• Journal of the Korean Ceramic Society
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• v.46 no.1
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• pp.30-34
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• 2009

A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8" wafer processing may be available. 10mm sq test device manufactured by Dry Film Resist (DFR) pattern process on 8" glass wafer of $500{\mu}m's$ thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 um tooling has been performed at 0.3 MPa pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.77-80
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• 1989

The aim of the study is to develope the processing technique of PZT-Polymer piezoelectric composite materials for ultrasonic transducer application such as biomedical probe and hydrophone. Piezoelectric composite of PZT and polymer with 1-3 connectivity patterns have been fabricated by dicing-filling method and extrusion forming method. In this study processing forming method. In the study processing steps by extrusion forming method in the preperation of PZT/polymer piezoelectric composites are described. The PZT powder used in the study is commercial powder which is prepared by mixing PbO, TiO$_2$ and ZrO$_2$. The binder, water and plasticizer are mixed with the PZT powder to form a slip. It is necessary to adjust the viescosity of slip according on the PZT rod diameters to be extruded. The electromechanical properties of the piezoelectric composites are characterized in terms of the thickness resonance mode. The pulse response characteristics by the ultrasonic transducer analyzer and osciloscope are evaluated.

• Laser Solutions
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• v.11 no.1
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• pp.19-24
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• 2008

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.274-279
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• 2015

This paper describes optimizing fabrication methods for 2-axis electrically levitated MEMS gyroscope. Electrostatically levitated gyroscope has very high potential of performance due to the fact that its proof mass is not mechanically bound to any other structures, but its complex structure and difficulty of fabrication holds back the research that only a few researches have been reported. In this work, fabrication method for glass-silicon-glass 3-floor structure for 2-axis electrically levitated MEMS gyroscope is presented, including simplified multi-level glass etch method utilizing photoresist attack, preventing metal diffusion by adding middle layer of metal electrode, overcoming Deep RIE limitation by separate fabrication of silicon structures and keeping the electrode safe from dicing debris.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.144-149
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• 1994

반도체 산업계에 있어서 IC 등을 주류로 하는 마이크로칩의 생산성 및 성능이 현저히 성장하여 많은 경제효과를 가져오고 있다. 이와함께 전자부품에 사용되어지는 취성재료의 종류 및 그양도 점점 증가하는 추세이다. 이러한 취성재료의 절단에는 초극박의 다이야몬드 브레이드가 널리 사용되어지고 있다. 실리콘웨이퍼와 같은 취성재료의 다이싱가공에서 문제가 되고있는것은 칩핑과 사행현상의 발생이다. 사행현상의 원인으로서는 브레이드축면의 비대칭성,절삭날의 둔화,숫돌축과 이송방향의 위치결정오차,후렌지 단면의 흔들림등을 들수 있다. 그러나, 사행의 발생영역과 사행이 계속되는 이유에 대해서는 전혀 검토되어진바 없는것이 현실이다. 본 연구에서는 다이싱가공시의 사행현상에 주목해서 사행현상의 발생영역을 명확하게 함과 동시에 AE 센서를 이용하여 인프로세서로 사행현상의 검출방법을 개발하는 것을 목적으로 한다.

• Journal of the Korean Ceramic Society
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• v.25 no.1
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• pp.7-14
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• 1988

In this paper, piezoelectric composite materials of 1-3 connectivity were prepared by using "dicing-filling" technique with PZT ceramics and epoxy polymers, and the dependence of piezoelectric properties on the thickness of specimens was investigated. In case that the PZT volume percent is 18.1%, according to an increment of thickness, the dielectric constant of composites( 33) is unchangeable, which is about 200, the piezoelectric coefficient (d33) is somewhat increased, which is about 240-280 (PC/N) and the electromechanical coupling factor of thickness mode(kt) is proportioned, but radial mode(kp) is constant.

• Journal of Institute of Convergence Technology
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• v.1 no.1
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• pp.48-51
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• 2011

Transdermal drug delivery device is a method of drug delivery through the skin. Skin has a very large area, so it is attractive route to drug delivery. When drug delivery through the skin, microneedle has a advantage that painless, constant drug deliver and penetration efficient; nevertheless the cost is expensive because fabrication process need a particular equipment and not suitable in mass production. This study shows microneedle fabrication process using convergence of general MEMS process and dicing process that can make 3-D sharp microneedle tip and this fabrication process suitable for mass production.

• Proceedings of the KAIS Fall Conference
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• 2008.05a
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• pp.46-48
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• 2008

나노복합 블레이드가 반도체 웨이퍼 가공을 위한 마이크로급 나노장치나 그 이상의 나노급 구조체를 위해 사용되었다. 금속 블레이드는 실리콘 웨이퍼 가공을 위해 사용되어 왔다. 그러나, 최근 레진 복합 블레이드는 반도체나 핸드폰의 쿼츠 웨이퍼 가공에 사용된다. 유기 또는 비유기 재료 선정은 기계가공성, 전기 전도성, 강도, 연성 및 웨이퍼 저항을 가진 블레이드를 만드는데 중요하다. 고성능 응용의 증대 요구에 따라 개발된 고기술 비유기성 재료의 혼합은 낮은 가격에 고기능의 신뢰도를 필요로 한다. 나노 입자의 크기를 가진 레진 복합물의 마이크로 설계는 입자간 상호작용의 제어가 필요하다. 형상 제작 동안 마이크로 차원에 두께를 유지하기 위해서는 마이크로/나노급 제작을 위한 가공기술이 중요한 것 중의 하나이다. 본 연구에서는 핫 프레스 구조물이 원래 설계 기준과 두께 차이의 실험 접근법을 사용해 만들어졌다. 다른 습식 공정 기술은 차원의 허용치를 개선하기 위해 만들었다. 실험들과 해석들은 신뢰성 결과가 사용가능함을 보여주었다. 반도체 시장에 사용될 레진 복합 블레이드의 개선 효과가 논의되었다.

• Nuclear Engineering and Technology
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• v.54 no.12
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• pp.4620-4624
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• 2022

Several cadmium zinc telluride (CZT) crystals were fabricated into radiation detectors using methods that included slicing, dicing, lapping, polishing, and chemical etching. A wet passivation with sodium hypochlorite (NaOCl) was then carried out on the Br-etched detectors. The Te-rich layer on the CZT surface was successfully compensated to the Te oxide layer, which was analyzed with X-ray photoelectron spectroscopy data of both a Br-etched crystal and a passivated CZT crystals. We confirmed that passivation with NaOCl improved the transport property by analyzing the mobility-lifetime product and surface recombination velocity. The electrical and spectroscopic properties of large volume detectors were compared before and after passivation, and then the detectors were observed for a month. Both bar and quasi-hemispherical detectors show an enhancement in performance after passivation. Thus, we could identify the effect of NaOCl passivation on large volume CZT detectors.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.