• Title/Summary/Keyword: Diamond tools

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Performance Characteristics of CVD Diamond Cutting Tools

  • Oles, E.J.;Cackowski, V.J.
    • The Korean Journal of Ceramics
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    • v.2 no.4
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    • pp.203-211
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    • 1996
  • CVD diamond tools are becoming more widely used in industry as an economic alternative to polycrystalline diamond (PCD) for machining non-ferrous and non-metallic materials. Although CVD diamond-sheet tools have been on the market for several years, diamond-coated carbide inserts have become available only recently, with the successful resolution of long-standing adhesion problems. Diamond coating morphology on the rake surface of the tool affects chip formation favorably, whereas a microscopically rough, faceted morphology on the flank surface of the tool produces a rough workpiece finish. Workpiece finish can be improved by using a coated tool with a larger nose radius. The tool life provided by diamond-coated tools(~30 $\mu\textrm{m}$ thick) can meet or exceed that of PCD tools, depending on the characteristics of the workpiece material. When using diamond-coated carbide tools in milling, a sharp-edged PCD tool should be used in the wiper position of the cutter to minimize workpiece roughness and burr formation.

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Powder Metallurgy Diamond Tools - A Review of Manufacturing Routes

  • Konstanty, Janusz
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.871-872
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    • 2006
  • Nowadays the market for diamond tools grows rapidly. The present decline in the price of industrial diamond makes it a commoditised product capable of competing with conventional abrasives. In terms of production volume, the largest group of diamond tools comprises the metal-bonded diamond impregnated tools, such as sawblades, wire saws, and core drills for cutting stone and construction materials, and core bits for mining applications. This article provides a compendious coverage of the powder metallurgy (PM) diamond tool-making routes, and identifies the recent trends towards changing the tool design and composition to render it cheaper and more efficient.

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ADHESION STRENGTH OF DIAMOND COATED WC-Co TOOLS USING MICROWAVE PLASMA CVD

  • Kiyama, Nobumichi;Sakamoto, Yukihiro;Takaya, Matsufumi
    • Journal of the Korean institute of surface engineering
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    • v.29 no.5
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    • pp.540-544
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    • 1996
  • To apply the CVD diamond film to coated tools, it is necessary to make adhesion strength between diamond film and substrate stronger. So adhesion strength of diamond coated WC-Co tools using Microwave Plasma CVD and cutting test of Al-18mass%Si alloy using diamond cutting tools were studied. Diamond coating was carried out using Microwave Plasma CVD apparatus. Reaction gas was used mixture of methane and hydrogen. Substrate temperature were varied from 673K to 1173K by control of microwave output power and reaction pressure. By observation of SEM, grain size became larger and larger as substrate temperature became higher and higher. Also all deposits were covered with clear diamond crystals. XRD results, the deposits were identified to cubic diamond. An analysis using Raman spectroscopy, the deposit synthesized at lower substrate temperature (673K) showed higher quality than deposit synthesized at higher substrate temperature (1173K). As a result of scratch adhesion strength test, from 873K to 1173K adhesion strength decreased by rising of substrate temperature. The deposit synthesized at 873K showed best adhesion strength. In the cutting test of Al-18mass%Si alloy using diamond coated tools and the surface machinability of Al-Si works turned with diamond coating tools which synthesized at 873K presented uniform roughness. Cutting performance of Al-18mass%Si alloys using diamond coated WC-Co tools related to the adhesion strength.

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A Study on Electro-deposited Multi-layered Diamond Tool for Grinding Sapphire Wafers (사파이어 절삭용 다층 전착 다이아몬드 공구에 대한 연구)

  • Lim, Goun;Song, William;Hong, Joo Wha
    • Journal of the Korean Society for Heat Treatment
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    • v.30 no.5
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    • pp.222-226
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    • 2017
  • Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.

Thin Film Adhesion and Cutting Performance in Diamond-Coated Carbide Tools

  • Jong Hee Kim;Dae Young Jung;Hee Kap Oh
    • The Korean Journal of Ceramics
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    • v.3 no.2
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    • pp.105-109
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    • 1997
  • The effects of surface conditions of the C-2 cemented carbide substrate on the adhesion of diamond film were investigated. The substrates were pretreated for different times with Murakami's reagent and then the acid solution of an H2SO4-H2O2. The adhesion strength was estimated by a peeling area around the Rockwell-A indentation. The cutting performance of the diamond-coated tools was evaluated by measuring flank wears in dry turning of Al-17% Si alloy. The morphology of deposited diamond crystallites was dominated by (111) and (220) surfaces with a cubooctahedral shape. The diamond film quality was hardly affected by the surface conditions of the substrate. The variation of tool life with longer substrate etching times resulted from a compromies between the increase of film adhesion at the interface and the decrease of toughness at the substrate surface. The coated tools were mainly deteriorated by chipping and flaking of the diamond film form a lock of adhesion strength, differently from the wear phenomena of PCD tools.

