• Transactions of Materials Processing
• /
• v.32 no.6
• /
• pp.360-366
• /
• 2023

This study is concerned with the surface quality of products according to the material and coating condition of the forming tool in incremental sheet forming. Three forming tools, SKD11 with and without diamond-like-coating (DLC) and polymer tool tip, were used to form conical and pyramidal geometries to take into account the influence of friction between the forming tool and the sheet on the surface quality including geometric accuracy of deformed samples. Each test was performed using SUS304 with a thickness of 0.4 mm according to different incremental depths per lap of 0.5 mm, 1.0 mm, and 1.5 mm for the contour tool path, considering the increase in normal force which is associated with the frictional behavior during local deformation. The surface quality was then investigated through surface roughness measured with KEYENCE VR-6000 and relative strain distribution including deformed shape analyzed with ARGUS which is a non-contact optical strain measurement system. Differences between 3D CAD surfaces and captured geometry from experiments were evaluated to compare the effect of friction on geometric accuracy. From comparisons of experimental results, it was revealed that the polymer-based tool tip can improve surface quality and geometric accuracy by reducing the undesired material flow due to local friction in the increment sheet forming process.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1507-1510
• /
• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.8 s.185
• /
• pp.171-177
• /
• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean institute of surface engineering
• /
• v.52 no.3
• /
• pp.163-170
• /
• 2019

Durability of instrument is one of the most important factor to ensure accurate treatment and decrease failure for the orthopedic surgical operation. Normally, a set-screw driver tip has been processed with hard coating for their higher durability and wear resistance. And several surface modification methods were obtained such as titanium nitride (TiN) coating, diamond like carbon coating, other nitriding, and etc. In this study, we have surface modified on set-screw driver tip with TiN and DLC, investigated whether the TiN and DLC coatings affect the mechanical properties and durability of the set-screw driver tip in the pedicle screw system. The surface morphologies were observed with scanning-electron microscopy (SEM), and the static/dynamic torsional properties were investigated with universal testing machine based on ASTM F543. Coating thickness of each coatings were commonly around $1^{\circ}C$. Static torsional stiffness, and ultimate torque values for DLC and TiN coated samples were significantly higher than those of non-coated sample by the pared T-test. Surface morphology of after the dynamic torsional test was more clean with less scratch or friction traces from DLC coating than that of TiN coating and non-coated sample.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2002.05a
• /
• pp.40-44
• /
• 2002

The motivation of this work is to use SAM(Self-Assembled Monolayer) for developing a rapid and flexible non-photolithographic nano-structure fabrication technique which can be utilized in micro-machining of metals as well as silicon-based materials. The fabrication technique implemented in this work consists of a two-step process, namely, mechanical scribing followed by chemical etching. From the experimental results, it was found that thiol on copper surface could be removed even under a few nN normal load. The nano-tribological characteristics of thiol-SAM on various metals were largely dependent on the native oxide layer of metals. Based on these findings, nano-patterns with sub-micrometer width and depth on metal surfaces such as Cu, Au and Ag could be obtained using a diamond-coated tip.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.2
• /
• pp.35-42
• /
• 2000

In recent years the recording density of hard disks has increased significantly largely due to the decreasing flying height. As a result of decreased flying height, the reliability issue become more critical. In this work the relationship between hard disk surface damage and data loss was investigated by using an actual hard disk drive. The purpose of this research was to identify the key factor which leads to data loss. It was shown that data loss is directly related to the physical damage of the Co-magnetic layer and there was no data loss when only carbon protective coating was damaged by the diamond tip.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.326-331
• /
• 2007

Large-scale molecular dynamics simulations are performed to verify the deformation characteristics of grain boundaries in nanolithography process. The copper substrate made of 200,000 atoms is constructed by two grains in different crystal orientations using dynamic relaxation method. The grain boundary is located in the middle of the substrate with $45\sim135$ degree angles. The plowing tip is made of diamond-like-carbon atoms in a variety of shapes. In the simulations, the generation, propagation, and accumulation of dislocations are observed inside the substrate. From the numerical results, we address the dynamic behavior of the grain boundaries as well as the frictional characteristics in terms of the morphology of initial grain boundaries.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2001.05a
• /
• pp.213-216
• /
• 2001

A micro hole punching system was developed and micro holes of 100m in diameter were successfully made on brass sheets of loom in thickness. A micro punch made of tungsten carbide was designed to withstand the punch load, considering the buckling and the bending moment due to possible misalignment error. The punch was fabricated by the grinding process with diamond wheel. The die was designed considering the punch load and fabricated by micro electrodischarge machining process. In this system the stripper is designed to guide punch tip to minimize the possible misalignment. The punch was installed on a vertical stepper and the die was mounted on an X-Y translation unit. The precision motion controller controlled all motions of the micro hole punching system. In this study technical difficulties and solutions in the micro hole punching process were also discussed.

• Proceedings of the Optical Society of Korea Conference
• /
• 2000.02a
• /
• pp.224-225
• /
• 2000

Transparent and hard materials such as sapphire are used for many industrial applications as optical windows, hard materials on mechanical contact against abrasion, and substrate materials for opto-electronic semiconductor devices such as blue LED and blue LD etc. The materials should be cut along the proper shapes possible to be used for each application. In case of blue LED, the blue LED wafer should be cut to thousands of blue LED pieces at the final stage of the manufacturing process. The process of cutting the wafer is usually divided into two steps. The wafer is scribed along the proper shapes in the first step. It is inserted between transparent flexible sheets for easy handling. And then, it is broken and split in the next step. Harder materials such as diamonds are usually used to scribe the wafer, while it has a problem of low depth of scribing and abrasion of the harder material itself. The low depth of scribing can induce failure in breaking the wafer along the scribed line. It was also known that the expensive diamond tip should be replaced frequently for the abrasion. (omitted)

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.05a
• /
• pp.135-135
• /
• 2004

21세기 정보화시대에 미디어의 발전은 고저장밀도를 요구하는 정보저장 장치의 개발을 필요로 하게 되었고, 현재 정보저장 장치의 주류를 이루는 magnetic recording 방식에 의한 HDD는 향후 5년 이내에 초자성한계 (super paramagnetic limit)라는 물리적 현상에 직면하여 더 이상 발전이 어려울 깃이다 따라서 이러한 한계를 극복하기 위한 여러 기술 증 Scanning Probe Microscope (SPM)을 이용한 차세대 탐침형 정보저장 기술은 미세한 끝단 반경을 가지는 탐침과 표면의 상호작용을 이용하여 정보를 기록/재생하는 기술로써 수십 nm 크기의 bit를 형성하여 Tbit/in$^2$ 이상의 높은 저장밀도를 가질 수 있으므로 현재 가장 상용화될 가능성이 높다.(중략)