• Journal of Korean Society of Industrial and Systems Engineering
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• v.34 no.2
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• pp.103-111
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• 2011

The reduction of setup time is very important in a lot production system. A punch press is a typical system of lot production. This paper describes a case study to reduce setup time of a punch press manufacturing system. Especially, this case study reduced the time of die exchange in the case that the standardization of die height is impossible realistically because of diversity on die height and heavy expenses. This study adopts a supplementary die and supplementary blocks to make the use of auto-clamping device possible. The paper also gives a sequencing algorithm to reduce the number of exchange of the supplementary die.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.2
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• pp.38-47
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• 2001

This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

• Design & Manufacturing
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• v.13 no.2
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• pp.49-53
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• 2019

The temperature distribution and lifetime of molds were predicted by computer simulation analysis with various spraying and blowing process of high pressure die casting. After varying the spraying angle and time, the mold temperature, heat exchange and mold life were predicted. As the spraying angle increases, the maximum temperature of the mold decreases, which is because the spraying area increases and the heat exchange with the mold increases. Heat exchange occurs more actively in the blowing process than in the spraying process. This is because the cooling is not performed due to the steam generation. When the spraying angle is 50 degree, the minimum life of the mold is analyzed 200 times. After adjusting the blowing time from 5s to 3s, the minimum lifetime of the mold has been increased almost twice.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.12
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• pp.230-238
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.123-132
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from pasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64). Transference of data between AutoCAD and I-DEAS Master Series Drafting is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of five modules, which are input and shape treatment, production feasibility check, strip-layout, data-conversion and die-layout modules. The process planning and Die design system is designed by considering several factors, such as complexities of blank geometry, punch profiles, and the availability of a press equipment and standard parts. This system provides its efficiecy for strip-layout, and die design for lead frame, semiconductor.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.1
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• pp.32-37
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• 2002

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.118-124
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• 2002

The use of ceramic inserts in hot extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper, process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The shrink fit analysis has been performed that enables optimal design of the dies taking into account the elastic deflections which generated in shrink fitting the die inserts and that caused by the stresses generated in the process and by using DEFORM software for process analysis. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the die design. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads. The results are compared with the experimental ones for verification.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.72-77
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• 2001

The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.3
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• pp.9-17
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• 2000

The use of ceramic inserts in steel forging tools offers significant technical and economic advantages over other materi-als of manufacture. These potential benefits can however only be realised by optimal design of the tools so that the ceramic insert are not subjected to stresses that led to their premature failure. In this paper the data on loading of the tools is determined from a commercial forging simulation package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite-element die-stress analysis. Process simulation and stress analysis are thus combined during the design and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic detections generated in shrink fitting the die inserts and that caused by the stresses generated in the forging process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads. Simulation results have been validated as a result of experimental investigation. Laboratory tests on ceramic insert dies have verified the superior performance of the Zirconia and Silicon Nitride ceramic insert in order to prolong maintenance life.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.9
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• pp.4111-4116
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• 2013

The progressive die producing continuously while transferring in order a multiple process is processing law that it is efficient and quality is excellent. In this study the position of precision secured that it occurred when be welded exhaust efficiency of gas boiler combustion exhaust pipe and the exhaust pipe which is cause of incomplete combustion for the purpose of productivity increase. it add burring to a product form and progressive die make die don't disassemble and it be able to exchange burring punch the position of precision and productivity by progressive die is able to improve.