axial and a lateral direction of the cylindrical billet would occur simultaneously. Therefore, in this study, three dimensional finite element analyses were applied to the lateral upsetting process in order to determine a proper diameter and height of the cylindrical billet. Once the geometry of the initial billet was determined, intermediate forging processes were designed by applying cold forging guidelines and the designed process sequence was verified by two dimensional finite element analysis. In addition, cold forging tryouts were conducted by using a die set, which was manufactured based on the designed process and finally we found that the part qualities were improved by the proposed cold forging process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.370-374
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• 2005

This study deals with the method of post-processing in the automatic tool path generation for 5-axis NC machining. The 5-axis NC machining cannot only cope with the manufacturing of complicated shapes, but also offers numerous advantages such as reasonable tool employment, great reduction of set-up process and so on. Thus 5-axis NC machining has been used fur aircraft parts, mold and die as well as for complicated shapes such as impeller, propeller and rotor. However, most of the present CAM systems for 5-axis NC machining have limited functions in terms of tool collision, machine limits and post-processing. Especially 5-axis machine configurations are various according to the method which the rotational axes are adapted with the table and spindle. For that reason, in many cases the optimal numerical control (NC) data cannot be obtained or considerable time is consumed. To solve this problem, we applied a general post-processor fur 5-axis NC machining. The validity of this post-processor should be experimentally confirmed by successfully milling to a helix shaped workpiece.

• 대한기계학회논문집A
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• 제21권6호
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• 반도체디스플레이기술학회지
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• 제20권3호
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• pp.1-5
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• 2021

Sleep apnea refers to a condition in which a person does not breathe during sleep, and is a dangerous symptom that blocks oxygen supply in the body, causing various complications, and the elderly and infants can die if severe. In this paper, we present an algorithm that classifies sleep breathing by analyzing the intensity of breathing with images alone in preparation for the risk of sleep apnea. Only the chest of the person being measured is set to the Region of Interest (ROI) to determine the breathing strength by the differential image within the corresponding ROI area. The adult was selected as the target of the measurement and the breathing strength was measured accurately, and the difference in breathing intensity was also distinguished using depth information. Two videos of sleeping babies also show that even microscopic breathing motions smaller than adults can be detected, which is also expected to help prevent infant death syndrome (SIDS).