• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.91-101
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• 2017

In this study, we conducted the preliminary research for high speed laser cutting of LED module. In particular, the feasibility of ultra-high speed laser cutting of 100 mm/s which exceeds the cutting speed of conventional dicing saw was examined. For this, copper/ceramic and silicone/ceramic hybrid substrates, which are the components of the LED module, were fabricated, and the surface morphology, surface roughness and flexural strength of the laser-cut samples were investigate and compared with the dicing-cut samples. To investigate optimal laser cutting conditions for hybrid substrates, the effects of various laser cutting conditions on cutting surface characteristics were studied using single ceramic and copper substrate. Optimal laser cutting conditions of the hybrid substrates were the use of Ar assist gas, high laser power and high assist gas pressure. Comparing the cutting surface of the hybrid substrates, the surface characteristics of the laser-cut samples are slightly inferior to those of the dicing-cut samples. The average surface roughness of the laser-cut samples was about $9{\mu}m$, and that of the dicing-cut samples was about $4{\mu}m$. However, considering very low cutting speed (3 mm/s) of the dicing saw, the surface morphology of the laser-cut sample was relatively uniform, and the surface roughness was not much different from that of the dicing-cut sample. The flexural strength of the laser-cut samples was equivalent to or slightly inferior to the flexural strength of dicing-cut samples. However, if the laser processing conditions are sufficiently optimized, the ultra-high speed laser cutting of the LED module will be possible.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.6
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• pp.1-6
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• 2017

Recently, the brittle materials such as ceramics, glass, sapphire and textile material have been widely used in semiconductors, aerospace and automobile owing to high functional characteristics. On the other hand, it has the characteristics of difficult-to-cut material relative to all materials. In this study, diamond electro-deposited band-saw machine was developed to operate stably using water-coolant type through relative motion between band-saw tool and $Al_2O_3$ material. High densified $Al_2O_3$ material was manufactured by spark plasma sintering method. The bulk density was observed by the Archimedes law and the theoretical density was estimated to be $3.88g/cm^3$ and its hardness 14.7 MPa. From the dicing sawing test of $Al_2O_3$ specimen, behavior of surface roughness and band-saw wear are dominantly affected by the increase of the band-saw linear velocity. Additionally, an continuous pattern type of diamond band-saw was a very effective due to entry impact as a one-off for brittle material.

• The Magazine of the IEIE
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• v.40 no.12
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• pp.59-64
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• 2013

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.3-8
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• 2000

• 한국전자현미경학회:학술대회논문집
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• 2004.11a
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• pp.157-159
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.963-966
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• 2000

Plasma display panel (PDP) is a type of flat panel display utilizing the light emission that is produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalk from adjacent sub-pixels. Mold for forming barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing process such as screen printing, sand-blasting and photosensitive glass methods. Mold for PDP barrier ribs have stripes of micro grooves transferring stripes of glass-material wall. In this paper. Stripes of grooves of which width 48 um, depth 124um, pitch 274um was acquired by machining the material of WC with dicing saw blade. Maximum roughness of the bottom and sidewall of the grooves was respectively 120 nm, 287 nm. Maximum tilt angle caused by difference between upper-most width and lower-most width was 2$^{\circ}$. Maximum Radius of curvature of bottom was 7.75 ${\mu}{\textrm}{m}$. This results meets the specification for barrier ribs of 50 inch XGA PDP. Forming the glass paste will be followed by using mold in the near future.

• Korean Journal of Optics and Photonics
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• v.16 no.4
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• pp.340-344
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• 2005

Microlens cells of Ge-doped BPSG (Boro-Phospho-Silicate Glass) are fabricated by dicing the film produced by FHD (Flame Hydrolysis Deposition). Microlens arrays of $53.4{\mu}m$ square unit are produced by the thermal reflow of the diced unit cells at $1200^{\circ}C$. The gap between the microlenses was about $70{\mu}m,$ and the thickness of the produced lens was about $28.4{\mu}m$. We analyzed the reflowed shape of the microlens cell by an image-process technique, and the focal length was about $62.2{\mu}m$. This method of fabricating a microlens is simple and inexpensive compared to the conventional method using the photolithographic process. Also, the control of the radius of curvature of the microlens is easier and a more precise microlens way of various types can be fabricated using this method.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.53-60
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• 2003

CCD(Charge-Coupled Device) wafers, with a layer of micro lenses on top, usually are not passivated with dielectric films. Micro lenses, in general, are made of polymer material, which usually has a large affinity for particles generated in the various chip fabrication processes, most notably the wafer sawing for chip-dicing. The particles deposited on the micro lens layer either seriously attenuate or deflect the incoming light and often lead to CCD failure. In this study we introduce new type of saws which would significantly reduce the particle-related problems found in conventional type of saws. In the new saws, the positions and diverging angles of side and center nozzles have been optimized so as to flush the particles effectively. In addition, an independent nozzle is added for the sole purpose of flushing the generated particles. The test results show that, with the new saws. the ratio of the particle-related CCD chip failures has been dropped drastically from 9.1% to 0.63%.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.171-176
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• 2001

Plasma Display Panel(PDP) is a type of flat panel display utilizing the light emission produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalks from adjacent sub-pixels. Mold for forming barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing process such as screen printing, sand-blasting and photosensitive glass methods. Mold for PDP barrier ribs have stripes of micro grooves transferring glass-material wall. In this paper, Stripes of grooves of which width 48${\mu}{\textrm}{m}$ and 270${\mu}{\textrm}{m}$, depth 124${\mu}{\textrm}{m}$, pitch 274${\mu}{\textrm}{m}$ was acquired by machining hard and brittle materials of WC, Silicon, Alumina with dicing saw blade. Maximum roughness of the bottom and sidewall of the grooves was respectively 120nm, 287nm in grooving WC. Maximum tilt angle caused by difference between upper-most width and lower-most width was 2$^{\circ}$. Maximum Radius of bottom curvatures was 7.75${\mu}{\textrm}{m}$. This results satisfies the specification for barrier ribs of 50 inch XGA PDP if the groove form of mold was fully transferred to the barrier ribs. Barrier ribs were formed with Silicone rubber mold, which is transferred from grooved hard materials. Silicone rubber mold has elasticity accommodating the waveness of lower glass plate of PDP.