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Diamond Tools with Diamond Grits Set in a Predetermined Pattern

  • Sung, James C.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.881-882
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    • 2006
  • In 1997, Dr. James Chien-Min Sung patented the technology of making diamond tools according to a predetermined pattern. The optimization of this pattern may double the tool life and the cutting speed. In 1998, Sung also made $DiaGrid^{(R)}$ saw segments that showed superior performance in cutting granite and marble. In 2000, Sung visited Shinhan and introduced them this revolutionary concept of diamond saw segments. In 2005, Shinhan adapted the idea and produced saw segments with diamond grits set in a predetermined pattern, their results confirmed that the sawing speed and the sawing life were both improved over conventional designs.

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Diamond Film Synthesis by MWCVD and Its Application to Cutting Tools (MWCVD에 의한 다이아몬드 필름의 합성과 절삭 공구에의 응용)

  • 서문규;김윤수
    • Journal of the Korean Ceramic Society
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    • v.30 no.11
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    • pp.979-985
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    • 1993
  • Diamond films were synthesized using CH4-H2-Ar mixture gases by MWCVD, and cutting ability was tested after brazing them onto WC tools. Growth rates were in the range of 0.5~10${\mu}{\textrm}{m}$/hr depending on the deposition conditions, and diamond films with thickness of 100~300${\mu}{\textrm}{m}$ were obtained. Diamond tools brazed by RF induction method showed an enhanced cutting ability in the cutting test of Si single crystal rod.

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Measurement of Cohesion Force between Diamond and Matrix in CMP Pad Conditioner

  • Kang, Seung-Koo;Song, Min-Seok;Jee, Won-Ho
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1128-1129
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    • 2006
  • Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond cohesion. Strong cohesion between diamond and metal matrix prevents macro scratch on the wafer during CMP Process. Typically the diamond tool has been manufactured by sintered, brazed and electro-plated methods. In this paper, some results will be reported of cohesion between diamond and metal matrix of the diamond tools prepared by three different manufacturing methods. The cohesion force of brazed diamond tool is found stronger than the others. This cohesion force is increased in reverse proportion to the contact area of diamond and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of Cr in metal matrix and C in diamond, which enhance the interfacial cohesion strength between diamonds and metal matrix.

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An Experimental Study on Cutting Characteristic of Ceramics (세라믹스의 절삭거동에 관한 실험적 연구)

  • 이길우;김순태
    • Journal of the Korean Ceramic Society
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    • v.30 no.5
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    • pp.420-426
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    • 1993
  • The machinability of ceramics has been experimentally studied. The experiments were conducted on alumina cernmics of various purity, quartz, and cordierite using the sintered diamond tools and CBN tools. Tool wasre, surface roughness, and cutting resistence were measured and analysed. It was found that the workpieces could be machined with the diamond and CBN tools, but the sintered diamond tools were more efficient for the machining of the high strength ceramics. The machining of alumina ceramics with sintered diamond tools showed that (1) wet machining prolonged tool life comparing with dry machining, (2) workpiecewith higher purity had better surface roughness, (3) severe cutting conditions led to the chipping and fracture of tool and increase of the surface roughness and cutting resistance, (4) 20~40m/min of cutting speed, 0.01~0.02mm/rev of feed, and 0.1~0.2mm of cutting depth are suggested as proper cutting conditions for the high strength ceramics.

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Resistance to Abrasive Wear of Materials Used as Metallic Matrices in Diamond Impregnated Tools

  • Konstanty, Janusz;Kim, Tai-Woung;Kim, Sang-Beom
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1132-1133
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    • 2006
  • Metal-bonded diamond impregnated tools are being increasingly used in the processing of stone and ceramics, road repair, petroleum exploration, etc. Although the main tool wear mechanisms have been identified, the scientific background is inadequate and fundamental research has to be carried out to better understand the tool field behaviour. This work addresses the complex issues of modelling abrasive wear of the metallic matrix under laboratory conditions. The generated data indicates that the matrix wear resistance can be assessed in a simple manner; whereas tests carried out on diamond impregnated specimens may aid prediction of the tool life in abrasive applications.

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